HUANG; SOON-KANG
Patent Applications and Registrations
Patent applications and USPTO patent grants for HUANG; SOON-KANG.The latest application filed is for "method and structure for metal gates".
- HUANG; SOON-KANG - HSINCHU TW
- Huang; Soon-Kang - Hsin Chu TW
- HUANG; Soon-Kang - Hsin-Chu City TW
- Huang; Soon Kang - Hsinchu City TW
| Patent | Date |
|---|---|
| Method And Structure For Metal Gates App 20220230921 - CHEN; TUNG-HUANG ; et al. | 2022-07-21 |
| Method of using a polishing system Grant 11,358,252 - Lin , et al. June 14, 2 | 2022-06-14 |
| Method of planarizing a wafer Grant 10,668,592 - Lee , et al. | 2020-06-02 |
| High throughput CMP platform Grant 10,513,006 - Wu , et al. Dec | 2019-12-24 |
| Method Of Using A Polishing System App 20190337116 - LIN; Shih-Chi ; et al. | 2019-11-07 |
| Polishing system Grant 10,357,867 - Lin , et al. July 23, 2 | 2019-07-23 |
| Apparatus and method for chemical mechanical polishing process control Grant 10,096,482 - Hui , et al. October 9, 2 | 2018-10-09 |
| Multi-point chemical mechanical polishing end point detection system and method of using Grant 10,090,207 - Wu , et al. October 2, 2 | 2018-10-02 |
| Polishing System App 20170312881 - LIN; Shih-Chi ; et al. | 2017-11-02 |
| Polishing system and polishing method Grant 9,718,164 - Lin , et al. August 1, 2 | 2017-08-01 |
| Metal conductor chemical mechanical polish Grant 9,368,452 - Huang , et al. June 14, 2 | 2016-06-14 |
| Method Of Planarizing A Wafer App 20160136776 - LEE; Bo-I ; et al. | 2016-05-19 |
| Apparatus and Method for Chemical Mechanical Polishing Process Control App 20150348797 - Hui; Keung ; et al. | 2015-12-03 |
| High Throughput Cmp Platform App 20140220863 - Wu; Jiann Lih ; et al. | 2014-08-07 |
| Method And Device For Cleaning A Brush Surface Having A Contamination App 20140196744 - WU; Jiann-Lih ; et al. | 2014-07-17 |
| Metal Conductor Chemical Mechanical Polish App 20140159243 - Huang; Soon-Kang ; et al. | 2014-06-12 |
| Polishing System And Polishing Method App 20140162534 - LIN; Shih-Chi ; et al. | 2014-06-12 |
| Multi-point Chemical Mechanical Polishing End Point Detection System And Method Of Using App 20140148008 - WU; Jiann Lih ; et al. | 2014-05-29 |
| CMP Groove Depth and Conditioning Disk Monitoring App 20130217306 - Wu; Jiann Lih ; et al. | 2013-08-22 |
| CMP Pad Cleaning Apparatus App 20130210323 - Wu; Jiann Lih ; et al. | 2013-08-15 |
| Multiple Zone Temperature Control for CMP App 20130210173 - Wu; Jiann Lih ; et al. | 2013-08-15 |
| Field-by-field laser annealing and feed forward process control Grant 8,188,447 - Yang , et al. May 29, 2 | 2012-05-29 |
| Multi-zone electrostatic chuck and chucking method Grant 7,957,118 - Chang , et al. June 7, 2 | 2011-06-07 |
| Retainer ring Grant 7,950,983 - Huang , et al. May 31, 2 | 2011-05-31 |
| System And Method For Conditioning Chemical Mechanical Polishing Apparatus Using Multiple Conditioning Disks App 20100291840 - HUANG; Soon Kang ; et al. | 2010-11-18 |
| Multi-Zone Electrostatic Chuck and Chucking Method App 20100277850 - Chang; Yi-Pin ; et al. | 2010-11-04 |
| Field-by-field Laser Annealing And Feed Forward Process Control App 20100187444 - Yang; Chung-Ru ; et al. | 2010-07-29 |
| Retainer Ring App 20100112912 - Huang; Soon Kang ; et al. | 2010-05-06 |
| Retainer ring Grant 7,666,068 - Huang , et al. February 23, 2 | 2010-02-23 |
| Retainer Ring App 20080293339 - Huang; Soon Kang ; et al. | 2008-11-27 |
| Methods and forming structures, structures and apparatuses for forming structures Grant 7,141,495 - Peng , et al. November 28, 2 | 2006-11-28 |
| Methods and forming structures, structures and apparatuses for forming structures App 20060046492 - Peng; Shuang-Neng ; et al. | 2006-03-02 |
| Dynamically adjustable slurry feed arm for wafer edge profile improvement in CMP Grant 6,821,895 - Lin , et al. November 23, 2 | 2004-11-23 |
| Dynamically adjustable slurry feed arm for wafer edge profile improvement in CMP App 20040166686 - Lin, Bih-Tiao ; et al. | 2004-08-26 |
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