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Patent applications and USPTO patent grants for Huang; Heh-Chang.The latest application filed is for "semiconductor package, integrated optical communication system".
Patent | Date |
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Semiconductor Package, Integrated Optical Communication System App 20210366802 - Huang; Sung-Hui ;   et al. | 2021-11-25 |
Integrated Circuit Package And Method Of Forming Same App 20210320097 - Hou; Shang-Yun ;   et al. | 2021-10-14 |
Method of forming a dummy die of an integrated circuit having an embedded annular structure Grant 11,101,260 - Hou , et al. August 24, 2 | 2021-08-24 |
Chip package structure with dummy bump and method for forming the same Grant 10,872,871 - Huang , et al. December 22, 2 | 2020-12-22 |
Chip Package Structure With Dummy Bump And Method For Forming The Same App 20200203299 - HUANG; Sung-Hui ;   et al. | 2020-06-25 |
Integrated Circuit Package And Method Of Forming Same App 20190237454 - Hou; Shang-Yun ;   et al. | 2019-08-01 |
Trace Structure Of Fine-pitch Pattern App 20160020166 - Hsieh; Yung-Wei ;   et al. | 2016-01-21 |
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