Huang; Shenghua
Patent Applications and Registrations
Patent applications and USPTO patent grants for Huang; Shenghua.The latest application filed is for "semiconductor product substrate including stress relief layer".
- Huang; Shenghua - Shanghai CN
- Huang; Shenghua - Shenzhen CN
- Huang, Shenghua - Shenzhen City CN
| Patent | Date |
|---|---|
| Semiconductor Product Substrate Including Stress Relief Layer App 20200006212 - Guo; Rui ; et al. | 2020-01-02 |
| Method for decide CDMA frequency hard handoffs Grant 7,136,647 - Huang , et al. November 14, 2 | 2006-11-14 |
| Method for decide cdma frequency hard handoffs App 20050260990 - Huang, Shenghua ; et al. | 2005-11-24 |
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