| Patent | Date |
|---|
Integrated Fan-out Package
App 20220278050 - Chiu; Ming-Yen ; et al. | 2022-09-01 |
Fin Field-Effect Transistor Device and Method
App 20220262926 - Chang; Che-Lun ; et al. | 2022-08-18 |
Package with Tilted Interface Between Device Die and Encapsulating Material
App 20220238404 - Chiu; Ming-Yen ; et al. | 2022-07-28 |
CMP process and methods thereof
Grant 11,387,109 - Chang , et al. July 12, 2 | 2022-07-12 |
Integrated fan-out package
Grant 11,362,037 - Chiu , et al. June 14, 2 | 2022-06-14 |
Package with tilted interface between device die and encapsulating material
Grant 11,322,419 - Chiu , et al. May 3, 2 | 2022-05-03 |
Fin field-effect transistor device and method
Grant 11,316,030 - Chang , et al. April 26, 2 | 2022-04-26 |
Integrated fan-out package and method of fabricating the same
Grant 11,282,796 - Chiu , et al. March 22, 2 | 2022-03-22 |
High dielectric constant dielectric layer forming method, image sensor device, and manufacturing method thereof
Grant 11,195,867 - Tsai , et al. December 7, 2 | 2021-12-07 |
Semiconductor Structure
App 20210335708 - CHENG; HSI-KUEI ; et al. | 2021-10-28 |
Optical lens structure
Grant 11,143,382 - Huang , et al. October 12, 2 | 2021-10-12 |
Semiconductor Device and Method of Forming the Same
App 20210288151 - Chang; Chia-Ming ; et al. | 2021-09-16 |
Fin Field-effect Transistor Device And Method
App 20210257479 - Chang; Che-Lun ; et al. | 2021-08-19 |
Ionic Liquid Electrolyte
App 20210238132 - Teng; Hsisheng ; et al. | 2021-08-05 |
Semiconductor package structure
Grant 11,069,614 - Cheng , et al. July 20, 2 | 2021-07-20 |
Info Structure with Copper Pillar Having Reversed Profile
App 20210202290 - Cheng; Hsi-Kuei ; et al. | 2021-07-01 |
Semiconductor device and method of forming the same
Grant 11,024,718 - Chang , et al. June 1, 2 | 2021-06-01 |
Ether-bridged dication, ionic liquid electrolyte and charge storage device thereof
Grant 11,014,877 - Teng , et al. May 25, 2 | 2021-05-25 |
FinFET with sloped surface at interface between isolation structures and manufacturing method thereof
Grant 10,998,235 - Li , et al. May 4, 2 | 2021-05-04 |
Package Structure With Bump
App 20210118804 - CHIU; Ming-Yen ; et al. | 2021-04-22 |
Optical Lens Structure
App 20210108780 - HUANG; Hsin-Chieh ; et al. | 2021-04-15 |
Package Structure and Method of Forming the Same
App 20210098434 - Cheng; Hsi-Kuei ; et al. | 2021-04-01 |
Semiconductor device and manufacturing method thereof
Grant 10,964,801 - Li , et al. March 30, 2 | 2021-03-30 |
Info structure with copper pillar having reversed profile
Grant 10,950,478 - Cheng , et al. March 16, 2 | 2021-03-16 |
Package structure with bump
Grant 10,879,185 - Chiu , et al. December 29, 2 | 2020-12-29 |
Package structure and method of forming the same
Grant 10,867,973 - Cheng , et al. December 15, 2 | 2020-12-15 |
Integrated Fan-out Package And Method Of Fabricating The Same
App 20200388574 - Chiu; Ming-Yen ; et al. | 2020-12-10 |
Integrated Fan-out Package
App 20200373245 - Chiu; Ming-Yen ; et al. | 2020-11-26 |
Package with Tilted Interface Between Device Die and Encapsulating Material
App 20200365479 - Chiu; Ming-Yen ; et al. | 2020-11-19 |
High Dielectric Constant Dielectric Layer Forming Method, Image Sensor Device, And Manufacturing Method Thereof
App 20200343279 - Tsai; Tsung-Han ; et al. | 2020-10-29 |
Finfet With Sloped Surface At Interface Between Isolation Structures And Manufacturing Method Thereof
App 20200343141 - Li; Chih-Sheng ; et al. | 2020-10-29 |
