| Patent | Date |
|---|
Dielets On Flexible And Stretchable Packaging For Microelectronics
App 20220278048 - Huang; Shaowu ; et al. | 2022-09-01 |
Seal for microelectronic assembly
Grant 11,417,576 - Katkar , et al. August 16, 2 | 2022-08-16 |
Bond Enhancement Structure In Microelectronics For Trapping Contaminants During Direct-bonding Processes
App 20220246564 - Gao; Guilian ; et al. | 2022-08-04 |
Direct-Bonded Native Interconnects And Active Base Die
App 20220238339 - DeLaCruz; Javier A. ; et al. | 2022-07-28 |
Printed circuit board structure and method for improved electromagnetic compatibility performance
Grant 11,395,401 - Huang , et al. July 19, 2 | 2022-07-19 |
Stacked transmission line
Grant 11,369,020 - Huang , et al. June 21, 2 | 2022-06-21 |
Dielets on flexible and stretchable packaging for microelectronics
Grant 11,355,443 - Huang , et al. June 7, 2 | 2022-06-07 |
Wire bonding method and apparatus for electromagnetic interference shielding
Grant 11,335,647 - Huang , et al. May 17, 2 | 2022-05-17 |
Reduction of power-over-data-lines (PODL) filter parasitics for multi-gigabit ethernet
App 20220116236 - Huang; Shaowu ; et al. | 2022-04-14 |
Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes
Grant 11,296,044 - Gao , et al. April 5, 2 | 2022-04-05 |
Direct-bonded native interconnects and active base die
Grant 11,289,333 - Delacruz , et al. March 29, 2 | 2022-03-29 |
Seal for microelectronic assembly
Grant 11,257,727 - Katkar , et al. February 22, 2 | 2022-02-22 |
Integrated Optical Waveguides, Direct-bonded Waveguide Interface Joints, Optical Routing And Interconnects
App 20220043209 - HUANG; Shaowu ; et al. | 2022-02-10 |
Common-mode Filtering For High-speed Cable Interface
App 20210352376 - Huang; Shaowu ; et al. | 2021-11-11 |
Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
Grant 11,169,326 - Huang , et al. November 9, 2 | 2021-11-09 |
On-board Integrated Enclosure For Electromagnetic Compatibility Shielding
App 20210298168 - Huang; Shaowu ; et al. | 2021-09-23 |
Printed circuit board structure and method for inductive noise cancellation
Grant 11,122,677 - Huang , et al. September 14, 2 | 2021-09-14 |
Pcb Rf Noise Grounding For Shielded High-speed Interface Cable
App 20210282260 - Huang; Shaowu ; et al. | 2021-09-09 |
Automotive Network Communication Devices And Cabling With Electromagnetic Shielding
App 20210267101 - Huang; Shaowu ; et al. | 2021-08-26 |
Printed Circuit Board Structure And Method For Inductive Noise Cancellation
App 20210153342 - Huang; Shaowu ; et al. | 2021-05-20 |
Cavity Packages
App 20210134689 - Huang; Shaowu ; et al. | 2021-05-06 |
Interface structures and methods for forming same
Grant 10,998,265 - Huang , et al. May 4, 2 | 2021-05-04 |
Cavity packages
Grant 10,923,408 - Huang , et al. February 16, 2 | 2021-02-16 |
Direct-Bonded Native Interconnects And Active Base Die
App 20200357641 - Delacruz; Javier A. ; et al. | 2020-11-12 |
Direct-bonded native interconnects and active base die
Grant 10,832,912 - Delacruz , et al. November 10, 2 | 2020-11-10 |
Interface structures and methods for forming same
Grant 10,784,191 - Huang , et al. Sept | 2020-09-22 |
Full wave modeling and simulations of the waveguide behavior of printed circuit boards using a broadband green's function technique
Grant 10,719,649 - Tsang , et al. | 2020-07-21 |
Wire Bonding Method And Apparatus For Electromagnetic Interference Shielding
App 20200227360 - Huang; Shaowu ; et al. | 2020-07-16 |
