Huang; Jen-Rong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Huang; Jen-Rong.The latest application filed is for "deposition nozzle and apparatus for thin film deposition process".

Company Profile

0.11.13

Huang; Jen-Rong - Hsinchu TW
Huang; Jen-Rong - Taipei N/A TW
Huang; Jen-Rong - Hsinchu City TW
Huang, Jen-Rong - Hsin Chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Deposition nozzle and apparatus for thin film deposition process Grant 8,944,347 - Huang February 3, 2	2015-02-03
Encapsulation film, package structure utilizing the same, and method for forming the package structure Grant 8,896,135 - Wang , et al. November 25, 2	2014-11-25
Method for depositing microcrystalline silicon and monitor device of plasma enhanced deposition Grant 8,435,803 - Du , et al. May 7, 2	2013-05-07
Deposition Nozzle And Apparatus For Thin Film Deposition Process App 20130001330 - HUANG; Jen-Rong	2013-01-03
Plasma Enhanced Atomic Layer Deposition Apparatus And The Controlling Method Thereof App 20120070590 - Huang; Jen-Rong ; et al.	2012-03-22
Encapsulation Film, Package Structure Utilizing The Same, And Method For Forming The Package Structure App 20120032355 - Wang; Ching-Chiun ; et al.	2012-02-09
Method For Depositing Microcrystalline Silicon And Monitor Device Of Plasma Enhanced Deposition App 20110136269 - Du; Chen-Chung ; et al.	2011-06-09
Long Linear-type Microwave Plasma Source Using Variably-reduced-height Rectangular Waveguide As Plasma Reactor App 20100164381 - CHANG; CHIH-CHEN ; et al.	2010-07-01
Capacitively Coupled Plasma (ccp) Generator With Two Input Ports App 20100141147 - CHANG; CHIH-CHEN ; et al.	2010-06-10
System And Method For Plasma Enhanced Thin Film Deposition App 20090090616 - DU; CHEN-CHUNG ; et al.	2009-04-09
Wafer electroplating apparatus Grant 7,449,091 - Du , et al. November 11, 2	2008-11-11
Electroplating apparatus with functions of voltage detection and flow rectification Grant 7,238,265 - Wang , et al. July 3, 2	2007-07-03
Wafer electroplating apparatus App 20060137974 - Du; Chen-Chung ; et al.	2006-06-29
Compress and position apparatus Grant 7,021,208 - Du , et al. April 4, 2	2006-04-04
Electroplating apparatus with functions of voltage detection and flow rectification App 20050051425 - Wang, Chih-Cheng ; et al.	2005-03-10
Compress and position apparatus App 20050051023 - Du, Chen-Chung ; et al.	2005-03-10
Wafer electroplating apparatus and method App 20040124090 - Du, Chen-Chung ; et al.	2004-07-01
Method for liquid phase deposition Grant 6,653,245 - Liang , et al. November 25, 2	2003-11-25
Door for wafer container having rotatable cammed member and movable links Grant 6,622,883 - Wu , et al. September 23, 2	2003-09-23
Method and apparatus for liquid phase deposition App 20020173170 - Liang, Muh-Wang ; et al.	2002-11-21
Nozzle And Adjust Module App 20020066806 - Tung, Fu-Ching ; et al.	2002-06-06

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