Huang; Kun-Yung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Huang; Kun-Yung.The latest application filed is for "semiconductor package structure and manufacturing method thereof".

Company Profile

4.6.8

Huang; Kun-Yung - Hsinchu County TW
Huang; Kun-Yung - Hukou Township TW
Huang, Kun-Yung - Hsin-Chu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package structure with landing pads and manufacturing method thereof Grant 11,437,336 - Wang , et al. September 6, 2	2022-09-06
Semiconductor package Grant 11,289,401 - Huang March 29, 2	2022-03-29
Semiconductor Package Structure And Manufacturing Method Thereof App 20210343674 - Wang; Jeffrey ; et al.	2021-11-04
Semiconductor Package And Manufacturing Method Thereof App 20200365486 - Huang; Kun-Yung	2020-11-19
Fan-out Package With Warpage Reduction And Manufacturing Method Thereof App 20200211980 - Huang; Kun-Yung	2020-07-02
Manufacturing method of redistribution layer Grant 10,607,856 - Huang , et al.	2020-03-31
Package structure and manufacturing method thereof Grant 10,460,959 - Huang , et al. Oc	2019-10-29
Package Structure And Manufacturing Method Thereof App 20190287820 - Huang; Kun-Yung ; et al.	2019-09-19
Semiconductor package and manufacturing method thereof Grant 10,276,545 - Huang , et al.	2019-04-30
Encapsulating composition, semiconductor package and manufacturing method thereof Grant 10,177,058 - Wang , et al. J	2019-01-08
Semiconductor Package Structure And Manufacturing Method Thereof App 20190006305 - Huang; Kun-Yung	2019-01-03
Manufacturing Method Of Redistribution Layer App 20180366344 - Huang; Kun-Yung ; et al.	2018-12-20
Image Sensor And Manufacturing Method Thereof App 20180226442 - Huang; Kun-Yung	2018-08-09
Integrated circuit device with compliant bumps and testing method for testing the integrated circuit device App 20050275422 - Luh, Song-Ping ; et al.	2005-12-15

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