Huang; H. T.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Huang; H. T..The latest application filed is for "wafer level packaging bond".
- Huang; H. T. - Bade TW
- Huang; H. T. - Bade City TW
- Huang; H. T. - Su-Lin Taipei TW
- Huang; H. T. - Su-Lin Taipei TW
- Huang; H. T. - Taipei TW
- Huang; H. T. - San-Hsia Taipei TW
| Patent | Date |
|---|---|
| Wafer level packaging bond Grant 9,293,445 - Liu , et al. March 22, 2 | 2016-03-22 |
| Wafer Level Packaging Bond App 20140138853 - Liu; Martin ; et al. | 2014-05-22 |
| Wafer Level Packaging Bond App 20110233621 - Liu; Martin ; et al. | 2011-09-29 |
| Desk lamp Grant D382,362 - Huang August 12, 1 | 1997-08-12 |
| Self balanced desk-lamp Grant D353,683 - Huang December 20, 1 | 1994-12-20 |
| Desk lamp Grant D348,536 - Huang July 5, 1 | 1994-07-05 |
| Adjustable-lamp Grant D345,027 - Huang March 8, 1 | 1994-03-08 |
| Adjustable desk lamp Grant D337,843 - Huang July 27, 1 | 1993-07-27 |
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