Huang; Jiun-Jie

Patent Applications and Registrations

Patent applications and USPTO patent grants for Huang; Jiun-Jie.The latest application filed is for "semiconductor device and method of forming the same".

Company Profile

3.15.19

Huang; Jiun-Jie - Kaohsiung TW
Huang; Jiun-Jie - Kaohsiung City TW
HUANG; Jiun Jie - Hsinchu Hsien TW
HUANG; JIUN JIE - CHUPEI CITY TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of forming the same Grant 10,608,094 - Tsai , et al.	2020-03-31
Semiconductor Device And Method Of Forming The Same App 20190229199 - Tsai; Fu-Tsun ; et al.	2019-07-25
Voids in interconnect structures and methods for forming the same Grant 9,837,348 - Huang , et al. December 5, 2	2017-12-05
Voids in Interconnect Structures and Methods for Forming the Same App 20150333003 - Huang; Jiun-Jie ; et al.	2015-11-19
Voids in interconnect structures and methods for forming the same Grant 9,105,634 - Huang , et al. August 11, 2	2015-08-11
Metal-oxide-metal capacitor apparatus with a via-hole region Grant 9,064,841 - Huang , et al. June 23, 2	2015-06-23
Methods and apparatus for testing pads on wafers Grant 8,648,341 - Yang , et al. February 11, 2	2014-02-11
Voids in Interconnect Structures and Methods for Forming the Same App 20140001597 - Huang; Jiun-Jie ; et al.	2014-01-02
Epoxy Resin Composition, And Prepreg And Printed Circuit Board Usng The Same App 20130306357 - HSU; Hsuan Hao ; et al.	2013-11-21
Metal-oxide-metal capacitor structure Grant 8,558,350 - Huang , et al. October 15, 2	2013-10-15
Methods and Apparatus for Testing Pads on Wafers App 20130221353 - Yang; Chung-Yuan ; et al.	2013-08-29
Enhanced wafer test line structure Grant 8,476,629 - Huang , et al. July 2, 2	2013-07-02
Reducing metal pits through optical proximity correction Grant 8,468,474 - Huang , et al. June 18, 2	2013-06-18
Epoxy Resin Composition, And Prepreg And Metal-clad Laminate Using The Same App 20130143046 - CHEN; HSIEN TE ; et al.	2013-06-06
Metal-Oxide-Metal Capacitor Structure App 20130093047 - Huang; Jiun-Jie ; et al.	2013-04-18
Metal-Oxide-Metal Capacitor Apparatus App 20130087885 - Huang; Jiun-Jie ; et al.	2013-04-11
Enhanced Wafer Test Line Structure App 20130075725 - Huang; Jiun-Jie ; et al.	2013-03-28
Reducing Metal Pits Through Optical Proximity Correction App 20130024833 - Huang; Jiun-Jie ; et al.	2013-01-24
Fused Filler And Its Manufacturing Method And Use App 20120329912 - LIU; Cheng-Ping ; et al.	2012-12-27
Reducing metal pits through optical proximity correction Grant 8,341,562 - Huang , et al. December 25, 2	2012-12-25
Epoxy Resin Composition, And Prepreg And Printed Circuit Board Using The Same App 20120024580 - HSU; Hsuan Hao ; et al.	2012-02-02

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