Huang; Jun-Lung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Huang; Jun-Lung.The latest application filed is for "process for removing organic materials during formation of a metal interconnect".

Company Profile

0.4.4

Huang; Jun-Lung - Hsin Chu TW
Huang, Jun-Lung - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Process for removing organic materials during formation of a metal interconnect Grant 7,122,484 - Perng , et al. October 17, 2	2006-10-17
Composite etching stop in semiconductor process integration Grant 7,042,049 - Li , et al. May 9, 2	2006-05-09
Process for removing organic materials during formation of a metal interconnect App 20050245082 - Perng, Baw-Ching ; et al.	2005-11-03
Method for removing polymeric residue contamination on semiconductor feature sidewalls Grant 6,884,728 - Huang , et al. April 26, 2	2005-04-26
Pre-etching plasma treatment to form dual damascene with improved profile App 20040192058 - Chu, Yin-Shen ; et al.	2004-09-30
Composite etching stop in semiconductor process integration App 20040191977 - Li, Lain-Jong ; et al.	2004-09-30
Composite etching stop in semiconductor process integration Grant 6,753,260 - Li , et al. June 22, 2	2004-06-22
Method for removing polymeric residue contamination on semiconductor feature sidewalls App 20040087167 - Huang, Jun-Lung ; et al.	2004-05-06

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