| Patent | Date |
|---|
Method of forming deep trench isolation in radiation sensing substrate and image sensor device
Grant 11,404,470 - Lu , et al. August 2, 2 | 2022-08-02 |
Method of forming semiconductor device
Grant 11,387,274 - Lu , et al. July 12, 2 | 2022-07-12 |
Wafer bonding method and apparatus with curved surfaces
Grant 11,276,587 - Huang , et al. March 15, 2 | 2022-03-15 |
Manufacturing methods of semiconductor image sensor devices
Grant 11,189,654 - Chang , et al. November 30, 2 | 2021-11-30 |
Method For Manufacturing Semiconductor Device And Manufacturing Method Of The Same
App 20210358740 - LIN; YUNG-LUNG ; et al. | 2021-11-18 |
Bonding support structure (and related process) for wafer stacking
Grant 11,139,210 - Li , et al. October 5, 2 | 2021-10-05 |
Method for manufacturing semiconductor device and manufacturing method of the same
Grant 11,087,971 - Lin , et al. August 10, 2 | 2021-08-10 |
Interconnect Structure for Stacked Device
App 20210233813 - Tsai; Shu-Ting ; et al. | 2021-07-29 |
Gas shower head with plural hole patterns and with corresponding different plural hole densities and film formation method
Grant 11,041,242 - Huang , et al. June 22, 2 | 2021-06-22 |
Multi-wafer Capping Layer For Metal Arcing Protection
App 20210134663 - Huang; Chih-Hui ; et al. | 2021-05-06 |
Interconnect structure for stacked device
Grant 10,978,345 - Tsai , et al. April 13, 2 | 2021-04-13 |
Reflector for backside illuminated (BSI) image sensor
Grant 10,879,288 - Huang , et al. December 29, 2 | 2020-12-29 |
Bonding Support Structure (and Related Process) For Wafer Stacking
App 20200321251 - Li; Sheng-Chan ; et al. | 2020-10-08 |
Manufacturing Methods Of Semiconductor Image Sensor Devices
App 20200312894 - Chang; Chao-Ching ; et al. | 2020-10-01 |
Bonding support structure (and related process) for wafer stacking
Grant 10,734,285 - Li , et al. | 2020-08-04 |
Mechanisms for cleaning substrate surface for hybrid bonding
Grant 10,727,097 - Chen , et al. | 2020-07-28 |
Gas Shower Head And Method For Forming Semiconductor Structure
App 20200141004 - HUANG; CHIH-HUI ; et al. | 2020-05-07 |
Method of Forming Deep Trench Isolation in Radiation Sensing Substrate and Image Sensor Device
App 20200119081 - LU; Chi-Ming ; et al. | 2020-04-16 |
Wafer Processing Method and Apparatus
App 20200105548 - Huang; Chih-Hui ; et al. | 2020-04-02 |
Method of Forming Semiconductor Device
App 20200083278 - LU; Chi-Ming ; et al. | 2020-03-12 |
Method For Manufacturing Semiconductor Device And Manufacturing Method Of The Same
App 20200083036 - LIN; YUNG-LUNG ; et al. | 2020-03-12 |
Reflector For Backside Illuminated (bsi) Image Sensor
App 20200075657 - Huang; Chih-Hui ; et al. | 2020-03-05 |
Film formation apparatus for forming semiconductor structure having shower head with plural hole patterns and with corresponding different plural hole densities
Grant 10,526,703 - Huang , et al. J | 2020-01-07 |
Bonding Support Structure (and Related Process) For Wafer Stacking
App 20200006145 - Li; Sheng-Chan ; et al. | 2020-01-02 |
Method of forming deep trench isolation in radiation sensing substrate and image sensor device
Grant 10,510,798 - Lu , et al. Dec | 2019-12-17 |
Method for manufacturing semiconductor device and manufacturing method of the same
Grant 10,504,716 - Lin , et al. Dec | 2019-12-10 |
Wafer processing method and apparatus
