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Huang; Heh-Chang Patent Filings

Huang; Heh-Chang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Huang; Heh-Chang.The latest application filed is for "semiconductor package, integrated optical communication system".

Company Profile
3.2.5
  • Huang; Heh-Chang - Hsinchu City TW
  • Huang; Heh-Chang - Hsinchu TW
  • Huang; Heh-Chang - New Taipei City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor Package, Integrated Optical Communication System
App 20210366802 - Huang; Sung-Hui ;   et al.
2021-11-25
Integrated Circuit Package And Method Of Forming Same
App 20210320097 - Hou; Shang-Yun ;   et al.
2021-10-14
Method of forming a dummy die of an integrated circuit having an embedded annular structure
Grant 11,101,260 - Hou , et al. August 24, 2
2021-08-24
Chip package structure with dummy bump and method for forming the same
Grant 10,872,871 - Huang , et al. December 22, 2
2020-12-22
Chip Package Structure With Dummy Bump And Method For Forming The Same
App 20200203299 - HUANG; Sung-Hui ;   et al.
2020-06-25
Integrated Circuit Package And Method Of Forming Same
App 20190237454 - Hou; Shang-Yun ;   et al.
2019-08-01
Trace Structure Of Fine-pitch Pattern
App 20160020166 - Hsieh; Yung-Wei ;   et al.
2016-01-21

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