Huang; Fu-Yu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Huang; Fu-Yu.The latest application filed is for "control system for air wave detecting and control method thereof".

Company Profile

1.5.14

Huang; Fu-Yu - Taipei TW
Huang; Fu-Yu - New Taipei City TW
Huang; Fu-Yu - Taipei City TW
Huang, Fu Yu - Kaohsiung City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
User device, base device and system utilizing audio signal to transmit data, and method thereof Grant 10,212,567 - Huang , et al. Feb	2019-02-19
Method and apparatus for transmitting digital contents Grant 9,661,442 - Huang , et al. May 23, 2	2017-05-23
Control System for Air Wave Detecting and Control Method Thereof App 20160309403 - Huang; Fu-Yu ; et al.	2016-10-20
Method And Apparatus For Transmitting Digital Contents App 20130108071 - Huang; Fu-Yu ; et al.	2013-05-02
User Device, Base Device and System Utilizing Audio Signal to Transmit Data, and Method Thereof App 20130110723 - Huang; Fu-Yu ; et al.	2013-05-02
Package structure for a multi-chip integrated circuit App 20040183179 - Shieh, Wen-Lo ; et al.	2004-09-23
Method of wire bonding of a semiconductor device for resolving oxidation of copper bonding pad App 20040082174 - Shieh, Wen-Lo ; et al.	2004-04-29
Fabrication method for solder bump pattern of rear section wafer package App 20040082159 - Shieh, Wen-Lo ; et al.	2004-04-29
Method of metal electro-plating for IC package substrate App 20030164303 - Huang, Fu-Yu ; et al.	2003-09-04
Open-type multichips stack packaging App 20030160316 - Shieh, Wen-Lo ; et al.	2003-08-28
Fabrication method of semiconductor App 20030059721 - Shieh, Wen-Lo ; et al.	2003-03-27
Semiconductor chip package with cooling arrangement App 20030035270 - Shieh, Wen-Lo ; et al.	2003-02-20
Method and device for making a metal bump with an increased height App 20030006268 - Shieh, Wen-Lo ; et al.	2003-01-09
Method and device for making a metal bump with an increased height Grant 6,499,648 - Shieh , et al. December 31, 2	2002-12-31
Method And Device For Making A Metal Bump With An Increased Height App 20020179686 - Shieh, Wen-Lo ; et al.	2002-12-05
Manufacturing method for multilayer high density substrate App 20020072216 - Shieh, Wen Lo ; et al.	2002-06-13
Method of forming bumps on wafers or substrates Grant 6,358,834 - Shieh , et al. March 19, 2	2002-03-19

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