Integrated fan-out package and method of fabricating the same
Grant 10,790,235 - Chiu , et al. September 29, 2 | 2020-09-29 |
Integrated fan-out package
Grant 10,770,402 - Chiu , et al. Sep | 2020-09-08 |
Semiconductor Structure
App 20200273795 - CHENG; HSI-KUEI ; et al. | 2020-08-27 |
Package with tilted interface between device die and encapsulating material
Grant 10,734,299 - Chiu , et al. | 2020-08-04 |
FinFET with sloped surface at interface between isolation structures and manufacturing method thereof
Grant 10,727,135 - Li , et al. | 2020-07-28 |
High dielectric constant dielectric layer forming method, image sensor device, and manufacturing method thereof
Grant 10,720,460 - Tsai , et al. | 2020-07-21 |
Manufacturing method for semiconductor structure
Grant 10,692,809 - Cheng , et al. | 2020-06-23 |
Package Structure With Bump
App 20200135651 - CHIU; Ming-Yen ; et al. | 2020-04-30 |
High dielectric constant dielectric layer forming method, image sensor device, and manufacturing method thereof
Grant 10,636,824 - Tsai , et al. | 2020-04-28 |
High Dielectric Constant Dielectric Layer Forming Method, Image Sensor Device, and Manufacturing Method Thereof
App 20200127024 - Tsai; Tsung-Han ; et al. | 2020-04-23 |
Ether-bridged Dication, Ionic Liquid Electrolyte And Charge Storage Device Thereof
App 20200048190 - TENG; Hsisheng ; et al. | 2020-02-13 |
Semiconductor Device And Manufacturing Method Thereof
App 20200035564 - Li; Chih-Sheng ; et al. | 2020-01-30 |
Semiconductor Device and Manufacturing Method Thereof
App 20200027963 - Li; Chih-Sheng ; et al. | 2020-01-23 |
Package structure and method of forming the same
Grant 10,529,697 - Cheng , et al. J | 2020-01-07 |
Semiconductor Device and Method of Forming the Same
App 20200006498 - Chang; Chia-Ming ; et al. | 2020-01-02 |
Package structure with bump
Grant 10,515,899 - Chiu , et al. Dec | 2019-12-24 |
FinFET with sloped surface at interface between isolation structures
Grant 10,504,787 - Li , et al. Dec | 2019-12-10 |
Semiconductor device and method of forming the same
Grant 10,505,001 - Chang , et al. Dec | 2019-12-10 |
Semiconductor device and manufacturing method thereof
Grant 10,468,504 - Li , et al. No | 2019-11-05 |
Info Structure with Copper Pillar Having Reversed Profile
App 20190267274 - Cheng; Hsi-Kuei ; et al. | 2019-08-29 |
Integrated Fan-out Package
App 20190252323 - Chiu; Ming-Yen ; et al. | 2019-08-15 |
FinFET device and fabricating method thereof
Grant 10,326,006 - Peng , et al. | 2019-06-18 |
FinFET Device and Fabricating Method Thereof
App 20190148523 - Peng; Yen-Ming ; et al. | 2019-05-16 |
Info structure with copper pillar having reversed profile
Grant 10,290,530 - Cheng , et al. | 2019-05-14 |
Semiconductor Device and Manufacturing Method Thereof
App 20190140070 - Li; Chih-Sheng ; et al. | 2019-05-09 |
Integrated Fan-out Package And Method Of Fabricating The Same
App 20190131243 - Chiu; Ming-Yen ; et al. | 2019-05-02 |
Semiconductor Device And Manufacturing Method Thereof
App 20190131178 - Li; Chih-Sheng ; et al. | 2019-05-02 |
Integrated fan-out package
Grant 10,276,506 - Chiu , et al. | 2019-04-30 |
Package with Tilted Interface Between Device Die and Encapsulating Material
App 20190122948 - Chiu; Ming-Yen ; et al. | 2019-04-25 |
Luminous system
Grant 10,247,392 - Huang , et al. | 2019-04-02 |
Optical lens assembly and illumination device comprising the same
Grant 10,240,755 - Huang , et al. | 2019-03-26 |
Semiconductor Structure And Manufacturing Method Thereof
