HUANG; Shih-Tsun
Patent Applications and Registrations
Patent applications and USPTO patent grants for HUANG; Shih-Tsun.The latest application filed is for "method for dicing wafer stack".
- HUANG; Shih-Tsun - Taichung City TW
- Huang; Shih-Tsun - Taichung Hsien TW
| Patent | Date |
|---|---|
| Method For Dicing Wafer Stack App 20120267351 - HUANG; Shih-Tsun | 2012-10-25 |
| Ground-enhanced semiconductor package and lead frame for the same Grant 7,230,323 - Lee , et al. June 12, 2 | 2007-06-12 |
| Ground-enhanced semiconductor package and lead frame for the same App 20040238921 - Lee, Yi-Shiung ; et al. | 2004-12-02 |
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