| Patent | Date |
|---|
Tools and Systems for Processing Semiconductor Devices, and Methods of Processing Semiconductor Devices
App 20220302079 - Huang; Kuei-Wei ; et al. | 2022-09-22 |
System for processing semiconductor devices
Grant 11,355,471 - Huang , et al. June 7, 2 | 2022-06-07 |
Semiconductor Package and Method
App 20210351172 - Pei; Hao-Jan ; et al. | 2021-11-11 |
Semiconductor packaging structure and method
Grant 11,158,605 - Lin , et al. October 26, 2 | 2021-10-26 |
Package-on-package structures and methods for forming the same
Grant 11,101,261 - Huang , et al. August 24, 2 | 2021-08-24 |
Semiconductor package and method
Grant 11,069,671 - Pei , et al. July 20, 2 | 2021-07-20 |
Bonding Through Multi-Shot Laser Reflow
App 20210013173 - Chen; Wei-Yu ; et al. | 2021-01-14 |
Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates
Grant 10,832,999 - Huang , et al. November 10, 2 | 2020-11-10 |
Bonding through multi-shot laser reflow
Grant 10,790,261 - Chen , et al. September 29, 2 | 2020-09-29 |
Packaging Methods for Semiconductor Devices
App 20200144171 - Huang; Kuei-Wei ; et al. | 2020-05-07 |
Bump-on-trace packaging structure and method for forming the same
Grant 10,600,709 - Chen , et al. | 2020-03-24 |
Semiconductor Bonding Structures and Methods
App 20200035510 - Chen; Meng-Tse ; et al. | 2020-01-30 |
Package-on-Package Structure Including a Thermal Isolation Material and Method of Forming the Same
App 20200020677 - Chen; Meng-Tse ; et al. | 2020-01-16 |
Packaging methods for semiconductor devices including forming trenches in workpiece to separate adjacent packaging substrates
Grant 10,522,452 - Huang , et al. Dec | 2019-12-31 |
Package on-package structure including a thermal isolation material and method of forming the same
Grant 10,490,539 - Chen , et al. Nov | 2019-11-26 |
Package-on-Package Structures and Methods for Forming the Same
App 20190355710 - Huang; Kuei-Wei ; et al. | 2019-11-21 |
Semiconductor Package and Method
App 20190296002 - Pei; Hao-Jan ; et al. | 2019-09-26 |
Bonding Through Multi-Shot Laser Reflow
App 20190279958 - Chen; Wei-Yu ; et al. | 2019-09-12 |
Package-on-package structures and methods for forming the same
Grant 10,373,941 - Huang , et al. | 2019-08-06 |
Package on-package structure with epoxy flux residue
Grant 10,297,579 - Yu , et al. | 2019-05-21 |
Bump-on-trace packaging structure and method for forming the same
Grant 10,192,804 - Chen , et al. Ja | 2019-01-29 |
Tools and Systems for Processing Semiconductor Devices, and Methods of Processing Semiconductor Devices
App 20180358325 - Huang; Kuei-Wei ; et al. | 2018-12-13 |
Semiconductor bonding structures and methods
Grant 10,153,180 - Chen , et al. Dec | 2018-12-11 |
Bump-on-trace Packaging Structure And Method For Forming The Same
App 20180337106 - Chen; Meng-Tse ; et al. | 2018-11-22 |
Package on-package process for applying molding compound
Grant 10,134,703 - Chen , et al. November 20, 2 | 2018-11-20 |
Semiconductor Bonding Structures and Methods
App 20180330970 - Chen; Meng-Tse ; et al. | 2018-11-15 |
Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices
Grant 10,109,612 - Huang , et al. October 23, 2 | 2018-10-23 |
Package-on-Package Structures and Methods for Forming the Same
App 20180197847 - Huang; Kuei-Wei ; et al. | 2018-07-12 |
Package-on-Package Structure with Epoxy Flux Residue
App 20180166421 - Yu; Chen-Hua ; et al. | 2018-06-14 |
Package-on-package structures and methods for forming the same
