HUANG; Hui-Min
Patent Applications and Registrations
Patent applications and USPTO patent grants for HUANG; Hui-Min.The latest application filed is for "apparatus and method for forming a package structure".
Company Profile
29.74.87
- HUANG; Hui-Min - Taoyuan City TW
- Huang; Hui-Min - Miao-Li County TW
- Huang; Hui-Min - Taoyuan TW
- Huang; Hui-Min - Hsinchu TW
- HUANG; HUI-MIN - YUNLIN COUNTY TW
- Huang; Hui-Min - Hsin-Chu TW
- Huang; Hui-Min - Taoyuan County TW
- Huang; Hui-Min - New Taipei TW
- Huang; Hui-Min - Taichung TW
- HUANG; Hui-Min - New Taipei City TW
- Huang; Hui-Min - Novi MI
- Huang; Hui-min - Changhua TW
Patent Activity
| Patent | Date |
|---|---|
| Apparatus And Method For Forming A Package Structure App 20220278071 - ZHAN; Kai Jun ; et al. | 2022-09-01 |
| Packages with Multiple Encapsulated Substrate Blocks App 20220262694 - Chen; Chen-Shien ; et al. | 2022-08-18 |
| Electronic Device App 20220252922 - Yang; Shu-Han ; et al. | 2022-08-11 |
| Method of packaging a semiconductor die Grant 11,387,171 - Huang , et al. July 12, 2 | 2022-07-12 |
| Electronic device Grant 11,347,113 - Yang , et al. May 31, 2 | 2022-05-31 |
| Display device Grant 11,289,044 - Yeh , et al. March 29, 2 | 2022-03-29 |
| Package-on-package structure Grant 11,239,103 - Lin , et al. February 1, 2 | 2022-02-01 |
| Display Device App 20210376049 - HUANG; Hui-Min ; et al. | 2021-12-02 |
| Receiving end of electronic device and method of setting phase threshold of timing recovery operation Grant 11,184,010 - Chen , et al. November 23, 2 | 2021-11-23 |
| Wafer etching process and methods thereof Grant 11,177,137 - Lu , et al. November 16, 2 | 2021-11-16 |
| Display Device App 20210351265 - HUANG; Hui-Min ; et al. | 2021-11-11 |
| Semiconductor device structure with protected bump and method of forming the same Grant 11,171,100 - Huang , et al. November 9, 2 | 2021-11-09 |
| Package-on-package structure having polymer-based material for warpage control Grant 11,133,285 - Chen , et al. September 28, 2 | 2021-09-28 |
| Semiconductor Package And Method Of Making App 20210287966 - HUANG; Hui-Min ; et al. | 2021-09-16 |
| Display device Grant 11,121,201 - Huang , et al. September 14, 2 | 2021-09-14 |
| Semiconductor structure and method for forming the same Grant 11,094,655 - Lu , et al. August 17, 2 | 2021-08-17 |
| Semiconductor Package System and Method App 20210242150 - Huang; Hui-Min ; et al. | 2021-08-05 |
| Wafer Etching Process And Methods Thereof App 20210225658 - Lu; Wen-Hsiung ; et al. | 2021-07-22 |
| Semiconductor Device Structure With Protected Bump And Method Of Forming The Same App 20210159197 - HUANG; Hui-Min ; et al. | 2021-05-27 |
| Liquid-crystal Antenna Device And Manufacturing Method Of The Same App 20210143534 - LIN; Yi-Hung ; et al. | 2021-05-13 |
| Electronic Device App 20210124200 - Yang; Shu-Han ; et al. | 2021-04-29 |
| Semiconductor package system and method Grant 10,985,122 - Huang , et al. April 20, 2 | 2021-04-20 |
| Display device Grant 10,971,107 - Chen , et al. April 6, 2 | 2021-04-06 |
| 3D Package Structure and Methods of Forming Same App 20210091047 - Chen; Meng-Tse ; et al. | 2021-03-25 |
| Electronic Device App 20210055616 - HSU; Chih-Hao ; et al. | 2021-02-25 |
