| Patent | Date |
|---|
Quasi-soft Catcher, Quasi-soft Capture Device, And Method Using The Same
App 20210293687 - Huang; Chung-Er ; et al. | 2021-09-23 |
Catcher, Capture Device, And Method For Capturing Target Biological Particle
App 20210293778 - Huang; Chung-Er ; et al. | 2021-09-23 |
Microfluidic Device
App 20200384468 - Huang; Chung-Er ; et al. | 2020-12-10 |
Biological detection system
Grant 10,730,042 - Huang , et al. | 2020-08-04 |
System and method for capturing and retrieving biological particles and capturing device used in the same
Grant 10,488,322 - Huang , et al. Nov | 2019-11-26 |
Biological Detection System
App 20190001320 - Huang; Chung-Er ; et al. | 2019-01-03 |
System And Method For Capturing And Retrieving Biological Particles And Capturing Device Used In The Same
App 20170299495 - HUANG; Chung-Er ; et al. | 2017-10-19 |
System of testing multiple RF modules and method thereof
Grant 9,031,808 - Huang , et al. May 12, 2 | 2015-05-12 |
Filtering apparatus and method for dual-band sensing circuit
Grant 8,874,061 - Huang , et al. October 28, 2 | 2014-10-28 |
Substrate module having an embedded phase-locked loop, integerated system using the same, and fabricating method thereof
Grant 8,749,038 - Huang , et al. June 10, 2 | 2014-06-10 |
System Of Testing Multiple Rf Modules And Method Thereof
App 20130158933 - HUANG; SHIH-FENG ; et al. | 2013-06-20 |
Module Ic Package Structure Having A Metal Shielding Function For Preventing Electrical Malfunction Induced By Short-circuit
App 20130113089 - HUANG; CHUNG-ER ; et al. | 2013-05-09 |
Module Ic Package Structure
App 20120211876 - HUANG; CHUNG-ER ; et al. | 2012-08-23 |
Chip-level through hole structure of electronic package
Grant 8,242,381 - Huang , et al. August 14, 2 | 2012-08-14 |
Module Ic Package Structure With Electrical Shield Function And Method For Making The Same
App 20120162930 - HUANG; CHUNG-ER ; et al. | 2012-06-28 |
Module Ic Package Structure And Method For Making The Same
App 20120139089 - HUANG; CHUNG-ER ; et al. | 2012-06-07 |
Signal Matching Module With Combination Of Electronic Components For Signal Matching Of Single Or Multiple Subsystems
App 20110304379 - HUANG; CHUNG ER ; et al. | 2011-12-15 |
Integrated circuit module with temperature compensation crystal oscillator
Grant 8,059,425 - Huang , et al. November 15, 2 | 2011-11-15 |
Packaging structure of SIP and a manufacturing method thereof
Grant 7,960,847 - Huang , et al. June 14, 2 | 2011-06-14 |
Communication module with dual systems and method for defining operating mode thereof
Grant 7,953,375 - Huang , et al. May 31, 2 | 2011-05-31 |
Wireless receiving and transmitting device having an exposed projection structure for user to hold
Grant 7,833,028 - Huang , et al. November 16, 2 | 2010-11-16 |
Packaging structure of SIP and a manufacturing method thereof
Grant 7,829,390 - Huang , et al. November 9, 2 | 2010-11-09 |
Packaging Structure Of Sip And A Manufacturing Method Thereof
App 20100220450 - Huang; Chung-Er ; et al. | 2010-09-02 |
Packaging structure of sip and a manufacturing method thereof
App 20100123238 - Huang; Chung-Er ; et al. | 2010-05-20 |
Parallel testing system with shared golden calibration table and method thereof
Grant 7,680,615 - Huang , et al. March 16, 2 | 2010-03-16 |
Multi-system module having functional substrate
Grant 7,675,357 - Huang , et al. March 9, 2 | 2010-03-09 |
Electronic packaging structure and a manufacturing method thereof
App 20100052143 - Huang; Chung-ER ; et al. | 2010-03-04 |
Electronic packaging structure and a manufacturing method thereof
App 20100055840 - Huang; Chung-Er ; et al. | 2010-03-04 |
Packaging structure, method for manufacturing the same, and method for using the same
App 20100009501 - HUANG; CHUNG-ER ; et al. | 2010-01-14 |
Integrated circuit module with temperature compensation crystal oscillator
App 20090296361 - Huang; Chung-Er ; et al. | 2009-12-03 |
Communication module with dual systems and method for defining operating mode thereof
App 20090275296 - Huang; Chung-Er ; et al. | 2009-11-05 |
Substrate module having an embedded phase-locked loop, integerated system using the same, and fabricating method thereof
App 20090190706 - Huang; Chung-Er ; et al. | 2009-07-30 |
Parallel testing system with shared golden calibration table and method thereof
App 20090192750 - Huang; Chung-Er ; et al. | 2009-07-30 |
Packaging structure, method for manufacturing the same, and method for using the same
App 20090179327 - Huang; Chung-Er ; et al. | 2009-07-16 |
RF module integrated with active antenna
App 20090174618 - Huang; Chung-Er ; et al. | 2009-07-09 |
Multi-system module having functional substrate
App 20090174463 - Huang; Chung-Er ; et al. | 2009-07-09 |
Communication transmission system and power detection method thereof
App 20090137217 - Huang; Chung-Er ; et al. | 2009-05-28 |
Signal matching module for single or multiple systems
App 20090111405 - Huang; Chung-Er ; et al. | 2009-04-30 |
Filtering apparatus and method for dual-band sensing circuit
App 20090096517 - Huang; Chung-Er ; et al. | 2009-04-16 |
Shielding structure for electronic components
App 20090091907 - Huang; Chung-Er ; et al. | 2009-04-09 |
Shielding structure for semiconductors and manufacturing method therefor
App 20090091005 - Huang; Chung-Er ; et al. | 2009-04-09 |
Testing System For A Radio Frequency Module
App 20090079447 - HUANG; CHUNG-ER ; et al. | 2009-03-26 |
Conductive metal structure applied to a module IC and method of manufacturing the same
App 20090065905 - Huang; Chung-Er ; et al. | 2009-03-12 |
Wafer-level packaged structure and method for making the same
App 20090051044 - Huang; Chung-Er ; et al. | 2009-02-26 |
Output Power Detecting System With A Directional Coupler
App 20090051461 - HUANG; CHUNG-ER ; et al. | 2009-02-26 |
Module For Integrating Peripheral Circuit And A Manufacturing Method Thereof
App 20090039479 - HUANG; CHUNG-ER ; et al. | 2009-02-12 |
Chip-level Through Hole Structure Of Electronic Package
App 20090021329 - HUANG; CHUNG-ER ; et al. | 2009-01-22 |
Method for detecting defectives in an integrated circuit
App 20040153917 - Wu, Janne-wha ; et al. | 2004-08-05 |
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