Huang; Hung-Shu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Huang; Hung-Shu.The latest application filed is for "passivation structure with increased thickness for metal pads".

Company Profile

10.6.9

Huang; Hung-Shu - Taichung TW
Huang; Hung-Shu - Taichung City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Device with a recessed gate electrode that has high thickness uniformity Grant 11,445,104 - Huang , et al. September 13, 2	2022-09-13
Passivation Structure With Increased Thickness for Metal Pads App 20220013482 - Huang; Hung-Shu ; et al.	2022-01-13
Flash Memory Structure With Enhanced Floating Gate App 20210384211 - Huang; Hung-Shu ; et al.	2021-12-09
Double channel memory device Grant 11,158,648 - Huang , et al. October 26, 2	2021-10-26
Flash memory structure with enhanced floating gate Grant 11,107,825 - Huang , et al. August 31, 2	2021-08-31
Pad Structure And Manufacturing Method Thereof In Semiconductor Device App 20210050314 - HUANG; HUNG-SHU ; et al.	2021-02-18
Pad structure and manufacturing method thereof in semiconductor device Grant 10,840,198 - Huang , et al. November 17, 2	2020-11-17
Flash Memory Structure With Enhanced Floating Gate App 20200321348 - Huang; Hung-Shu ; et al.	2020-10-08
Double Channel Memory Device App 20200295015 - HUANG; Hung-Shu ; et al.	2020-09-17
Flash memory structure with enhanced floating gate Grant 10,734,398 - Huang , et al.	2020-08-04
Device With A Recessed Gate Electrode That Has High Thickness Uniformity App 20200221015 - Huang; Hung-Shu ; et al.	2020-07-09
Pad Structure And Manufacturing Method Thereof In Semiconductor Device App 20200091096 - Huang; Hung-shu ; et al.	2020-03-19
Flash Memory Structure With Enhanced Floating Gate App 20200075614 - Huang; Hung-Shu ; et al.	2020-03-05
Pad structure and manufacturing method thereof in semiconductor device Grant 10,510,696 - Huang , et al. Dec	2019-12-17
Pad Structure And Manufacturing Method Thereof In Semiconductor Device App 20190164917 - HUANG; HUNG-SHU ; et al.	2019-05-30

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