App 20190074248 - CHENG; HSI-KUEI ; et al. | 2019-03-07 |
High dielectric constant dielectric layer forming method, image sensor device, and manufacturing method thereof
Grant 10,177,185 - Tsai , et al. J | 2019-01-08 |
Integrated fan-out package and method of fabricating the same
Grant 10,170,430 - Chiu , et al. J | 2019-01-01 |
Semiconductor device and manufacturing method thereof
Grant 10,164,072 - Li , et al. Dec | 2018-12-25 |
Method of forming FinFET device by adjusting etch selectivity of dielectric layer
Grant 10,163,717 - Li , et al. Dec | 2018-12-25 |
Package with tilted interface between device die and encapsulating material
Grant 10,163,745 - Chiu , et al. Dec | 2018-12-25 |
FinFET device and fabricating method thereof
Grant 10,164,071 - Peng , et al. Dec | 2018-12-25 |
FinFET device and fabricating method thereof
Grant 10,164,059 - Peng , et al. Dec | 2018-12-25 |
Variable focus lighting fixture
Grant 10,151,452 - Huang , et al. Dec | 2018-12-11 |
Package Structure and Method of Forming the Same
App 20180350784 - Cheng; Hsi-Kuei ; et al. | 2018-12-06 |
FinFET Device and Fabricating Method Thereof
App 20180337267 - Peng; Yen-Ming ; et al. | 2018-11-22 |
Semiconductor package structure and manufacturing method thereof
Grant 10,128,182 - Cheng , et al. November 13, 2 | 2018-11-13 |
Semiconductor structure and fabricating method thereof
Grant 10,115,686 - Huang , et al. October 30, 2 | 2018-10-30 |
Integrated fan-out package and method of fabricating the same
Grant 10,109,589 - Chiu , et al. October 23, 2 | 2018-10-23 |
Power transistor die
Grant 10,083,921 - Lin , et al. September 25, 2 | 2018-09-25 |
Illumination device with optical units including spiral structure optical unit and illumination device having the same
Grant 10,077,883 - Huang , et al. September 18, 2 | 2018-09-18 |
Semiconductor device and method of forming the same
Grant 10,050,148 - Chang , et al. August 14, 2 | 2018-08-14 |
Integrated fan-out package and method of fabricating the same
Grant 10,037,961 - Chiu , et al. July 31, 2 | 2018-07-31 |
Semiconductor device and method of forming the same
Grant 10,032,873 - Chang , et al. July 24, 2 | 2018-07-24 |
Package with Tilted Interface between Device Die and Encapsulating Material
App 20180204780 - Chiu; Ming-Yen ; et al. | 2018-07-19 |
Device for measuring solution concentration
Grant 10,025,077 - Huang , et al. July 17, 2 | 2018-07-17 |
Semiconductor Device and Manufacturing Method Thereof
App 20180182673 - Li; Chih-Sheng ; et al. | 2018-06-28 |
Info Structure with Copper Pillar Having Reversed Profile
App 20180174937 - Cheng; Hsi-Kuei ; et al. | 2018-06-21 |
Semiconductor Device and Method of Forming the Same
App 20180108742 - Chang; Chia-Ming ; et al. | 2018-04-19 |
Conductive pattern and integrated fan-out package having the same
Grant 9,941,216 - Chiu , et al. April 10, 2 | 2018-04-10 |
Integrated Fan-out Package And Method Of Fabricating The Same
App 20180096942 - Chiu; Ming-Yen ; et al. | 2018-04-05 |
Package Structure With Bump
App 20180096939 - CHIU; Ming-Yen ; et al. | 2018-04-05 |
Integrated Fan-out Package And Method Of Fabricating The Same
App 20180096943 - Chiu; Ming-Yen ; et al. | 2018-04-05 |
Integrated biosensor
Grant 9,933,388 - Cheng , et al. April 3, 2 | 2018-04-03 |
Info Structure With Copper Pillar Having Reversed Profile
App 20180082917 - Cheng; Hsi-Kuei ; et al. | 2018-03-22 |
Package Structure And Method Of Forming The Same
