loadpatents
Patent applications and USPTO patent grants for Huang; Fu-Ming.The latest application filed is for "post-cmp cleaning and apparatus".
Patent | Date |
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Ion implant process for defect elimination in metal layer planarization Grant 11,450,565 - Chen , et al. September 20, 2 | 2022-09-20 |
Post-CMP Cleaning and Apparatus App 20220262620 - Huang; Fu-Ming ;   et al. | 2022-08-18 |
Post-CMP cleaning and apparatus Grant 11,322,345 - Huang , et al. May 3, 2 | 2022-05-03 |
Methods For Chemical Mechanical Polishing And Forming Interconnect Structure App 20210391186 - Cui; Ji ;   et al. | 2021-12-16 |
Chemical Mechanical Polishing Slurry Composition, Method For Chemical Mechanical Polishing And Method For Forming Connecting Structure App 20210391208 - Cui; Ji ;   et al. | 2021-12-16 |
Slurry Composition And Method For Polishing And Integratged Circuit App 20210371702 - CUI; JI ;   et al. | 2021-12-02 |
Ion Implant Process For Defect Elimination In Metal Layer Planarization App 20210305092 - CHEN; Chia-Cheng ;   et al. | 2021-09-30 |
Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen App 20210220964 - Chang; Ting-Hsun ;   et al. | 2021-07-22 |
Chemical Mechanical Planarization Tool App 20210053180 - Yen; Michael ;   et al. | 2021-02-25 |
Post-CMP Cleaning and Apparatus App 20190244804 - Huang; Fu-Ming ;   et al. | 2019-08-08 |
Post-CMP cleaning and apparatus Grant 10,269,555 - Huang , et al. | 2019-04-23 |
Interconnect structure for semiconductor devices Grant 10,062,645 - Kuo , et al. August 28, 2 | 2018-08-28 |
Chemical mechanical polishing apparatus and method Grant 9,962,805 - Chang , et al. May 8, 2 | 2018-05-08 |
Chemical Mechanical Polishing Apparatus and Method App 20170304990 - Chang; Ting-Kui ;   et al. | 2017-10-26 |
Interconnect Structure for Semiconductor Devices App 20170278785 - Kuo; Han-Hsin ;   et al. | 2017-09-28 |
Brush cleaning method Grant 9,723,915 - Huang , et al. August 8, 2 | 2017-08-08 |
Interconnect structure for semiconductor devices Grant 9,679,848 - Kuo , et al. June 13, 2 | 2017-06-13 |
Mechanisms for removing debris from polishing pad Grant 9,630,295 - Peng , et al. April 25, 2 | 2017-04-25 |
Post-CMP Cleaning and Apparatus App 20170092481 - Huang; Fu-Ming ;   et al. | 2017-03-30 |
Interconnect Structure for Semiconductor Devices App 20170018496 - Kuo; Han-Hsin ;   et al. | 2017-01-19 |
Interconnect structure for semiconductor devices Grant 9,460,997 - Kuo , et al. October 4, 2 | 2016-10-04 |
Method of fabricating a semiconductor device, and chemical mechanical polish tool Grant 9,370,854 - Kuo , et al. June 21, 2 | 2016-06-21 |
Interconnects for semiconductor devices Grant 9,305,880 - Huang , et al. April 5, 2 | 2016-04-05 |
Reduction of OCD measurement noise by way of metal via slots Grant 9,252,060 - Tsai , et al. February 2, 2 | 2016-02-02 |
Brush Cleaning Method App 20150335146 - HUANG; Fu-Ming ;   et al. | 2015-11-26 |
Brush cleaning system Grant 9,119,464 - Huang , et al. September 1, 2 | 2015-09-01 |
Interconnect Structure for Semiconductor Devices App 20150187697 - Kuo; Han-Hsin ;   et al. | 2015-07-02 |
Method Of Fabricating A Semiconductor Device, And Chemical Mechanical Polish Tool App 20150132948 - Kuo; Han-Hsin ;   et al. | 2015-05-14 |
Interconnects For Semiconductor Devices App 20150115447 - HUANG; Fu-Ming ;   et al. | 2015-04-30 |
Apparatus And Method For Manufacturing A Semiconductor Wafer App 20150087208 - TSAI; CHI-MING ;   et al. | 2015-03-26 |
Mechanisms For Removing Debris From Polishing Pad App 20150024661 - PENG; He-Hui ;   et al. | 2015-01-22 |
Reduction Of Ocd Measurement Noise By Way Of Metal Via Slots App 20130256659 - Tsai; Chi-Ming ;   et al. | 2013-10-03 |
Brush Cleaning System App 20130192634 - HUANG; Fu-Ming ;   et al. | 2013-08-01 |
Method of manufacturing a biodegradable container Grant 5,756,024 - Huang May 26, 1 | 1998-05-26 |
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