| Liquid-crystal antenna device and manufacturing method of the same Grant 10,903,559 - Lin , et al. January 26, 2 | 2021-01-26 |
| Electronic Devices App 20210013234 - CHANG; Yu-Che ; et al. | 2021-01-14 |
| Display Device App 20200410949 - Yeh; Chia-Min ; et al. | 2020-12-31 |
| Semiconductor Structure And Method For Forming The Same App 20200395323 - LU; Wen-Hsiung ; et al. | 2020-12-17 |
| 3D package structure and methods of forming same Grant 10,861,827 - Chen , et al. December 8, 2 | 2020-12-08 |
| Chip package with fan-out structure Grant 10,840,111 - Chen , et al. November 17, 2 | 2020-11-17 |
| Package-on-Package Structure App 20200350197 - Lin; Chih-Wei ; et al. | 2020-11-05 |
| Display device Grant 10,770,014 - Yeh , et al. Sep | 2020-09-08 |
| Package-on-Package Structure App 20200243370 - Lin; Chih-Wei ; et al. | 2020-07-30 |
| Semiconductor Package System and Method App 20200144206 - Huang; Hui-Min ; et al. | 2020-05-07 |
| Display substrate and display device Grant 10,642,118 - Chen , et al. | 2020-05-05 |
| Operating voltage switching device with current mirror Grant 10,620,656 - Lin , et al. | 2020-04-14 |
| Package on-package structure Grant 10,622,240 - Lin , et al. | 2020-04-14 |
| Bump-on-trace packaging structure and method for forming the same Grant 10,600,709 - Chen , et al. | 2020-03-24 |
| Display device with display drivers arranged on edge thereof Grant 10,546,537 - Tsai , et al. Ja | 2020-01-28 |
| Packaged semiconductor devices and methods of packaging semiconductor devices Grant 10,510,716 - Yu , et al. Dec | 2019-12-17 |
| Semiconductor package system and method Grant 10,510,697 - Huang , et al. Dec | 2019-12-17 |
| Methods of packaging semiconductor devices and packaged semiconductor devices Grant 10,510,719 - Yu , et al. Dec | 2019-12-17 |
| Display Device App 20190304392 - YEH; Chia-Min ; et al. | 2019-10-03 |
| 3D Package Structure and Methods of Forming Same App 20190273068 - Chen; Meng-Tse ; et al. | 2019-09-05 |
| Display Substrate And Display Device App 20190265568 - CHEN; Hung-Kun ; et al. | 2019-08-29 |
| Display Device App 20190261512 - HUANG; Hui-Min ; et al. | 2019-08-22 |
| Package-on-package Structure Having Polymer-based Material For Warpage Control App 20190221544 - Chen; Meng-Tse ; et al. | 2019-07-18 |
| Display device and display substrate Grant 10,324,345 - Chen , et al. | 2019-06-18 |
| 3D package structure and methods of forming same Grant 10,276,541 - Chen , et al. | 2019-04-30 |
| Package-on-package structure having polymer-based material for warpage control Grant 10,269,763 - Chen , et al. | 2019-04-23 |
| Liquid-crystal Antenna Device And Manufacturing Method Of The Same App 20190051979 - LIN; Yi-Hung ; et al. | 2019-02-14 |
| Bump-on-trace packaging structure and method for forming the same Grant 10,192,804 - Chen , et al. Ja | 2019-01-29 |
| Molding structure for wafer level package Grant 10,163,804 - Yu , et al. Dec | 2018-12-25 |
| Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices App 20180342482 - Yu; Chen-Hua ; et al. | 2018-11-29 |
| Bump-on-trace Packaging Structure And Method For Forming The Same App 20180337106 - Chen; Meng-Tse ; et al. | 2018-11-22 |
| Semiconductor Package System and Method App 20180331055 - Huang; Hui-Min ; et al. | 2018-11-15 |
| Display device Grant 10,128,275 - Chen , et al. November 13, 2 | 2018-11-13 |