Grant 9,935,091 - Huang , et al. April 3, 2 | 2018-04-03 |
Semiconductor Packaging Structure and Method
App 20180047708 - Lin; Chun-Cheng ; et al. | 2018-02-15 |
Package-on-package structure with epoxy flux residue
Grant 9,881,903 - Yu , et al. January 30, 2 | 2018-01-30 |
Alignment in the packaging of integrated circuits
Grant 9,865,574 - Huang , et al. January 9, 2 | 2018-01-09 |
Package-on-package Structure With Epoxy Flux Residue
App 20170345794 - Yu; Chen-Hua ; et al. | 2017-11-30 |
Semiconductor packaging structure and method
Grant 9,799,631 - Lin , et al. October 24, 2 | 2017-10-24 |
Semiconductor package
Grant 9,786,622 - Cheng , et al. October 10, 2 | 2017-10-10 |
Semiconductor Packaging Structure and Method
App 20170179083 - Lin; Chun-Cheng ; et al. | 2017-06-22 |
Package on package bonding structure and method for forming the same
Grant 9,673,182 - Huang , et al. June 6, 2 | 2017-06-06 |
Process for forming package-on-package structures
Grant 9,666,572 - Lin , et al. May 30, 2 | 2017-05-30 |
Semiconductor packaging having warpage control and methods of forming same
Grant 9,589,861 - Huang , et al. March 7, 2 | 2017-03-07 |
Semiconductor packaging structure and method
Grant 9,583,464 - Lin , et al. February 28, 2 | 2017-02-28 |
Packaging process tools and systems, and packaging methods for semiconductor devices
Grant 9,543,185 - Lin , et al. January 10, 2 | 2017-01-10 |
Package-on-Package Structures and Methods for Forming the Same
App 20160351554 - Huang; Kuei-Wei ; et al. | 2016-12-01 |
Package-on-Package Structure Including a Thermal Isolation Material and Method of Forming the Same
App 20160343698 - Chen; Meng-Tse ; et al. | 2016-11-24 |
Semiconductor Packaging Structure and Method
App 20160343692 - Lin; Chun-Cheng ; et al. | 2016-11-24 |
Package on Package Bonding Structure and Method for Forming the Same
App 20160322339 - Huang; Kuei-Wei ; et al. | 2016-11-03 |
Semiconductor Packaging Having Warpage Control and Methods of Forming Same
App 20160307815 - Huang; Yu-Chih ; et al. | 2016-10-20 |
Process for Forming Package-on-Package Structures
App 20160293588 - Lin; Chih-Wei ; et al. | 2016-10-06 |
Alignment in the Packaging of Integrated Circuits
App 20160247790 - Huang; Kuei-Wei ; et al. | 2016-08-25 |
Package-on-package structure including a thermal isolation material and method of forming the same
Grant 9,418,971 - Chen , et al. August 16, 2 | 2016-08-16 |
Package on package bonding structure and method for forming the same
Grant 9,397,062 - Huang , et al. July 19, 2 | 2016-07-19 |
Semiconductor packaging having warpage control and methods of forming same
Grant 9,379,032 - Huang , et al. June 28, 2 | 2016-06-28 |
Process for forming package-on-package structures
Grant 9,373,610 - Lin , et al. June 21, 2 | 2016-06-21 |
Alignment in the packaging of integrated circuits
Grant 9,343,386 - Huang , et al. May 17, 2 | 2016-05-17 |
Semiconductor Packaging Having Warpage Control And Methods Of Forming Same
App 20160079135 - Huang; Yu-Chih ; et al. | 2016-03-17 |
Packaging methods and packaged semiconductor devices
Grant 9,263,412 - Lin , et al. February 16, 2 | 2016-02-16 |
Packaging process tools and packaging methods for semiconductor devices
Grant 9,218,999 - Lu , et al. December 22, 2 | 2015-12-22 |
Process for Forming Package-on-Package Structures
App 20150348957 - Lin; Chih-Wei ; et al. | 2015-12-03 |
Process for forming package-on-package structures
Grant 9,117,816 - Lin , et al. August 25, 2 | 2015-08-25 |