App 20180082988 - Cheng; Hsi-Kuei ; et al. | 2018-03-22 |
Variable Focus Lighting Fixture
App 20180080634 - HUANG; Hsin-Chieh ; et al. | 2018-03-22 |
Package with tilted interface between device die and encapsulating material
Grant 9,922,895 - Chiu , et al. March 20, 2 | 2018-03-20 |
Info structure with copper pillar having reversed profile
Grant 9,922,896 - Cheng , et al. March 20, 2 | 2018-03-20 |
Semiconductor Structure And Manufacturing Method Thereof
App 20180076129 - CHENG; HSI-KUEI ; et al. | 2018-03-15 |
Ether-bridged Dication, Ionic Liquid Electrolyte And Charge Storage Device Thereof
App 20180075981 - TENG; Hsisheng ; et al. | 2018-03-15 |
Device For Measuring Solution Concentration
App 20180067288 - HUANG; HSIN-CHIEH ; et al. | 2018-03-08 |
Optical Lens Assembly And Illumination Device Comprising The Same
App 20180058666 - HUANG; HSIN-CHIEH ; et al. | 2018-03-01 |
Semiconductor device and manufacturing method thereof
Grant 9,905,467 - Li , et al. February 27, 2 | 2018-02-27 |
Integrated Fan-out Package
App 20180025986 - Chiu; Ming-Yen ; et al. | 2018-01-25 |
Integrated fan-out package and method of fabricating the same
Grant 9,837,359 - Chiu , et al. December 5, 2 | 2017-12-05 |
Conductive Pattern And Integrated Fan-out Package Having The Same
App 20170345762 - Chiu; Ming-Yen ; et al. | 2017-11-30 |
Integrated Fan-out Package And Method Of Fabricating The Same
App 20170338196 - Chiu; Ming-Yen ; et al. | 2017-11-23 |
Semiconductor Device and Manufacturing Method Thereof
App 20170330959 - Li; Chih-Sheng ; et al. | 2017-11-16 |
Package with Tilted Interface between Device Die and Encapsulating Material
App 20170323840 - Chiu; Ming-Yen ; et al. | 2017-11-09 |
Dicing Techniques For Power Transistors
App 20170294391 - Lin; Yu-Syuan ; et al. | 2017-10-12 |
Semiconductor Structure And Fabricating Method Thereof
App 20170278809 - HUANG; WEI-LI ; et al. | 2017-09-28 |
Semiconductor Device and Method of Forming the Same
App 20170243976 - Chang; Chia-Ming ; et al. | 2017-08-24 |
Semiconductor device and manufacturing method thereof
Grant 9,722,050 - Li , et al. August 1, 2 | 2017-08-01 |
Dicing method for power transistors
Grant 9,711,463 - Lin , et al. July 18, 2 | 2017-07-18 |
Semiconductor device and method of forming the same
Grant 9,647,122 - Chang , et al. May 9, 2 | 2017-05-09 |
Semiconductor Device And Method Of Forming The Same
App 20170077244 - CHANG; Chia-Ming ; et al. | 2017-03-16 |
Semiconductor Device And Method Of Forming The Same
App 20170077305 - CHANG; Chia-Ming ; et al. | 2017-03-16 |
Finfet Device And Fabricating Method Thereof
App 20170069757 - Peng; Yen-Ming ; et al. | 2017-03-09 |
Semiconductor Device And Manufacturing Method Thereof
App 20170069504 - LI; Chih-Sheng ; et al. | 2017-03-09 |
Semiconductor Device And Manufacturing Method Thereof
App 20170069539 - LI; Chih-Sheng ; et al. | 2017-03-09 |
Integrated Biosensor
App 20170016851 - Cheng; Chun-Wen ; et al. | 2017-01-19 |
Luminous System
App 20170002997 - HUANG; HSIN-CHIEH ; et al. | 2017-01-05 |
High Dielectric Constant Dielectric Layer Forming Method, Image Sensor Device, And Manufacturing Method Thereof
App 20160329364 - TSAI; Tsung-Han ; et al. | 2016-11-10 |
Lens
Grant D771,172 - Huang , et al. November 8, 2 | 2016-11-08 |
Biosensor with a sensing surface on an interlayer dielectric
Grant 9,488,615 - Cheng , et al. November 8, 2 | 2016-11-08 |
Light-emitting devices on textured substrates
Grant 9,461,204 - Huang October 4, 2 | 2016-10-04 |
Illumination Device And Optical Component Thereof