| Method Of Packaging A Semiconductor Die App 20180286787 - HUANG; Hui-Min ; et al. | 2018-10-04 |
| Chip Package With Fan-out Structure App 20180233382 - CHEN; Shing-Chao ; et al. | 2018-08-16 |
| Methods of packaging semiconductor devices and packaged semiconductor devices Grant 10,043,778 - Yu , et al. August 7, 2 | 2018-08-07 |
| Semiconductor package system and method Grant 10,032,734 - Huang , et al. July 24, 2 | 2018-07-24 |
| Operating Voltage Switching Device App 20180196458 - LIN; Chih-Cheng ; et al. | 2018-07-12 |
| Wafer-level molding chase design Grant 10,020,211 - Yu , et al. July 10, 2 | 2018-07-10 |
| Molding Structure For Wafer Level Package App 20180158780 - Yu; Chen-Hua ; et al. | 2018-06-07 |
| Packaging with interposer frame Grant 9,991,190 - Huang , et al. June 5, 2 | 2018-06-05 |
| Detection Circuit for Power over Ethernet and Detection Current Generation Method Thereof App 20180143225 - LIU; KAI-YIN ; et al. | 2018-05-24 |
| Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices App 20180138147 - Yu; Chen-Hua ; et al. | 2018-05-17 |
| Resistance Calibration Circuit And Device App 20180138895 - LIU; KAI-YIN ; et al. | 2018-05-17 |
| Display Device App 20180122303 - TSAI; Yi-Cheng ; et al. | 2018-05-03 |
| Display Device App 20180122329 - CHEN; Cheng-Tso ; et al. | 2018-05-03 |
| Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices App 20180108637 - Yu; Chen-Hua ; et al. | 2018-04-19 |
| Structure and formation method of chip package with fan-out structure Grant 9,947,552 - Chen , et al. April 17, 2 | 2018-04-17 |
| Apparatus for charged particle lithography system Grant 9,911,575 - Wang , et al. March 6, 2 | 2018-03-06 |
| Wafer level chip scale package interconnects and methods of manufacture thereof Grant 9,892,962 - Wu , et al. February 13, 2 | 2018-02-13 |
| Molding structure for wafer level package Grant 9,887,162 - Yu , et al. February 6, 2 | 2018-02-06 |
| Package-on-Package Structure App 20180019151 - Lin; Chih-Wei ; et al. | 2018-01-18 |
| Packaged semiconductor devices and methods of packaging semiconductor devices Grant 9,871,018 - Yu , et al. January 16, 2 | 2018-01-16 |
| Methods of packaging semiconductor devices and packaged semiconductor devices Grant 9,847,317 - Yu , et al. December 19, 2 | 2017-12-19 |
| Structure And Formation Method Of Chip Package With Fan-out Structure App 20170316957 - CHEN; Shing-Chao ; et al. | 2017-11-02 |
| Package on-package structure Grant 9,768,048 - Lin , et al. September 19, 2 | 2017-09-19 |
| Display device Grant 9,750,140 - Chen , et al. August 29, 2 | 2017-08-29 |
| Display Device App 20170229484 - CHEN; Hung-Kun ; et al. | 2017-08-10 |
| Package-on-package Structure Having Polymer-based Material For Warpage Control App 20170194289 - Chen; Meng-Tse ; et al. | 2017-07-06 |
| Wafer Level Chip Scale Package Interconnects and Methods of Manufacture Thereof App 20170154811 - Wu; Cheng-Tar ; et al. | 2017-06-01 |
| Display device Grant 9,659,973 - Chen , et al. May 23, 2 | 2017-05-23 |
| Display panel and display device Grant 9,653,482 - Huang , et al. May 16, 2 | 2017-05-16 |
| Display device Grant 9,632,375 - Chen , et al. April 25, 2 | 2017-04-25 |
| Bonding pad surface damage reduction in a formation of digital pattern generator Grant 9,633,958 - Lu , et al. April 25, 2 | 2017-04-25 |