Grant 10,504,756 - Huang , et al. Dec | 2019-12-10 |
Semiconductor device having stress-neutralized film stack and method of fabricating same
Grant 10,475,847 - Lu , et al. Nov | 2019-11-12 |
Method For Manufacturing Semiconductor Device And Manufacturing Method Of The Same
App 20190287788 - LIN; YUNG-LUNG ; et al. | 2019-09-19 |
Film Formation Apparatus And Method For Forming Semiconductor Structure
App 20190284695 - HUANG; CHIH-HUI ; et al. | 2019-09-19 |
Interconnect Structure For Stacked Device
App 20190051559 - Tsai; Shu-Ting ; et al. | 2019-02-14 |
Method Of Forming Deep Trench Isolation In Radiation Sensing Substrate And Image Sensor Device
App 20190043915 - Lu; Chi-Ming ; et al. | 2019-02-07 |
Conductive pad structure for hybrid bonding and methods of forming same
Grant 10,177,106 - Chen , et al. J | 2019-01-08 |
Method of forming deep trench isolation in radiation sensing substrate and image sensor device
Grant 10,134,801 - Lu , et al. November 20, 2 | 2018-11-20 |
Interconnect structure for stacked device
Grant 10,096,515 - Tsai , et al. October 9, 2 | 2018-10-09 |
Composite bond structure in stacked semiconductor structure
Grant 10,062,656 - Chang , et al. August 28, 2 | 2018-08-28 |
Deep trench isolation fabrication for BSI image sensor
Grant 10,062,720 - Chiang , et al. August 28, 2 | 2018-08-28 |
Selective Deposition And Planarization For A Cmos Image Sensor
App 20180122844 - Li; Sheng-Chan ; et al. | 2018-05-03 |
Hybrid bonding mechanisms for semiconductor wafers
Grant 9,960,129 - Liu , et al. May 1, 2 | 2018-05-01 |
Selective deposition and planarization for a CMOS image sensor
Grant 9,960,200 - Li , et al. May 1, 2 | 2018-05-01 |
Wafer Processing Method and Apparatus
App 20180090348 - Huang; Chih-Hui ; et al. | 2018-03-29 |
Conductive Pad Structure for Hybrid Bonding and Methods of Forming Same
App 20180068965 - Chen; Sheng-Chau ; et al. | 2018-03-08 |
Composite Bond Structure In Stacked Semiconductor Structure
App 20180047682 - Chang; Chao-Ching ; et al. | 2018-02-15 |
Semiconductor devices, image sensors, and methods of manufacture thereof
Grant 9,859,326 - Chen , et al. January 2, 2 | 2018-01-02 |
Conductive pad structure for hybrid bonding and methods of forming same
Grant 9,842,816 - Chen , et al. December 12, 2 | 2017-12-12 |
Wafer processing method and apparatus
Grant 9,837,291 - Huang , et al. December 5, 2 | 2017-12-05 |
Method Of Forming Semiconductor Device
App 20170317134 - LU; Chi-Ming ; et al. | 2017-11-02 |
Deep Trench Isolation Fabrication For Bsi Image Sensor
App 20170301709 - Chiang; Yen-Ting ; et al. | 2017-10-19 |
Bond chuck, methods of bonding, and tool including bond chuck
Grant 9,754,813 - Huang , et al. September 5, 2 | 2017-09-05 |
Semiconductor Image Sensor Device And Manufacturing Method Of The Same
App 20170250211 - Chang; Chao-Ching ; et al. | 2017-08-31 |
Hybrid bond using a copper alloy for yield improvement
Grant 9,728,521 - Tsai , et al. August 8, 2 | 2017-08-08 |
Deep trench isolation fabrication for BSI image sensor
Grant 9,728,570 - Chiang , et al. August 8, 2 | 2017-08-08 |
Method Of Forming Deep Trench Isolation In Radiation Sensing Substrate And Image Sensor Device
App 20170154917 - LU; Chi-Ming ; et al. | 2017-06-01 |
Dti For Bsi Image Sensor
App 20170133414 - Chiang; Yen-Ting ; et al. | 2017-05-11 |
Bond Chuck, Methods of Bonding, and Tool Including Bond Chuck
