| Patent | Date |
|---|
Packaging material and film
Grant 10,717,806 - Chen , et al. | 2020-07-21 |
Method For Facilitating Recycling
App 20200118088 - KAO; Chen-I ; et al. | 2020-04-16 |
Method for manufacturing elastic mat with successive mixed color type
Grant 10,538,018 - Kao , et al. Ja | 2020-01-21 |
Method for Manufacturing Wear and Tear-Indicating Product
App 20190248167 - Kao; Chen-I ; et al. | 2019-08-15 |
Packaging Material And Film
App 20190127513 - CHEN; Wen-Bin ; et al. | 2019-05-02 |
Method for Manufacturing Elastic Mat with Successive Mixed Color Type
App 20180079117 - Kao; Chen-I ; et al. | 2018-03-22 |
Preparation and use of fish skin fermentation liquid obtained by fermenting fish skin with Aspergillus
Grant 9,782,444 - Huang , et al. October 10, 2 | 2017-10-10 |
Optical solid state prepolymer and molding composition
Grant 9,773,958 - Chan , et al. September 26, 2 | 2017-09-26 |
Printing Method for Indicating Lifetime of Product
App 20170253064 - Kao; Chen-I ; et al. | 2017-09-07 |
Method for Facilitating Recycling
App 20170249601 - Kao; Chen-I ; et al. | 2017-08-31 |
Optical Solid State Prepolymer And Molding Composition
App 20170179349 - CHAN; Ying-Nan ; et al. | 2017-06-22 |
Organic-inorganic hybrid resin, molding composition, and photoelectric device employing the same
Grant 9,617,411 - Chan , et al. April 11, 2 | 2017-04-11 |
Siloxane resin composition, and photoelectric device employing the same
Grant 9,540,488 - Lin , et al. January 10, 2 | 2017-01-10 |
Preparation And Use Of Fish Skin Fermentation Liquid Obtained By Fermenting Fish Skin With Aspergillus
App 20160263165 - HUANG; SHU-CHEN ; et al. | 2016-09-15 |
Organic-inorganic Hybrid Resin, Molding Composition, And Photoelectric Device Employing The Same
App 20150197631 - CHAN; Ying-Nan ; et al. | 2015-07-16 |
Preparation And Use Of Fish Skin Fermentation Product
App 20140342012 - HUANG; SHU-CHEN ; et al. | 2014-11-20 |
Fermented composition of mung bean hulls, method for forming thereof, and anti-oxidation and anti-inflammation composition using the same
Grant 8,784,912 - Huang , et al. July 22, 2 | 2014-07-22 |
Organic-inorganic metal oxide hybrid resin, a method for forming the same, and transparent resin composition formed therefrom
Grant 8,721,919 - Huang , et al. May 13, 2 | 2014-05-13 |
Organic-inorganic Metal Oxide Hybrid Resin, A Method For Forming The Same, And Transparent Resin Composition Formed Therefrom
App 20130334458 - HUANG; Shu-Chen ; et al. | 2013-12-19 |
Flat fuel cell assembly and fabrication thereof
Grant 8,609,297 - Yen , et al. December 17, 2 | 2013-12-17 |
Transparent silicone epoxy composition
Grant 8,440,774 - Lin , et al. May 14, 2 | 2013-05-14 |
Transparent Silicone Epoxy Composition
App 20120172505 - Lin; Chich-Haw ; et al. | 2012-07-05 |
Preparation And Use Of Fish Skin Fermentation Product
App 20120107409 - HUANG; SHU-CHEN ; et al. | 2012-05-03 |
Fermented Composition Of Mung Bean Hulls, Method For Forming Thereof, And Anti-oxidation And Anti-inflammation Composition Using The Same
App 20110038969 - Huang; Shu-Chen ; et al. | 2011-02-17 |
Light partition assembly
App 20070261805 - Huang; Shu-Chen | 2007-11-15 |
Chip package structure and process for fabricating the same
Grant 7,230,331 - Chen , et al. June 12, 2 | 2007-06-12 |
Computer readable storage medium for work-in-process schedules
App 20070117230 - Huang; Shu Chen ; et al. | 2007-05-24 |
Process For Fabricating Chip Package Structure
App 20070072339 - Chen; Kai-Chi ; et al. | 2007-03-29 |
Method for generating work-in-process schedules
Grant 7,179,664 - Huang , et al. February 20, 2 | 2007-02-20 |
Chip Package Structure
App 20060261499 - Chen; Kai-Chi ; et al. | 2006-11-23 |
Chip package structure
Grant 7,061,103 - Chen , et al. June 13, 2 | 2006-06-13 |
Chip package structure
Grant 7,057,277 - Chen , et al. June 6, 2 | 2006-06-06 |
Method for generating work-in-process schedules
App 20050250226 - Huang, Shu Chen ; et al. | 2005-11-10 |
Chip package structure and process for fabricating the same
App 20050087852 - Chen, Kai-Chi ; et al. | 2005-04-28 |
Flat fuel cell assembly and fabrication thereof
App 20050026026 - Yen, Yeu-Shih ; et al. | 2005-02-03 |
Fine conductive particles for making anisotropic conductive adhesive composition
Grant 6,841,094 - Li , et al. January 11, 2 | 2005-01-11 |
[chip Package Structure]
App 20040212056 - Chen, Kai-Chi ; et al. | 2004-10-28 |
[chip Package Structure]
App 20040212970 - Chen, Kai-Chi ; et al. | 2004-10-28 |
[chip Package Structure And Process For Fabricating The Same]
App 20040212080 - Chen, Kai-Chi ; et al. | 2004-10-28 |
Fine conductive particles for making anisotropic conductive adhesive composition
App 20040056236 - Li, Hsun-Tien ; et al. | 2004-03-25 |
Stator assembly structure
Grant 6,707,223 - Huang March 16, 2 | 2004-03-16 |
Integrated circuit package provided with multiple heat-conducting paths for enhancing heat dissipation and wrapping around cap for improving integrity and reliability
Grant 5,710,459 - Teng , et al. January 20, 1 | 1998-01-20 |
Ethernet switching hub
Grant D380,447 - Chen , et al. July 1, 1 | 1997-07-01 |
Multi-media communication system with integrated and coherent audio-video user interface allowing flexible image input
Grant 5,557,663 - Huang , et al. September 17, 1 | 1996-09-17 |
Video telephone
Grant D373,355 - Huang , et al. September 3, 1 | 1996-09-03 |
| 