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name:-0.0057740211486816
name:-0.00096988677978516
Huang; Huei Pin Patent Filings

Huang; Huei Pin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Huang; Huei Pin.The latest application filed is for "illuminating membrane switch and illuminating keypad using the same".

Company Profile
0.4.10
  • Huang; Huei Pin - Taoyuan TW
  • Huang; Huei-Pin - Yangmei Township TW
  • Huang, Huei-Pin - Hsinchu TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Double-shielded electroluminescent panel
Grant 7,816,864 - Liang , et al. October 19, 2
2010-10-19
Illuminating Membrane Switch and Illuminating Keypad Using the Same
App 20080135392 - Huang; Huei-Pin ;   et al.
2008-06-12
Illuminating membrane switch and illuminating keypad using the same
App 20060283698 - Huang; Huei-Pin ;   et al.
2006-12-21
Double-shielded electroluminescent panel
App 20050275347 - Liang, Chih Ping ;   et al.
2005-12-15
Optical switch apparatus
Grant 6,904,194 - Chang , et al. June 7, 2
2005-06-07
Device for stripping coated optical fiber ribbons
Grant 6,823,761 - Chiang , et al. November 30, 2
2004-11-30
Method and apparatus for fiber array module
Grant 6,782,183 - Chiang , et al. August 24, 2
2004-08-24
Gigabit interface converter housing
App 20040082206 - Chang, Chia-Hsiung ;   et al.
2004-04-29
Device for stripping coated optical fiber ribbons
App 20040055161 - Chiang, Chung-I ;   et al.
2004-03-25
Optical switch apparatus
App 20030198430 - Chang, Chia-Hsiung ;   et al.
2003-10-23
Fiber array module fabrication method and apparatus therefor
App 20030198454 - Chiang, Chung-I ;   et al.
2003-10-23
Fiber array module and method for fabricating the same
App 20030194197 - Chiang, Chung-I ;   et al.
2003-10-16
Fiber array base block for fiber array module and method for fixing optical fibers to the fiber array base block
App 20030194196 - Chiang, Chung-I ;   et al.
2003-10-16
Method for forming soldering layer of fiber arrays
App 20030194494 - Chiang, Chung-I ;   et al.
2003-10-16

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