Packaging methods and structures for semiconductor devices
Grant 9,082,636 - Lin , et al. July 14, 2 | 2015-07-14 |
Methods for forming 3DIC package
Grant 9,073,158 - Chen , et al. July 7, 2 | 2015-07-07 |
Package on Package Bonding Structure and Method for Forming the Same
App 20150187723 - Huang; Kuei-Wei ; et al. | 2015-07-02 |
Process for Forming Package-on-Package Structures
App 20150179624 - Lin; Chih-Wei ; et al. | 2015-06-25 |
Tools and Systems for Processing Semiconductor Devices, and Methods of Processing Semiconductor Devices
App 20150171051 - Huang; Kuei-Wei ; et al. | 2015-06-18 |
Contact structure
Grant 9,059,148 - Chen , et al. June 16, 2 | 2015-06-16 |
Semiconductor Bonding Structures and Methods
App 20150091193 - Chen; Meng-Tse ; et al. | 2015-04-02 |
Process for forming package-on-package structures
Grant 8,975,741 - Lin , et al. March 10, 2 | 2015-03-10 |
Packaging Methods and Structures for Semiconductor Devices
App 20150044819 - Lin; Chih-Wei ; et al. | 2015-02-12 |
Package-on-Package Process for Applying Molding Compound
App 20150008581 - Chen; Meng-Tse ; et al. | 2015-01-08 |
Package-on-package process for applying molding compound
Grant 8,927,391 - Chen , et al. January 6, 2 | 2015-01-06 |
Package on package bonding structure and method for forming the same
Grant 8,928,134 - Huang , et al. January 6, 2 | 2015-01-06 |
Alignment in the Packaging of Integrated Circuits
App 20140374922 - Huang; Kuei-Wei ; et al. | 2014-12-25 |
Packaging Methods and Packaged Semiconductor Devices
App 20140367867 - Lin; Wei-Hung ; et al. | 2014-12-18 |
Fine-pitch package-on-package structures and methods for forming the same
Grant 8,900,922 - Lin , et al. December 2, 2 | 2014-12-02 |
Packaging Process Tools and Packaging Methods for Semiconductor Devices
App 20140331462 - Lu; Wen-Hsiung ; et al. | 2014-11-13 |
Packaging methods and structures for semiconductor devices
Grant 8,884,431 - Lin , et al. November 11, 2 | 2014-11-11 |
Warpage control in a package-on-package structure
Grant 8,846,448 - Chen , et al. September 30, 2 | 2014-09-30 |
Package-on-Package Structures and Methods for Forming the Same
App 20140264856 - Huang; Kuei-Wei ; et al. | 2014-09-18 |
Packaging process tools and packaging methods for semiconductor devices
Grant 8,809,117 - Lu , et al. August 19, 2 | 2014-08-19 |
Package On Package Bonding Structure And Method For Forming The Same
App 20140183732 - Huang; Kuei-Wei ; et al. | 2014-07-03 |
Package-on-package Structure Including A Thermal Isolation Material And Method Of Forming The Same
App 20140124955 - CHEN; Meng-Tse ; et al. | 2014-05-08 |
Package assembly cleaning process using vaporized solvent
Grant 8,702,871 - Hsiao , et al. April 22, 2 | 2014-04-22 |
Methods for Forming 3DIC Package
App 20140091509 - Chen; Meng-Tse ; et al. | 2014-04-03 |
Warpage Control In A Package-on-package Structure
App 20140045300 - Chen; Meng-Tse ; et al. | 2014-02-13 |
Bump-on-trace Packaging Structure And Method For Forming The Same
App 20140008786 - Chen; Meng-Tse ; et al. | 2014-01-09 |
Forming low stress joints using thermal compress bonding
Grant 8,616,433 - Huang , et al. December 31, 2 | 2013-12-31 |
Forming low stress joints using thermal compress bonding
Grant 08616433 - | 2013-12-31 |
Contact and Method of Formation
App 20130334710 - Chen; Meng-Tse ; et al. | 2013-12-19 |
Methods for forming 3DIC package
Grant 8,609,462 - Chen , et al. December 17, 2 | 2013-12-17 |
Process for forming packages