Direct-bonded Native Interconnects And Active Base Die
App 20200194262 - DELACRUZ; Javier A. ; et al. | 2020-06-18 |
Wire bonding method and apparatus for electromagnetic interference shielding
Grant 10,658,302 - Huang , et al. | 2020-05-19 |
Selective recess
Grant 10,658,313 - Delacruz , et al. | 2020-05-19 |
Seal For Microelectronic Assembly
App 20200140268 - Katkar; Rajesh ; et al. | 2020-05-07 |
Seal For Microelectronic Assembly
App 20200140267 - Katkar; Rajesh ; et al. | 2020-05-07 |
Bond Enhancement In Microelectronics By Trapping Contaminants And Arresting Cracks During Direct-bonding Processes
App 20200075520 - GAO; Guilian ; et al. | 2020-03-05 |
Bond Enhancement In Microelectronics By Trapping Contaminants And Arresting Cracks During Direct-bonding Processes
App 20200075533 - GAO; Guilian ; et al. | 2020-03-05 |
Interface Structures And Methods For Forming Same
App 20200043848 - Huang; Shaowu ; et al. | 2020-02-06 |
Methods of forming flipped RF filter components
Grant 10,535,909 - Huang , et al. Ja | 2020-01-14 |
Direct-bonded native interconnects and active base die
Grant 10,522,352 - Delacruz , et al. Dec | 2019-12-31 |
Seal for microelectronic assembly
Grant 10,508,030 - Katkar , et al. Dec | 2019-12-17 |
Dielets On Flexible And Stretchable Packaging For Microelectronics
App 20190341350 - Huang; Shaowu ; et al. | 2019-11-07 |
Interface structures and methods for forming same
Grant 10,446,487 - Huang , et al. Oc | 2019-10-15 |
Dielets on flexible and stretchable packaging for microelectronics
Grant 10,403,577 - Huang , et al. Sep | 2019-09-03 |
Integrated Optical Waveguides, Direct-bonded Waveguide Interface Joints, Optical Routing And Interconnects
App 20190265411 - HUANG; Shaowu ; et al. | 2019-08-29 |
Cavity Packages
App 20190198407 - Huang; Shaowu ; et al. | 2019-06-27 |
Selective Recess
App 20190181107 - DELACRUZ; Javier A. ; et al. | 2019-06-13 |
Surface integrated waveguides and circuit structures therefor
Grant 10,299,368 - Huang , et al. | 2019-05-21 |
Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein
Grant 10,276,909 - Huang , et al. | 2019-04-30 |
Stacked Transmission Line
App 20190069392 - Huang; Shaowu ; et al. | 2019-02-28 |
Flipped Rf Filters And Components
App 20190036191 - Huang; Shaowu ; et al. | 2019-01-31 |
Stacked transmission line
Grant 10,149,377 - Huang , et al. De | 2018-12-04 |
Flipped RF filters and components
Grant 10,109,903 - Huang , et al. October 23, 2 | 2018-10-23 |
Interface Structures And Methods For Forming Same
App 20180286805 - Huang; Shaowu ; et al. | 2018-10-04 |
Seal for microelectronic assembly
App 20180273377 - KATKAR; Rajesh ; et al. | 2018-09-27 |
Full Wave Modeling And Simulations Of The Waveguide Behavior Of Printed Circuit Boards Using A Broadband Green's Function Technique
App 20180203966 - TSANG; Leung W. ; et al. | 2018-07-19 |
Wire Bonding Method and Apparatus for Electromagnetic Interference Shielding
App 20180197834 - Huang; Shaowu ; et al. | 2018-07-12 |
Bonded Structures With Integrated Passive Component
App 20180190580 - Haba; Belgacem ; et al. | 2018-07-05 |
Structure With Integrated Metallic Waveguide
App 20180191047 - Huang; Shaowu ; et al. | 2018-07-05 |
Bonded Structures With Integrated Passive Component
App 20180190583 - DeLaCruz; Javier A. ; et al. | 2018-07-05 |
Surface Integrated Waveguides and Circuit Structures Therefor
App 20180177041 - HUANG; Shaowu ; et al. | 2018-06-21 |
Memory module adaptor card
Grant 9,954,332 - Huang , et al. April 24, 2 | 2018-04-24 |