App 20160265745 - Huang; Hsin-Chieh ; et al. | 2016-09-15 |
Dicing Method For Power Transistors
App 20160204074 - Lin; Yu-Syuan ; et al. | 2016-07-14 |
Integrated Biosensor
App 20160178568 - Cheng; Chun-Wen ; et al. | 2016-06-23 |
Audio amplifier apparatus
Grant 9,257,942 - Chen , et al. February 9, 2 | 2016-02-09 |
Light emitting devices with textured active layer
Grant 9,153,739 - Huang October 6, 2 | 2015-10-06 |
Light color and intensity adjustable LED
Grant 9,125,272 - Huang September 1, 2 | 2015-09-01 |
Light-emitting Devices With Through-substrate Via Connections
App 20150243848 - Huang; Hsin-Chieh | 2015-08-27 |
Light-emitting Devices On Textured Substrates
App 20150187992 - Huang; Hsin-Chieh | 2015-07-02 |
Pre-cutting A Back Side Of A Silicon Substrate For Growing Better Iii-v Group Compound Layer On A Front Side Of The Substrate
App 20150171266 - Li; Zhen-Yu ; et al. | 2015-06-18 |
Single phosphor layer photonic device for generating white light or color lights
Grant 9,029,175 - Huang , et al. May 12, 2 | 2015-05-12 |
Pre-cutting a back side of a silicon substrate for growing better III-V group compound layer on a front side of the substrate
Grant 8,981,534 - Li , et al. March 17, 2 | 2015-03-17 |
Light-emitting devices on textured substrates
Grant 8,981,397 - Huang March 17, 2 | 2015-03-17 |
Light Color And Intensity Adjustable Led
App 20150054412 - Huang; Hsin-Chieh | 2015-02-26 |
Light color and intensity adjustable LED
Grant 8,884,529 - Huang November 11, 2 | 2014-11-11 |
Method And System For Adjusting Light Output From A Light Source
App 20140319318 - Huang; Hsin-Chieh | 2014-10-30 |
Method and system for adjusting light output from a light source
Grant 8,786,197 - Huang July 22, 2 | 2014-07-22 |
Light Emitting Devices with Textured Active Layer
App 20140191191 - Huang; Hsin-Chieh | 2014-07-10 |
Pre-Cutting a Back Side of a Silicon Substrate for Growing Better III-V Group Compound Layer on a Front Side of the Substrate
App 20140077224 - Li; Zhen-Yu ; et al. | 2014-03-20 |
Light-emitting devices with textured active layer
Grant 8,673,666 - Huang March 18, 2 | 2014-03-18 |
Single Phosphor Layer Photonic Device for Generating White Light or Color Lights
App 20140065740 - Huang; Hsin-Chieh ; et al. | 2014-03-06 |
Light Color and Intensity Adjustable LED
App 20140055039 - Huang; Hsin-Chieh | 2014-02-27 |
Light color and intensity adjustable LED
Grant 8,624,505 - Huang January 7, 2 | 2014-01-07 |
Single phosphor layer photonic device for generating white light or color lights
Grant 8,604,498 - Huang , et al. December 10, 2 | 2013-12-10 |
Audio Amplifier Apparatus
App 20130259267 - Chen; Yi-Lung ; et al. | 2013-10-03 |
Optical element and illuminant device using the same
Grant 8,523,407 - Huang , et al. September 3, 2 | 2013-09-03 |
Radio communication transceiver
Grant 8,489,035 - Chiang , et al. July 16, 2 | 2013-07-16 |
Apparatus and method for wafer level classification of light emitting device
Grant 8,476,918 - Huang July 2, 2 | 2013-07-02 |
Circuit with three-stage of power-on sequence used for suppressing the pop noise in audio system
Grant 8,447,046 - Huang , et al. May 21, 2 | 2013-05-21 |
Radio communication transceiver
Grant 8,442,453 - Chiang , et al. May 14, 2 | 2013-05-14 |
Optical Element And Illuminant Device Using The Same
App 20130063962 - HUANG; Hsin-Chieh ; et al. | 2013-03-14 |
Light-Emitting Devices with Textured Active Layer
App 20130045556 - Huang; Hsin-Chieh | 2013-02-21 |
