Huang; Po-Ming
Patent Applications and Registrations
Patent applications and USPTO patent grants for Huang; Po-Ming.The latest application filed is for "semiconductor package and method of manufacturing the same".
- Huang; Po-Ming - Kaohsiung TW
- Huang; Po-Ming - New Taipei TW
- Huang; Po Ming - Taichung N/A TW
- HUANG; Po Ming - Taichung City TW
- HUANG; Po-Ming - New Taipei City TW
| Patent | Date |
|---|---|
| Semiconductor package including cap layer and dam structure and method of manufacturing the same Grant 11,133,278 - Huang , et al. September 28, 2 | 2021-09-28 |
| Semiconductor Package And Method Of Manufacturing The Same App 20200111760 - HUANG; Yu-Che ; et al. | 2020-04-09 |
| Hub devices and methods for initializing hub device Grant 9,817,788 - Ho , et al. November 14, 2 | 2017-11-14 |
| Automated forming machine Grant 9,789,528 - Huang October 17, 2 | 2017-10-17 |
| Automated forming machine App 20170043387 - HUANG; Po Ming | 2017-02-16 |
| Sheet molding device Grant 9,511,404 - Huang December 6, 2 | 2016-12-06 |
| Hub Devices And Methods For Initializing Hub Device App 20160275040 - HO; Chih-Long ; et al. | 2016-09-22 |
| Mold structure App 20160059467 - HUANG; PO MING | 2016-03-03 |
| Multi-layer composite structure Grant 8,877,319 - Huang November 4, 2 | 2014-11-04 |
| Mobile phone shell Grant D698,775 - Huang February 4, 2 | 2014-02-04 |
| Hub Devices And Methods For Initializing Hub Device App 20140019658 - HO; Chih-Long ; et al. | 2014-01-16 |
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