| Package-on-package structure having polymer-based material for warpage control Grant 9,627,355 - Chen , et al. April 18, 2 | 2017-04-18 |
| Method and apparatus for localized and controlled removal of material from a substrate Grant 9,627,234 - Huang , et al. April 18, 2 | 2017-04-18 |
| Method and apparatus for adjusting wafer warpage Grant 9,576,830 - Huang , et al. February 21, 2 | 2017-02-21 |
| Methods of packaging and dicing semiconductor devices and structures thereof Grant 9,559,005 - Tsai , et al. January 31, 2 | 2017-01-31 |
| Display Device And Display Substrate App 20170023840 - CHEN; Hung-Kun ; et al. | 2017-01-26 |
| Semiconductor Package System and Method App 20170005049 - Huang; Hui-Min ; et al. | 2017-01-05 |
| 3d Package Structure And Methods Of Forming Same App 20170005074 - Chen; Meng-Tse ; et al. | 2017-01-05 |
| Display Panel And Touch Display Device Comprising The Same App 20160370632 - HUANG; Hui-Min ; et al. | 2016-12-22 |
| Integrated fan-out structure and method Grant 9,524,956 - Pei , et al. December 20, 2 | 2016-12-20 |
| Stacked dies with wire bonds and method Grant 9,508,703 - Yu , et al. November 29, 2 | 2016-11-29 |
| Apparatus for Charged Particle Lithography System App 20160322199 - WANG; SHIH-CHI ; et al. | 2016-11-03 |
| Interconnect structures for wafer level package and methods of forming same Grant 9,484,285 - Chen , et al. November 1, 2 | 2016-11-01 |
| Semiconductor package system and method Grant 9,449,908 - Huang , et al. September 20, 2 | 2016-09-20 |
| Display Panel And Display Device App 20160260745 - HUANG; Hui-Min ; et al. | 2016-09-08 |
| Package-on-package Structure Having Polymer-based Material For Warpage Control App 20160247782 - Chen; Meng-Tse ; et al. | 2016-08-25 |
| Bonding Pad Surface Damage Reduction in a Formation of Digital Pattern Generator App 20160225612 - Lu; Chih Wei ; et al. | 2016-08-04 |
| Apparatus for charged particle lithography system Grant 9,390,891 - Wang , et al. July 12, 2 | 2016-07-12 |
| Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices App 20160190096 - Yu; Chen-Hua ; et al. | 2016-06-30 |
| Semiconductor device and fabricating method thereof Grant 9,373,508 - Yeh , et al. June 21, 2 | 2016-06-21 |
| Package-on-package structure having polymer-based material for warpage control Grant 9,349,663 - Chen , et al. May 24, 2 | 2016-05-24 |
| Integrated Fan-Out Structure and Method App 20160126226 - Pei; Hao-Jan ; et al. | 2016-05-05 |
| Packaged semiconductor devices and methods of packaging semiconductor devices Grant 9,299,688 - Yu , et al. March 29, 2 | 2016-03-29 |
| Interconnect Structures for Wafer Level Package and Methods of Forming Same App 20160056056 - Chen; Meng-Tse ; et al. | 2016-02-25 |
| Apparatus for Charged Particle Lithography System App 20160049278 - Wang; Shih-Chi ; et al. | 2016-02-18 |
| Semiconductor Package System and Method App 20160035663 - Huang; Hui-Min ; et al. | 2016-02-04 |
| Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices App 20160013152 - Yu; Chen-Hua ; et al. | 2016-01-14 |
| Wafer-level Molding Chase Design App 20150364456 - Yu; Chen-Hua ; et al. | 2015-12-17 |
| Stacked Dies With Wire Bonds and Method App 20150318264 - Yu; Chen-Hua ; et al. | 2015-11-05 |