Method, computer readable storage medium and system for localizing acoustic source
Grant 8,363,848 - Huang , et al. January 29, 2 | 2013-01-29 |
Light-emitting devices with textured active layer
Grant 8,299,479 - Huang October 30, 2 | 2012-10-30 |
Circuit With Three-stage Of Power-on Sequence Used For Suppressing The Pop Noise In Audio System
App 20120183155 - HUANG; Hsin-Chieh ; et al. | 2012-07-19 |
Method And System For Adjusting Light Output From A Light Source
App 20120104954 - HUANG; Hsin-Chieh | 2012-05-03 |
Method And System For Adjusting Light Output From A Light Source
App 20120105402 - HUANG; Hsin-Chieh | 2012-05-03 |
Light Emitting Diode Module, Flat Panel Monitor Having The Light Emitting Diode Module, And Method Of Operating The Same
App 20120081616 - HUANG; Hsin-Chieh | 2012-04-05 |
Light Color And Intensity Adjustable Led
App 20110291564 - HUANG; Hsin-Chieh | 2011-12-01 |
Radio Communication Transceiver
App 20110281531 - Chiang; Ming Chou ; et al. | 2011-11-17 |
Radio Communication Transceiver
App 20110281527 - Chiang; Ming Chou ; et al. | 2011-11-17 |
Apparatus And Method For Wafer Level Classification Of Light Emitting Device
App 20110267087 - Huang; Hsin-Chieh | 2011-11-03 |
Single Phosphor Layer Photonic Device For Generating White Light Or Color Lights
App 20110233575 - HUANG; Hsin-Chieh ; et al. | 2011-09-29 |
Light-Emitting Devices with Textured Active Layer
App 20110220930 - Huang; Hsin-Chieh | 2011-09-15 |
Light-Emitting Devices with Through-Substrate Via Connections
App 20110198609 - Huang; Hsin-Chieh | 2011-08-18 |
Light-Emitting Devices on Textured Substrates
App 20110198637 - Huang; Hsin-Chieh | 2011-08-18 |
Liquid crystal panel having recesses for holding spacers
Grant 7,965,362 - Huang , et al. June 21, 2 | 2011-06-21 |
Method, Computer Readable Storage Medium And System For Localizing Acoustic Source
App 20110135102 - Huang; Hsin-Chieh ; et al. | 2011-06-09 |
Liquid crystal panel having concaves for holding spacers
App 20090002610 - Huang; Hsin-Chieh ; et al. | 2009-01-01 |
Micromirror and products using the same
Grant 7,095,544 - Yeh , et al. August 22, 2 | 2006-08-22 |
Optical lens and lens system
Grant 7,068,448 - Huang June 27, 2 | 2006-06-27 |
[optical Lens And Lens System]
App 20060018036 - Huang; Hsin-Chieh | 2006-01-26 |
Micromirror and products using the same
App 20040190108 - Yeh, Chih-Chieh ; et al. | 2004-09-30 |
Method For Coating A Thick Spin-on-glass Layer On A Semiconductor Structure
App 20040082194 - Wang, Wen-Yi ; et al. | 2004-04-29 |
Method for coating a thick spin-on-glass layer on a semiconductor structure
Grant 6,727,184 - Wang , et al. April 27, 2 | 2004-04-27 |
Container with magnifying identification lens
App 20030234208 - Huang, Hsin-Chieh | 2003-12-25 |
Semiconductor wafer transport pod equipped with cover latch indicator
Grant 6,653,944 - Huang , et al. November 25, 2 | 2003-11-25 |
Semiconductor wafer transport pod equipped with cover latch indicator
App 20030016137 - Huang, Hsin-Chieh ; et al. | 2003-01-23 |
Method of cleaning residue on a semiconductor wafer bonding pad
Grant 5,731,243 - Peng , et al. March 24, 1 | 1998-03-24 |
SOG coated apparatus to solve SOG non-uniformity in the VLSI process
Grant 5,454,871 - Liaw , et al. October 3, 1 | 1995-10-03 |
Method to prevent silicide bubble in the VLSI process
Grant 5,434,096 - Chu , et al. July 18, 1 | 1995-07-18 |
Method to solve sog non-uniformity in the VLSI process
Grant 5,371,046 - Liaw , et al. December 6, 1 | 1994-12-06 |
| 