Huang; Hung-Cheng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Huang; Hung-Cheng.The latest application filed is for "flexible network switch fabric for clustering system".

Company Profile

0.6.6

Huang; Hung-Cheng - Taoyuan TW
Huang; Hung-Cheng - Taipei TW
Huang; Hung-Cheng - Taipei Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Flexible network switch fabric for clustering system Grant 8,107,466 - Huang , et al. January 31, 2	2012-01-31
Bandgap reference circuit Grant 7,619,401 - Chen , et al. November 17, 2	2009-11-17
Flexible Network Switch Fabric For Clustering System App 20090245135 - Huang; Hung-Cheng ; et al.	2009-10-01
Bandgap Reference Circuit App 20080018317 - Chen; An Chung ; et al.	2008-01-24
Bandgap reference circuit Grant 7,253,599 - Chen , et al. August 7, 2	2007-08-07
Bandgap reference circuit App 20060279270 - Chen; An-Chung ; et al.	2006-12-14
Internal circuit structure of semiconductor chip with array-type bonding pads and method of fabricating the same Grant 6,762,507 - Cheng , et al. July 13, 2	2004-07-13
Internal circuit structure of semiconductor chip with array-type bonding pads and method of fabricating the same Grant 6,759,329 - Cheng , et al. July 6, 2	2004-07-06
Package of semiconductor chip with array-type bonding pads Grant 6,707,164 - Cheng , et al. March 16, 2	2004-03-16
Internal circuit structure of semiconductor chip with array-type bonding pads and method of fabricating the same App 20040004296 - Cheng, Wen-Lung ; et al.	2004-01-08
Internal circuit structure of semiconductor chip with array-type bonding pads and method of fabricating the same App 20040004278 - Cheng, Wen-Lung ; et al.	2004-01-08
Package of semiconductor chip with array-type bonding pads App 20030075812 - Cheng, Wen-Lung ; et al.	2003-04-24

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