App 20170053823 - Huang; Chih-Hui ; et al. | 2017-02-23 |
Hybrid Bond Using A Copper Alloy For Yield Improvement
App 20170025381 - Tsai; Yu-Cheng ; et al. | 2017-01-26 |
Semiconductor structure and method of manufacturing the same
Grant 9,508,769 - Li , et al. November 29, 2 | 2016-11-29 |
Conductive Pad Structure for Hybrid Bonding and Methods of Forming Same
App 20160343679 - Chen; Sheng-Chau ; et al. | 2016-11-24 |
Bond chuck, methods of bonding, and tool including bond chuck
Grant 9,490,158 - Huang , et al. November 8, 2 | 2016-11-08 |
Conductive pad structure for hybrid bonding and methods of forming same
Grant 9,437,572 - Chen , et al. September 6, 2 | 2016-09-06 |
Bond Chuck, Methods of Bonding, and Tool Including Bond Chuck
App 20160204020 - Huang; Chih-Hui ; et al. | 2016-07-14 |
Hybrid bonding and apparatus for performing the same
Grant 9,331,032 - Liu , et al. May 3, 2 | 2016-05-03 |
Semiconductor device with compressive layers
Grant 9,252,296 - Tsao , et al. February 2, 2 | 2016-02-02 |
Hybrid Bonding Mechanisms For Semiconductor Wafers
App 20150357296 - LIU; Ping-Yin ; et al. | 2015-12-10 |
Image sensor trench isolation with conformal doping
Grant 9,190,441 - Lai , et al. November 17, 2 | 2015-11-17 |
Hybrid bonding mechanisms for semiconductor wafers
Grant 9,142,517 - Liu , et al. September 22, 2 | 2015-09-22 |
Semiconductor Device With Compressive Layers
App 20150263055 - TSAO; Chun-Han ; et al. | 2015-09-17 |
Mechanisms For Cleaning Substrate Surface For Hybrid Bonding
App 20150243537 - CHEN; Sheng-Chau ; et al. | 2015-08-27 |
Semiconductor Devices, Image Sensors, and Methods of Manufacture Thereof
App 20150214267 - Chen; Sheng-Chau ; et al. | 2015-07-30 |
Wafer Processing Method and Apparatus
App 20150214082 - Huang; Chih-Hui ; et al. | 2015-07-30 |
Conductive Pad Structure for Hybrid Bonding and Methods of Forming Same
App 20150171050 - Chen; Sheng-Chau ; et al. | 2015-06-18 |
Image sensor having compressive layers
Grant 9,059,057 - Tsao , et al. June 16, 2 | 2015-06-16 |
Mechanisms for cleaning substrate surface for hybrid bonding
Grant 9,040,385 - Chen , et al. May 26, 2 | 2015-05-26 |
Image Sensor Trench Isolation With Conformal Doping
App 20150056739 - LAI; CHIH-YU ; et al. | 2015-02-26 |
Mechanisms For Cleaning Substrate Surface For Hybrid Bonding
App 20150031189 - Chen; Sheng-Chau ; et al. | 2015-01-29 |
Image sensor trench isolation with conformal doping
Grant 8,853,811 - Lai , et al. October 7, 2 | 2014-10-07 |
Interconnect Structure for Stacked Device
App 20140264929 - Tsai; Shu-Ting ; et al. | 2014-09-18 |
Hybrid Bonding and Apparatus for Performing the Same
App 20140256087 - Liu; Ping-Yin ; et al. | 2014-09-11 |
Hybrid Bonding Mechanisms For Semiconductor Wafers
App 20140117546 - LIU; Ping-Yin ; et al. | 2014-05-01 |
Image Sensor Having Compressive Layers
App 20130329102 - TSAO; Chun-Han ; et al. | 2013-12-12 |
Image Sensor Trench Isolation With Conformal Doping
App 20130113061 - Lai; Chih-Yu ; et al. | 2013-05-09 |
Antireflective layer for backside illuminated image sensor and method of manufacturing same
Grant 8,377,733 - Huang , et al. February 19, 2 | 2013-02-19 |
Antireflective Layer For Backside Illuminated Image Sensor And Method Of Manufacturing Same
App 20120038015 - Huang; Chih-Hui ; et al. | 2012-02-16 |
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