| Patent | Date |
|---|
Thermal extrusion method to fabricate large-dimension superhydrophobic cylinder pillar arrays with droplet pancake bouncing phenomenon
Grant 11,104,043 - Song , et al. August 31, 2 | 2021-08-31 |
Superhydrophobic Hemispherical Array Which Can Realize Droplet Pancake Bouncing Phenomenon
App 20210155837 - SONG; Jinlong ; et al. | 2021-05-27 |
Device location classification using data collected by wireless access points
Grant 10,721,708 - Mukherji , et al. | 2020-07-21 |
Thermal Extrusion Method To Fabricate Large-dimension Superhydrophobic Cylinder Pillar Arrays With Droplet Pancake Bouncing Phen
App 20200009763 - SONG; Jinlong ; et al. | 2020-01-09 |
Accurate detection of rogue wireless access points
Grant 10,334,445 - Hooda , et al. | 2019-06-25 |
Accurate Detection Of Rogue Wireless Access Points
App 20170111360 - Hooda; Sanjay Kumar ; et al. | 2017-04-20 |
Hybrid TSV and method for forming the same
Grant 9,269,651 - Hong , et al. February 23, 2 | 2016-02-23 |
Hybrid Tsv And Method For Forming The Same
App 20150179547 - Hong; Yu ; et al. | 2015-06-25 |
Hybrid TSV and method for forming the same
Grant 9,006,102 - Hong , et al. April 14, 2 | 2015-04-14 |
Interconnect formation using a sidewall mask layer
Grant 8,916,472 - Hu , et al. December 23, 2 | 2014-12-23 |
Interconnect Formation Using A Sidewall Mask Layer
App 20140038412 - Hu; Xiang ; et al. | 2014-02-06 |
Scheme for planarizing through-silicon vias
Grant 8,354,327 - Zengxiang , et al. January 15, 2 | 2013-01-15 |
Scheme For Planarizing Through-silicon Vias
App 20120270391 - Zengxiang; Chen ; et al. | 2012-10-25 |
Hybrid TSV and Method for Forming the Same
App 20120267788 - Hong; Yu ; et al. | 2012-10-25 |
Composite barrier/etch stop layer comprising oxygen doped SiC and SiC for interconnect structures
Grant 7,538,353 - Huang , et al. May 26, 2 | 2009-05-26 |
Modulation of Stress in ESL SiN Film through UV Curing to Enhance both PMOS and NMOS Transistor Performance
App 20080124855 - Widodo; Johnny ; et al. | 2008-05-29 |
Preventing plasma induced damage resulting from high density plasma deposition
Grant 7,208,426 - Huang , et al. April 24, 2 | 2007-04-24 |
Silicon-rich oxide for copper damascene interconnect incorporating low dielectric constant dielectrics
Grant 7,186,640 - Huang , et al. March 6, 2 | 2007-03-06 |
Use of phoslon (PNO) for borderless contact fabrication, etch stop/barrier layer for dual damascene fabrication and method of forming phoslon
Grant 7,148,157 - Choo , et al. December 12, 2 | 2006-12-12 |
Oxygen doped SiC for Cu barrier and etch stop layer in dual damascene fabrication
App 20060202343 - Huang; Liu ; et al. | 2006-09-14 |
Oxygen doped SiC for Cu barrier and etch stop layer in dual damascene fabrication
Grant 7,052,932 - Huang , et al. May 30, 2 | 2006-05-30 |
Oxygen doped SiC for Cu barrier and etch stop layer in dual damascene fabrication
App 20050184295 - Huang, Liu ; et al. | 2005-08-25 |
Deposition and sputter etch approach to extend the gap fill capability of HDP CVD process to .ltoreq.0.10 microns
Grant 6,872,633 - Huang , et al. March 29, 2 | 2005-03-29 |
Use of amorphous carbon as a removable ARC material for dual damascene fabrication
Grant 6,787,452 - Sudijono , et al. September 7, 2 | 2004-09-07 |
Use of amorphous carbon as a removable ARC material for dual damascene fabrication
App 20040092098 - Sudijono, John ; et al. | 2004-05-13 |
Use of phoslon (PNO) for borderless contact fabrication, etch stop/barrier layer for dual damascene fabrication and method of forming phoslon
App 20040077181 - Choo, Hsia Liang ; et al. | 2004-04-22 |
HDP SRO liner for beyond 0.18 um STI gap-fill
App 20040005781 - Huang, Liu ; et al. | 2004-01-08 |
Silicon-rich oxide for copper damascene interconnect incorporating low dielectric constant dielectrics
App 20030235980 - Huang, Liu ; et al. | 2003-12-25 |
Novel deposition and sputter etch approach to extend the gap fill capability of HDP CVD process to less than or equal to 0.10 microns
App 20030224580 - Huang, Liu ; et al. | 2003-12-04 |
Preventing plasma induced damage resulting from high density plasma deposition
App 20030092284 - Huang, Liu ; et al. | 2003-05-15 |
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