HUANG; KUAN-JUI

Patent Applications and Registrations

Patent applications and USPTO patent grants for HUANG; KUAN-JUI.The latest application filed is for "touch sensitive device and display device employing the same".

Company Profile

0.5.14

HUANG; KUAN-JUI - Tu-Cheng TW
HUANG; Kuan-Jui - Kao-Hsiung Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Touch Sensitive Device And Display Device Employing The Same App 20120242623 - HO; HSIEN-LUNG ; et al.	2012-09-27
Front Light Illumination Device And Reflective Display Device Employing The Same App 20120230055 - HO; HSIEN-LUNG ; et al.	2012-09-13
Light Emitting Diode Package And Method Of Making The Same App 20120080693 - LIN; Hung-Yi ; et al.	2012-04-05
Light emitting diode package and method of making the same Grant 8,129,206 - Lin , et al. March 6, 2	2012-03-06
Interposer for connecting plurality of chips and method for manufacturing the same Grant 7,987,588 - Huang , et al. August 2, 2	2011-08-02
Method of fabricating metal interconnects and inter-metal dielectric layer thereof Grant 7,795,131 - Huang , et al. September 14, 2	2010-09-14
Method for making light emitting diode chip package Grant 7,732,233 - Lin , et al. June 8, 2	2010-06-08
Light Emitting Diode Package And Method Of Making The Same App 20100090245 - Lin; Hung-Yi ; et al.	2010-04-15
Chip Package Structure And Method Of Making The Same App 20090273004 - Lin; Hung-Yi ; et al.	2009-11-05
Light Emitting Diode Chip Package And Method Of Making The Same App 20090267108 - Lin; Hung-Yi ; et al.	2009-10-29
Interposer For Connecting Plurality Of Chips And Method For Manufacturing The Same App 20090064496 - Huang; Kuan-Jui ; et al.	2009-03-12
Method Of Fabricating Micro Mechanical Moving Member And Metal Interconnects Thereof App 20080188024 - Huang; Kuan-Jui ; et al.	2008-08-07
Interposer For Connecting Plurality Of Chips And Method For Manufacturing The Same App 20080182432 - Huang; Kuan-Jui ; et al.	2008-07-31
Method Of Fabricating Metal Interconnects And Inter-metal Dielectric Layer Thereof App 20080146021 - Huang; Kuan-Jui ; et al.	2008-06-19
Method of forming a wear-resistant dielectric layer Grant 7,262,078 - Lai , et al. August 28, 2	2007-08-28
Chip-type Micro-connector And Method Of Packaging The Same App 20060263934 - Hu; Shu-Hua ; et al.	2006-11-23
Chip-type Micro-connector And Method Of Packaging The Same App 20060186523 - Hu; Shu-Hua ; et al.	2006-08-24
Method Of Forming A Wear-resistant Dielectric Layer App 20060183259 - Lai; Wei-Shun ; et al.	2006-08-17
Method Of Forming Chip-type Low-k Dielectric Layer App 20060183312 - Hu; Shu-Hua ; et al.	2006-08-17

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