HUANG; Chih-Kung
Patent Applications and Registrations
Patent applications and USPTO patent grants for HUANG; Chih-Kung.The latest application filed is for "structure and formation method of chip package with protective lid".
- HUANG; Chih-Kung - Hsinchu TW
- Huang; Chih-Kung - Hsin-Chu TW
- Huang; Chih-Kung - Taichung TW
- HUANG; Chih-Kung - Hsinchu City TW
- Huang; Chih-Kung - Taichung City TW
- Huang; Chih-Kung - New Taipei City TW
- Huang; Chih-Kung - Taipei County N/A TW
- Huang; Chih-Kung - Hsinchu City 300 TW
- HUANG, CHIH-KUNG - YI-LAN TW
- Huang; Chih-Kung - Yi-Lang TW
| Patent | Date |
|---|---|
| Structure And Formation Method Of Chip Package With Protective Lid App 20220278069 - KUO; Meng-Tsung ; et al. | 2022-09-01 |
| Semiconductor device and method of manufacture Grant 11,328,971 - Yeh , et al. May 10, 2 | 2022-05-10 |
| Semiconductor Device and Method of Manufacture App 20200357714 - Yeh; Shu-Shen ; et al. | 2020-11-12 |
| Semiconductor device and method of manufacture Grant 10,727,147 - Yeh , et al. | 2020-07-28 |
| Semiconductor Device and Method of Manufacture App 20190057916 - Yeh; Shu-Shen ; et al. | 2019-02-21 |
| Semiconductor device and method of manufacture Grant 10,109,547 - Yeh , et al. October 23, 2 | 2018-10-23 |
| Semiconductor Device and Method of Manufacture App 20170221788 - Yeh; Shu-Shen ; et al. | 2017-08-03 |
| Package substrate structure Grant 9,451,694 - Huang , et al. September 20, 2 | 2016-09-20 |
| Touch Sensing Device App 20160034083 - LAI; Wei-Jen ; et al. | 2016-02-04 |
| Package Substrate Structure App 20150373849 - Huang; Chih-Kung ; et al. | 2015-12-24 |
| Package Structure App 20150364448 - Huang; Chih-Kung ; et al. | 2015-12-17 |
| Ferrite Circuit Board App 20150061814 - LAI; Wei-Jen ; et al. | 2015-03-05 |
| Holder For Semiconductor Package App 20130213698 - BIAR; Jeff ; et al. | 2013-08-22 |
| MEMS sensor capable of sensing acceleration and pressure Grant 8,468,888 - Wu , et al. June 25, 2 | 2013-06-25 |
| Laminated Substrate With Coils App 20120099285 - BIAR; Jeff ; et al. | 2012-04-26 |
| Mems Sensor Capable Of Sensing Acceleration And Pressure App 20120060605 - WU; Ming-Ching ; et al. | 2012-03-15 |
| MEMS Sensor Package App 20120056280 - WU; Ming-Ching ; et al. | 2012-03-08 |
| Method Of Making Light-guiding Module App 20100301504 - Hsieh; Cheng-Yang ; et al. | 2010-12-02 |
| Light-emitting element package and light source apparatus using the same Grant 7,737,452 - Biar , et al. June 15, 2 | 2010-06-15 |
| Base substrate for chip scale packaging Grant 7,675,159 - Biar , et al. March 9, 2 | 2010-03-09 |
| Chip Size Image Sensing Chip Package App 20080265356 - Biar; Jin-Chyuan ; et al. | 2008-10-30 |
| Ultra Thin Image Sensing Chip Package App 20080265388 - BIAR; Jin-Chyuan ; et al. | 2008-10-30 |
| Light-emitting Element Package And Light Source Apparatus Using The Same App 20080265271 - Biar; Jin-Chyuan ; et al. | 2008-10-30 |
| Substrate For Thin Chip Packagings App 20080248270 - Biar; Jeff ; et al. | 2008-10-09 |
| Base Substrate For Chip Scale Packaging App 20080224299 - BIAR; Jeff ; et al. | 2008-09-18 |
| Method of fabricating film carrier Grant 7,122,124 - Hu , et al. October 17, 2 | 2006-10-17 |
| Method Of Fabricating Film Carrier App 20050196902 - Hu, Dyi-Chung ; et al. | 2005-09-08 |
| Method Of Fabricating Film Carrier App 20050194349 - Hu, Dyi-Chung ; et al. | 2005-09-08 |
| Lead On Chip Package And Leadframe Thereof App 20040207066 - HSIAO, CHUNG-LIANG ; et al. | 2004-10-21 |
| Double Leadframe-based Packaging Structure And Manufacturing Process Thereof App 20040036151 - Hsiao, Chung-Liang ; et al. | 2004-02-26 |
| Tape structure and manufacturing method Grant 6,677,055 - Chung , et al. January 13, 2 | 2004-01-13 |
| Chip scale package of semiconductor Grant 6,392,305 - Huang , et al. May 21, 2 | 2002-05-21 |
| Lead frame with heat slug Grant 6,262,475 - Liu , et al. July 17, 2 | 2001-07-17 |
| Metal stud array packaging App 20010001069 - Huang, Chih-Kung ; et al. | 2001-05-10 |
| Dual leadframe package Grant 6,215,176 - Huang April 10, 2 | 2001-04-10 |
| Lead frame structure for preventing the warping of semiconductor package body Grant 6,078,099 - Liu , et al. June 20, 2 | 2000-06-20 |
| Leadframe for integrated circuit package Grant 5,889,317 - Huang , et al. March 30, 1 | 1999-03-30 |
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