| Display Device App 20150301396 - SUNG; Li-Wei ; et al. | 2015-10-22 |
| Display Device App 20150264805 - CHEN; Hung-Kun ; et al. | 2015-09-17 |
| Display Device App 20150263043 - CHEN; Hung-Kun ; et al. | 2015-09-17 |
| Display Device App 20150262536 - CHEN; Hung-Kun ; et al. | 2015-09-17 |
| Display device Grant 9,097,924 - Sung , et al. August 4, 2 | 2015-08-04 |
| Methods of Packaging and Dicing Semiconductor Devices and Structures Thereof App 20150214077 - Tsai; Yu-Peng ; et al. | 2015-07-30 |
| Molding Structure for Wafer Level Package App 20150171055 - Yu; Chen-Hua ; et al. | 2015-06-18 |
| Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices App 20150162316 - Yu; Chen-Hua ; et al. | 2015-06-11 |
| Touch Integrated Panel, Electronic Device, and Method of Manufacturing Touch Integrated panel App 20150042901 - HUANG; Hui-Min ; et al. | 2015-02-12 |
| Fabrication method of semiconductor package Grant 8,895,367 - Huang , et al. November 25, 2 | 2014-11-25 |
| Method and Apparatus for Localized and Controlled Removal of Material from a Substrate App 20140273499 - Huang; Hui-Min ; et al. | 2014-09-18 |
| Package-on-Package Structure App 20140264840 - Lin; Chih-Wei ; et al. | 2014-09-18 |
| Display Device App 20140078428 - SUNG; Li-Wei ; et al. | 2014-03-20 |
| Semiconductor Device And Fabricating Method Thereof App 20140035049 - YEH; Ta-Hsun ; et al. | 2014-02-06 |
| Method and apparatus for reducing package warpage Grant 8,642,445 - Chen , et al. February 4, 2 | 2014-02-04 |
| Bump-on-trace Packaging Structure And Method For Forming The Same App 20140008786 - Chen; Meng-Tse ; et al. | 2014-01-09 |
| Package-on-package Structure Having Polymer-based Material For Warpage Control App 20140001652 - CHEN; Meng-Tse ; et al. | 2014-01-02 |
| Fabrication Method Of Semiconductor Package App 20130330883 - Huang; Jung-Pang ; et al. | 2013-12-12 |
| Semiconductor device and fabrication method thereof Grant 8,603,911 - Huang , et al. December 10, 2 | 2013-12-10 |
| Method And Apparatus For Adjusting Wafer Warpage App 20130309621 - HUANG; Hui-Min ; et al. | 2013-11-21 |
| Packaging With Interposer Frame App 20130307140 - HUANG; Hui-Min ; et al. | 2013-11-21 |
| Device of phase locked-loop and the method using the same Grant 8,564,343 - Huang October 22, 2 | 2013-10-22 |
| Method And Apparatus For Reducing Package Warpage App 20130260535 - CHEN; Meng-Tse ; et al. | 2013-10-03 |
| Semiconductor package and fabrication method thereof Grant 8,519,526 - Huang , et al. August 27, 2 | 2013-08-27 |
| Device Of Phase Locked-loop And The Method Using The Same App 20120235719 - HUANG; Hui-Min | 2012-09-20 |
| Semiconductor Device And Fabrication Method Thereof App 20120223425 - Huang; Hui-Min ; et al. | 2012-09-06 |
| Semiconductor Package And Fabrication Method Thereof App 20120161301 - Huang; Jung-Pang ; et al. | 2012-06-28 |
| Method for fabricating semiconductor package App 20120129315 - Hu; Yeh-Chang ; et al. | 2012-05-24 |
| Door assembly and method for a vehicle Grant 8,033,592 - Hsu , et al. October 11, 2 | 2011-10-11 |
| Door Assembly and Method for a Vehicle App 20100052360 - Hsu; Chih-Cheng ; et al. | 2010-03-04 |
| Polymer thick film resistor pastes Grant 6,030,553 - Huang , et al. February 29, 2 | 2000-02-29 |
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