HUANG; Hung-Hsien

Patent Applications and Registrations

Patent applications and USPTO patent grants for HUANG; Hung-Hsien.The latest application filed is for "heat transfer element, method for forming the same and semiconductor structure comprising the same".

Company Profile

0.3.8

HUANG; Hung-Hsien - Kaohsiung TW
Huang; Hung-Hsien - Taoyuan TW
Huang; Hung-Hsien - Taoyuan City TW
Huang; Hung-Hsien - Kaohsiung City TW
Huang; Hung-Hsien - Hsinchu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Heat Transfer Element, Method For Forming The Same And Semiconductor Structure Comprising The Same App 20220243992 - HUANG; Hung-Hsien ; et al.	2022-08-04
Detection circuit, detection method and uninterruptible power system using same Grant 11,293,984 - Liao , et al. April 5, 2	2022-04-05
Substrate Structures, Methods For Forming The Same And Semiconductor Device Structures Comprising The Same App 20220084926 - HU; Ian ; et al.	2022-03-17
Semiconductor device package Grant 11,205,606 - Chen , et al. December 21, 2	2021-12-21
Detection Circuit, Detection Method And Uninterruptible Power System Using Same App 20210318380 - Liao; Jen-Chuan ; et al.	2021-10-14
Semiconductor package structure and assembly structure Grant 11,139,226 - Chen , et al. October 5, 2	2021-10-05
Semiconductor Device Package And Method For Manufacturing The Same App 20210202349 - CHEN; Hsin-En ; et al.	2021-07-01
Semiconductor Package Structure And Assembly Structure App 20200111728 - CHEN; Hsin-En ; et al.	2020-04-09
Thermoelectric Module App 20170170378 - Liao; Chien-Neng ; et al.	2017-06-15
Highly Efficient Thermoelectric Material App 20130112909 - Liao; Chien-Neng ; et al.	2013-05-09

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