Huang; Huang-Ta
Patent Applications and Registrations
Patent applications and USPTO patent grants for Huang; Huang-Ta.The latest application filed is for "bonding pad structure with dense via array".
- Huang; Huang-Ta - Tainan TW
- HUANG; Huang-Ta - Tainan City TW
- Huang; Huang-Ta - Itan TW
| Patent | Date |
|---|---|
| Bonding pad structure with dense via array Grant 9,711,468 - Tsai , et al. July 18, 2 | 2017-07-18 |
| Bonding Pad Structure With Dense Via Array App 20150214165 - TSAI; Tsung-Han ; et al. | 2015-07-30 |
| Bonding pad structure with dense via array Grant 9,041,204 - Tsai , et al. May 26, 2 | 2015-05-26 |
| Bonding Pad On A Back Side Illuminated Image Sensor App 20140225215 - CHIEN; VOLUME ; et al. | 2014-08-14 |
| Bonding Pad Structure With Dense Via Array App 20130256893 - TSAI; Tsung-Han ; et al. | 2013-10-03 |
| Devices for controlling electron emission in plasma flood system Grant 6,822,395 - Li , et al. November 23, 2 | 2004-11-23 |
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