Full wave modeling and simulations of the waveguide behavior of printed circuit boards using a broadband green's function technique
Grant 9,946,825 - Tsang , et al. April 17, 2 | 2018-04-17 |
Flipped Rf Filters And Components
App 20180102578 - Huang; Shaowu ; et al. | 2018-04-12 |
Direct-bonded native interconnects and active base die
App 20180102251 - DELACRUZ; Javier A. ; et al. | 2018-04-12 |
Interface Structures And Methods For Forming Same
App 20180096931 - Huang; Shaowu ; et al. | 2018-04-05 |
Wire bonding method and apparatus for electromagnetic interference shielding
Grant 9,935,075 - Huang , et al. April 3, 2 | 2018-04-03 |
Printed circuit board having a signal conductor disposed adjacent one or more trenches filled with a low-loss ambient medium
Grant 9,935,353 - Ouyang , et al. April 3, 2 | 2018-04-03 |
Vertical Memory Module Enabled by Fan-Out Redistribution Layer
App 20180040587 - Tao; Min ; et al. | 2018-02-08 |
Microelectronic Packages And Assemblies With Repeaters
App 20180040589 - Huang; Shaowu ; et al. | 2018-02-08 |
Wire Bonding Method and Apparatus for Electromagnetic Interference Shielding
App 20180033764 - Huang; Shaowu ; et al. | 2018-02-01 |
Stacked Transmission Line
App 20170374734 - Huang; Shaowu ; et al. | 2017-12-28 |
Reflected signal absorption in interconnect
Grant 9,814,130 - Huang , et al. November 7, 2 | 2017-11-07 |
Crosstalk, power supply noise and/or EMI reduction methods and apparatuses
Grant 9,806,392 - Huang , et al. October 31, 2 | 2017-10-31 |
Reconfigurable Repeater System
App 20170309570 - HUANG; SHAOWU ; et al. | 2017-10-26 |
Memory Module Adaptor Card
App 20170295647 - Huang; Shaowu ; et al. | 2017-10-12 |
Absorbing termination in an interconnect
Grant 9,750,129 - Huang , et al. August 29, 2 | 2017-08-29 |
Memory module adaptor card
Grant 9,716,361 - Huang , et al. July 25, 2 | 2017-07-25 |
Reconfigurable repeater system
Grant 9,679,854 - Huang , et al. June 13, 2 | 2017-06-13 |
Interconnects With Trenches
App 20170086288 - Ouyang; Gong ; et al. | 2017-03-23 |
Memory Module Adaptor Card
App 20170063013 - Huang; Shaowu ; et al. | 2017-03-02 |
Absorbing Termination In An Interconnect
App 20170006698 - Huang; Shaowu ; et al. | 2017-01-05 |
Crosstalk, Power Supply Noise And/or Emi Reduction Methods And Apparatuses
App 20160344085 - Huang; Shaowu ; et al. | 2016-11-24 |
Memory module adaptor card
Grant 9,496,633 - Huang , et al. November 15, 2 | 2016-11-15 |
Absorbing termination in an interconnect
Grant 9,485,854 - Huang , et al. November 1, 2 | 2016-11-01 |
Full Wave Modeling And Simulations Of The Waveguide Behavior Of Printed Circuit Boards Using A Broadband Green's Function Technique
App 20160314231 - TSANG; Leung W. ; et al. | 2016-10-27 |
Reflected Signal Absorption In Interconnect
App 20160242273 - Huang; Shaowu ; et al. | 2016-08-18 |
Reconfigurable Repeater System
App 20160233922 - HUANG; SHAOWU ; et al. | 2016-08-11 |
Two-part Electrical Connector
App 20160179733 - Huang; Shaowu ; et al. | 2016-06-23 |
Reflected signal absorption in interconnect
Grant 9,351,394 - Huang , et al. May 24, 2 | 2016-05-24 |
Signal Integrity In Mutli-junction Topologies
App 20160134036 - HUANG; Shaowu ; et al. | 2016-05-12 |
Absorbing Termination In An Interconnect
App 20160057851 - Huang; Shaowu ; et al. | 2016-02-25 |
Reflected Signal Absorption In Interconnect
App 20150366052 - HUANG; Shaowu ; et al. | 2015-12-17 |
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