Huang; Meng-Chi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Huang; Meng-Chi.The latest application filed is for "adhesion promoting layer, method for depositing conductive layer on inorganic or organic-inorganic hybrid substrate, and conductive structure".

Company Profile

2.9.18

Huang; Meng-Chi - Taoyuan City TW
Huang; Meng-Chi - Taoyuan TW
Huang; Meng-Chi - Zhongli TW
HUANG; Meng-Chi - Zhongli City TW
Huang; Meng-Chi - Taoyuan County TW
Huang; Meng-Chi - Kaohsiung TW
Huang; Meng-Chi - Kaohsiung City TW
Huang; Meng-Chi - Kaohsiung County TW
Huang; Meng-Chi - Fongshan City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Adhesion Promoting Layer, Method For Depositing Conductive Layer On Inorganic Or Organic-inorganic Hybrid Substrate, And Conductive Structure App 20220177364 - Chang; Yiu-Hsiang ; et al.	2022-06-09
Ceramic device and manufacturing method thereof Grant 10,669,209 - Huang , et al.	2020-06-02
Ceramic Device And Manufacturing Method Thereof App 20190177231 - Huang; Meng-Chi ; et al.	2019-06-13
Multilayer circuit structure Grant 10,051,737 - Huang , et al. August 14, 2	2018-08-14
Laminated antenna structure Grant 10,020,569 - Huang , et al. July 10, 2	2018-07-10
Multilayer Circuit Structure App 20170196085 - Huang; Meng-Chi ; et al.	2017-07-06
Metal Patch, Method For Manufacturing The Same And Bonding Method By Using The Same App 20170173718 - Huang; Yi-Hao ; et al.	2017-06-22
Metal circuit structure Grant 9,683,292 - Kao , et al. June 20, 2	2017-06-20
Laminated Antenna Structure App 20170162936 - Huang; Meng-Chi ; et al.	2017-06-08
Insulating Colloidal Material And Multilayer Circuit Structure App 20170127513 - Huang; Meng-Chi ; et al.	2017-05-04
Insulating colloidal material and multilayer circuit structure Grant 9,642,250 - Huang , et al. May 2, 2	2017-05-02
Beam antenna Grant 9,590,292 - Li , et al. March 7, 2	2017-03-07
Metal Circuit Structure App 20170029953 - KAO; Tune-Hune ; et al.	2017-02-02
Method for forming metal circuit, liquid trigger material for forming metal circuit and metal circuit structure Grant 9,499,911 - Kao , et al. November 22, 2	2016-11-22
Beam Antenna App 20160164184 - Li; Wei-Yu ; et al.	2016-06-09
Method For Forming Metal Circuit, Liquid Trigger Material For Forming Metal Circuit And Metal Circuit Structure App 20150122533 - KAO; Tune-Hune ; et al.	2015-05-07
Liquid-filled Packaging Structure Of Heating Component App 20150060932 - HUANG; Meng-Chi ; et al.	2015-03-05
Light-emitting Diode Chip App 20150014719 - JAO; Chih-Sheng ; et al.	2015-01-15
Die Bonding Method And Die Bonding Structure Of Light Emitting Diode Package App 20140175495 - Chuang; Tung-Han ; et al.	2014-06-26
Die structure, manufacturing method and substrate thereof Grant 8,659,160 - Huang , et al. February 25, 2	2014-02-25
Light-emitting Diode Array Light Source And Optical Engine Having The Same App 20130170203 - Cheng; Kuei-Yuan ; et al.	2013-07-04
Die Structure, Manufacturing Method And Substrate Thereof App 20120168950 - Huang; Meng-Chi ; et al.	2012-07-05
Fabricating Method For Multi-layer Electric Probe App 20100281679 - Huang; Meng-Chi ; et al.	2010-11-11
Method For Forming A Patterned Photoresist Layer App 20090246717 - Huang; Meng-Chi ; et al.	2009-10-01
Multi-layer Electric Probe And Fabricating Method Thereof App 20080094084 - Huang; Meng-Chi ; et al.	2008-04-24

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