Huang, Jesse

USPTO Trademark & Patent Filings

Huang Jesse

Trademark applications and grants for Huang, Jesse. Huang, Jesse has 3 trademark applications. The latest application filed is for "THE INNOVATION GAME"

Company Profile
    Company Aliases
  • Huang, Jesse
  • jesse huang
  • HUANG; Jesse - Westford MA
  • HUANG; JESSE - Shanghai CN
  • Huang; Jesse - Hsin-Tien City TW
  • Huang; Jesse - Shanghai CN
  • Huang, Jesse - Kaohsiung TW
  • Huang; Jesse - Kaohsiung TW
Entity Type INDIVIDUAL
Address 4 Essex Street Plainsboro, NEW JERSEY UNITED STATES 08536

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks Patents
Patent Applications
Patent ApplicationDate
METHOD, SYSTEM AND DEVICES FOR INSTANT AUTOMATED DESIGN OF A CUSTOMIZED DENTAL OBJECT
20220296344 - 17/637107 LEE; Jinho ;   et al.
2022-09-22
MASK-LESS METHOD AND STRUCTURE FOR PATTERNING PHOTOSENSITIVE MATERIAL USING OPTICAL FIBERS
20120050702 - 13/291079 CHIU; TZU YIN ;   et al.
2012-03-01
Method Of Verifying Accuracy Of A Speech
20080262840 - 11/849440 Huang; Jesse ;   et al.
2008-10-23
MASK-LESS METHOD AND STRUCTURE FOR PATTERNING PHOTOSENSITIVE MATERIAL USING OPTICAL FIBERS
20080252868 - 11/765399 Chiu; Tzu Yin ;   et al.
2008-10-16
Integrated circuit packaging for improving effective chip-bonding area
20040106233 - 10/721288 Lin, Chung-Hung ;   et al.
2004-06-03
Mask-less method and structure for patterning photosensitive material using optical fibers
8,351,748 - 13/291,079 Chiu , et al. January 8, 2
2013-01-08
Mask-less method and structure for patterning photosensitive material using optical fibers
8,053,178 - 11/765,399 Chiu , et al. November 8, 2
2011-11-08
Wafer treating method for making adhesive dies
RE42,349 - 11/371,307 Lin , et al. May 10, 2
2011-05-10
Integrated circuit packaging for improving effective chip-bonding area
6,960,491 - 10/721,288 Lin , et al. November 1, 2
2005-11-01
Wafer treating method for making adhesive dies
6,703,075 - 10/327,064 Lin , et al. March 9, 2
2004-03-09
Patent Grants & Applications

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