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Patent applications and USPTO patent grants for Huang; Gil.The latest application filed is for "method to reduce ubm undercut".
Patent | Date |
---|---|
Method for forming solder bumps of increased height Grant 7,459,386 - Tseng , et al. December 2, 2 | 2008-12-02 |
Method to reduce UBM undercut Grant 7,456,090 - Chang , et al. November 25, 2 | 2008-11-25 |
Method to reduce UBM undercut App 20080157362 - Chang; Blenny ;   et al. | 2008-07-03 |
Cavity structure for semiconductor structures Grant 7,378,724 - Yu , et al. May 27, 2 | 2008-05-27 |
Cavity structure for semiconductor structures App 20060213804 - Yu; Hsiu-Mei ;   et al. | 2006-09-28 |
Method for forming solder bumps of increased height App 20060105560 - Tseng; Li-Hsin ;   et al. | 2006-05-18 |
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