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name:-0.011723041534424
name:-0.012664079666138
name:-0.0061209201812744
Huang; Jian-Ming Patent Filings

Huang; Jian-Ming

Patent Applications and Registrations

Patent applications and USPTO patent grants for Huang; Jian-Ming.The latest application filed is for "process for forming metal-insulator-metal structures".

Company Profile
6.9.11
  • Huang; Jian-Ming - Taipei TW
  • Huang; Jian-Ming - New Taipei TW
  • Huang; Jian-Ming - New Taipei City TW
  • Huang; Jian-Ming - TAIPEI CITY TW
  • Huang; Jian-Ming - Miaoli TW
  • Huang; Jian-Ming - Tainan City TW
  • HUANG; JIAN-MING - Shenzhen CN
  • HUANG; JIAN-MING - Shenzhen City CN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Electrolytic copper foil, electrode comprising the same, and lithium ion battery comprising the same
Grant 11,365,486 - Lai , et al. June 21, 2
2022-06-21
Process for forming metal-insulator-metal structures
Grant 11,145,592 - Shen , et al. October 12, 2
2021-10-12
Process for Forming Metal-Insulator-Metal Structures
App 20210249350 - Shen; Hsiang-Ku ;   et al.
2021-08-12
Contact structure and semiconductor device and method of forming the same
Grant 10,867,851 - Lee , et al. December 15, 2
2020-12-15
Electrolytic copper foil and electrode and lithium ion cell comprising the same
Grant 10,826,052 - Huang , et al. November 3, 2
2020-11-03
Electrolytic copper foil with low profile
Grant 10,787,751 - Huang , et al. September 29, 2
2020-09-29
Electrolytic copper foil for printed circuit board with low transmission loss
Grant 10,765,010 - Huang , et al. Sep
2020-09-01
Electrolytic Copper Foil With Low Profile
App 20200248328 - Kind Code
2020-08-06
Electrolytic Copper Foil For Printed Circuit Board With Low Transmission Loss
App 20200253061 - Kind Code
2020-08-06
Electrolytic Copper Foil, Electrode Comprising The Same, And Lithium Ion Battery Comprising The Same
App 20200119360 - Lai; Yao-Sheng ;   et al.
2020-04-16
Contact Structure And Semiconductor Device And Method Of Forming The Same
App 20190267284 - Lee; Ying ;   et al.
2019-08-29
Electrodeposited copper foil with low repulsive force
Grant 10,190,225 - Lai , et al. Ja
2019-01-29
Electrodeposited Copper Foil With Low Repulsive Force
App 20180298509 - LAI; Yao-Sheng ;   et al.
2018-10-18
Electrodeposited Copper Foil With Low Repulsive Force
App 20180298508 - LAI; Yao-Sheng ;   et al.
2018-10-18
Electrodeposited copper foil with low repulsive force
Grant 10,081,875 - Lai , et al. September 25, 2
2018-09-25
Touch Display System, And Driving Apparatus And Driving Method Thereof
App 20170123527 - Chuang; Chen-Jung ;   et al.
2017-05-04
Pin Puller
App 20140345100 - HUANG; JIAN-MING ;   et al.
2014-11-27
Jig assembly for orienting, sorting and selecting fastener nuts
Grant 8,820,537 - Peng , et al. September 2, 2
2014-09-02
Jig Assembly For Orienting, Sorting And Selecting Fastener Nuts
App 20130146511 - PENG; LI-DONG ;   et al.
2013-06-13
Adhesive Bonding Assembly And Method For Making The Same
App 20090226703 - ZHENG; HAI-QUAN ;   et al.
2009-09-10

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