Grant 8,603,860 - Chen , et al. December 10, 2 | 2013-12-10 |
Contact and method of formation
Grant 8,586,408 - Chen , et al. November 19, 2 | 2013-11-19 |
Thermal compress bonding
Grant 8,556,158 - Jang , et al. October 15, 2 | 2013-10-15 |
Fine-Pitch Package-on-Package Structures and Methods for Forming the Same
App 20130214431 - Lin; Cheng-Chung ; et al. | 2013-08-22 |
Semiconductor Packaging Structure and Method
App 20130187268 - Lin; Chun-Cheng ; et al. | 2013-07-25 |
Packaging Process Tools and Systems, and Packaging Methods for Semiconductor Devices
App 20130143361 - Lin; Wei-Hung ; et al. | 2013-06-06 |
Forming Low Stress Joints Using Thermal Compress Bonding
App 20130128486 - Huang; Kuei-Wei ; et al. | 2013-05-23 |
Thermal Compress Bonding
App 20130126591 - Jang; Bor-Ping ; et al. | 2013-05-23 |
Contact and Method of Formation
App 20130113116 - Chen; Meng-Tse ; et al. | 2013-05-09 |
Semiconductor Package
App 20130099370 - CHENG; Ming-Da ; et al. | 2013-04-25 |
Semiconductor Package Having Solder Jointed Region With Controlled Ag Content
App 20130099371 - CHENG; Ming-Da ; et al. | 2013-04-25 |
Process for Forming Packages
App 20130102112 - Chen; Meng-Tse ; et al. | 2013-04-25 |
Packaging Methods for Semiconductor Devices
App 20130095611 - Huang; Kuei-Wei ; et al. | 2013-04-18 |
Methods for Forming 3DIC Package
App 20130095608 - Chen; Meng-Tse ; et al. | 2013-04-18 |
Process for Forming Package-on-Package Structures
App 20130093078 - Lin; Chih-Wei ; et al. | 2013-04-18 |
Packaging Process Tools and Packaging Methods for Semiconductor Devices
App 20130089952 - Lu; Wen-Hsiung ; et al. | 2013-04-11 |
Packaging Methods and Structures for Semiconductor Devices
App 20130062761 - Lin; Chih-Wei ; et al. | 2013-03-14 |
Driving method and driving apparatus for displaying apparatus
Grant 8,390,651 - Huang , et al. March 5, 2 | 2013-03-05 |
Package Assembly Cleaning Process Using Vaporized Solvent
App 20130048027 - Hsiao; Yi-Li ; et al. | 2013-02-28 |
Thermal compress bonding
Grant 8,381,965 - Jang , et al. February 26, 2 | 2013-02-26 |
Forming low stress joints using thermal compress bonding
Grant 8,360,303 - Huang , et al. January 29, 2 | 2013-01-29 |
Package-on-Package Process for Applying Molding Compound
App 20120299181 - Chen; Meng-Tse ; et al. | 2012-11-29 |
Methods and Apparatus for Thin Die Processing
App 20120267423 - Huang; Kuei-Wei ; et al. | 2012-10-25 |
Pixel array structure
Grant 8,139,191 - Huang , et al. March 20, 2 | 2012-03-20 |
Liquid crystal display device
Grant 8,111,226 - Tsai , et al. February 7, 2 | 2012-02-07 |
Thermal Compress Bonding
App 20120018494 - Jang; Bor-Ping ; et al. | 2012-01-26 |
Forming Low Stress Joints Using Thermal Compress Bonding
App 20120021183 - Huang; Kuei-Wei ; et al. | 2012-01-26 |
Touch display panel
Grant 8,054,297 - Huang November 8, 2 | 2011-11-08 |
Image Processing Method Capable Of Reducing Color Shift
App 20100238101 - Jhuo; Long-Cai ; et al. | 2010-09-23 |
Liquid Crystal Display Device
App 20100231494 - Tsai; Yi-Cheng ; et al. | 2010-09-16 |
Liquid crystal display panel with eliminating image sticking abilities and method of the same
App 20100171893 - Huang; Kuei - Wei | 2010-07-08 |
Touch Display Panel
App 20100103119 - Huang; Kuei-Wei | 2010-04-29 |
Pixel Array Structure
App 20100097555 - Huang; Kuei-Wei ; et al. | 2010-04-22 |
Driving Method and Driving Apparatus for Displaying Apparatus
App 20100033507 - Huang; Kuei-Wei ; et al. | 2010-02-11 |
| 