loadpatents
Patent applications and USPTO patent grants for HUANG; Meng-Cheng.The latest application filed is for "combined fan and cooling device using the same".
Patent | Date |
---|---|
Combined Fan And Cooling Device Using The Same App 20170241430 - HUANG; Meng-Cheng ;   et al. | 2017-08-24 |
Thin fastener of heat sink Grant 8,488,322 - Huang , et al. July 16, 2 | 2013-07-16 |
Vane type electric heater and vane structure thereof Grant 8,431,873 - Wang , et al. April 30, 2 | 2013-04-30 |
Thin Fastener Of Heat Sink App 20120106088 - HUANG; Meng-Cheng ;   et al. | 2012-05-03 |
Anti-breaking structure for end closure of heat pipe Grant 7,841,386 - Wang , et al. November 30, 2 | 2010-11-30 |
Thin Heat Dissipating Apparatus App 20100101763 - Huang; Meng-Cheng ;   et al. | 2010-04-29 |
Vane Type Electric Heater And Vane Structure Thereof App 20100078425 - Wang; Cheng-Tu ;   et al. | 2010-04-01 |
Heat Dissipating Structure App 20090279262 - HUANG; Meng-Cheng ;   et al. | 2009-11-12 |
Anti-breaking Structure For End Closure Of Heat Pipe App 20080222890 - Wang; Tony ;   et al. | 2008-09-18 |
Assembled Structure Of Large-sized Led Lamp App 20080055908 - Wu; Chung ;   et al. | 2008-03-06 |
Assembled structure of large-sized LED lamp Grant 7,338,186 - Wu , et al. March 4, 2 | 2008-03-04 |
LED lamp and heat-dissipating structure thereof App 20070253202 - Wu; Chung ;   et al. | 2007-11-01 |
Pressing mechanism for LED chip App 20070254519 - Wu; Chung ;   et al. | 2007-11-01 |
Method For Manufacturing A Heat Pipe Having An Enlarged Portion App 20070240481 - Wu; Chung ;   et al. | 2007-10-18 |
Capillary structure of heat pipe App 20070240859 - Wang; Tony ;   et al. | 2007-10-18 |
Air-guiding structure for heat-dissipating fin App 20070240868 - Wu; Chung ;   et al. | 2007-10-18 |
Method for manufacturing a heat pipe having an enlarged portion Grant 7,275,409 - Wu , et al. October 2, 2 | 2007-10-02 |
Cooling device for light emitting diode lamp App 20060139935 - Huang; Meng-Cheng | 2006-06-29 |
Heat sink App 20060098414 - Huang; Meng-Cheng | 2006-05-11 |
Configuring apparatus and processing method of thermal conductive plate App 20050218190 - Huang, Meng-Cheng ;   et al. | 2005-10-06 |
Structure of a uniform thermal conductive heat dissipation device App 20050145369 - Huang, Meng-Cheng ;   et al. | 2005-07-07 |
Three-phase heat transfer structure Grant 6,702,003 - Hsiao , et al. March 9, 2 | 2004-03-09 |
Three-phase heat transfer structure App 20030221812 - Hsiao, Feng-Neng ;   et al. | 2003-12-04 |
Automatic shaping method and structure of fin and connection element App 20030126743 - Huang, Meng-Cheng ;   et al. | 2003-07-10 |
Joining structure of heat-radiating plate and optoelectronic heat-emitting device App 20030099092 - Huang, Meng-Cheng ;   et al. | 2003-05-29 |
Pipe sealing structure for forming thermal pipe App 20020178561 - Huang, Meng Cheng | 2002-12-05 |
Combination heat radiator Grant 6,446,709 - Huang September 10, 2 | 2002-09-10 |
Integral heat dissipating device Grant 6,421,239 - Huang July 16, 2 | 2002-07-16 |
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