| Patent | Date |
|---|
Magnetic Tunnel Junction Device And Method Of Forming The Same
App 20220310903 - Huang; Chih-Fan ; et al. | 2022-09-29 |
Semiconductor Structure With Memory Device And Method For Manufacturing The Same
App 20220302375 - CHIU; Chih-Pin ; et al. | 2022-09-22 |
Metal-Insulator-Metal Structure and Methods of Fabrication Thereof
App 20220285479 - Huang; Chih-Fan ; et al. | 2022-09-08 |
Chip structure and method for forming the same
Grant 11,437,331 - Huang , et al. September 6, 2 | 2022-09-06 |
Shielding structures
Grant 11,380,639 - Huang , et al. July 5, 2 | 2022-07-05 |
Metal-insulator-metal (MIM) capacitor structure and method for forming the same
Grant 11,362,170 - Huang , et al. June 14, 2 | 2022-06-14 |
Metal-insulator-metal structure and methods of fabrication thereof
Grant 11,342,408 - Huang , et al. May 24, 2 | 2022-05-24 |
MRAM Structure for Balanced Loading
App 20220069199 - Huang; Chih-Fan ; et al. | 2022-03-03 |
Structure and Method for MRAM Devices with a Slot Via
App 20220044717 - Huang; Chih-Fan ; et al. | 2022-02-10 |
Package structure and method for forming the same
Grant 11,239,142 - Huang , et al. February 1, 2 | 2022-02-01 |
Method of forming a photoresist over a bond pad to mitigate bond pad corrosion
Grant 11,222,857 - Huang , et al. January 11, 2 | 2022-01-11 |
Semiconductor structure with polyimide packaging and manufacturing method
Grant 11,189,538 - Huang , et al. November 30, 2 | 2021-11-30 |
Multi-layer passivation structure and method
Grant 11,145,564 - Huang , et al. October 12, 2 | 2021-10-12 |
Method Of Forming A Photoresist Over A Bond Pad To Mitigate Bond Pad Corrosion
App 20210265291 - Huang; Chih-Fan ; et al. | 2021-08-26 |
Semiconductor package, semiconductor device and method of forming the same
Grant 11,056,474 - Yu , et al. July 6, 2 | 2021-07-06 |
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices
App 20210202335 - Yu; Chen-Hua ; et al. | 2021-07-01 |
Metal-insulator-metal (MIM) capacitor structure and method for forming the same
Grant 11,031,458 - Huang , et al. June 8, 2 | 2021-06-08 |
Chip Structure And Method For Forming The Same
App 20210118829 - HUANG; Chih-Fan ; et al. | 2021-04-22 |
Package Structure And Method For Forming The Same
App 20210118782 - HUANG; Chih-Fan ; et al. | 2021-04-22 |
Metal Pad Corrosion Prevention
App 20210098399 - Huang; Chih-Fan ; et al. | 2021-04-01 |
Shielding Structures
App 20210091029 - Huang; Chih-Fan ; et al. | 2021-03-25 |
Packaged semiconductor devices and methods of packaging semiconductor devices
Grant 10,950,514 - Yu , et al. March 16, 2 | 2021-03-16 |
Metal-insulator-metal (mim) Capacitor Structure And Method For Forming The Same
App 20210013301 - HUANG; Chih-Fan ; et al. | 2021-01-14 |
Shielding structures
Grant 10,861,810 - Huang , et al. December 8, 2 | 2020-12-08 |
Metal-Insulator-Metal Structure and Methods of Fabrication Thereof
App 20200365683 - Huang; Chih-Fan ; et al. | 2020-11-19 |
Metal-insulator-metal structure and methods of fabrication thereof
Grant 10,734,474 - Huang , et al. | 2020-08-04 |
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices
App 20200227331 - Yu; Chen-Hua ; et al. | 2020-07-16 |
Shielding Structures
App 20200168574 - Huang; Chih-Fan ; et al. | 2020-05-28 |
Packaged semiconductor devices and methods of packaging semiconductor devices
Grant 10,629,508 - Yu , et al. | 2020-04-21 |
Semiconductor Structure with Polyimide Packaging and Manufacturing Method
App 20200105634 - Huang; Chih-Fan ; et al. | 2020-04-02 |
Metal-Insulator-Metal Structure and Methods of Fabrication Thereof
App 20200035779 - Huang; Chih-Fan ; et al. | 2020-01-30 |
Metal-insulator-metal (mim) Capacitor Structure And Method For Forming The Same
App 20200035780 - HUANG; Chih-Fan ; et al. | 2020-01-30 |
Multi-Layer Passivation Structure and Method
App 20200006183 - Huang; Chih-Fan ; et al. | 2020-01-02 |
Methods of packaging semiconductor devices and packaged semiconductor devices
Grant 10,510,719 - Yu , et al. Dec | 2019-12-17 |
Packaged semiconductor devices and methods of packaging semiconductor devices
Grant 10,510,716 - Yu , et al. Dec | 2019-12-17 |
Molding structure for wafer level package
Grant 10,510,630 - Yu , et al. Dec | 2019-12-17 |
Metal-insulator-metal (MIM) capacitor structure and method for forming the same
Grant 10,468,478 - Huang , et al. No | 2019-11-05 |
Molding Structure for Wafer Level Package
App 20190259678 - Yu; Chen-Hua ; et al. | 2019-08-22 |
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices
App 20190252280 - Yu; Chen-Hua ; et al. | 2019-08-15 |
Molding structure for wafer level package
Grant 10,283,427 - Yu , et al. | 2019-05-07 |
Metal-insulator-metal (mim) Capacitor Structure And Method For Forming The Same
App 20190131385 - HUANG; Chih-Fan ; et al. | 2019-05-02 |
Packaged semiconductor devices and methods of packaging semiconductor devices
Grant 10,269,673 - Yu , et al. | 2019-04-23 |
Semiconductor Package, Semiconductor Device and Method of Forming the Same
App 20190088635 - Yu; Chen-Hua ; et al. | 2019-03-21 |
Molding structure for wafer level package
Grant 10,163,804 - Yu , et al. Dec | 2018-12-25 |
Method for manufacturing semiconductor structure
Grant 10,163,734 - Yu , et al. Dec | 2018-12-25 |
Packages with molding structures and methods of forming the same
Grant 10,157,849 - Huang , et al. Dec | 2018-12-18 |
Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices
App 20180342482 - Yu; Chen-Hua ; et al. | 2018-11-29 |
Semiconductor package, semiconductor device and method of forming the same
Grant 10,134,717 - Yu , et al. November 20, 2 | 2018-11-20 |
Bump-on-trace structures with high assembly yield
Grant 10,050,000 - Huang , et al. August 14, 2 | 2018-08-14 |
Methods of packaging semiconductor devices and packaged semiconductor devices
Grant 10,043,778 - Yu , et al. August 7, 2 | 2018-08-07 |
Wafer-level molding chase design
Grant 10,020,211 - Yu , et al. July 10, 2 | 2018-07-10 |
Molding Structure for Wafer Level Package
App 20180190555 - Yu; Chen-Hua ; et al. | 2018-07-05 |
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices
App 20180190559 - Yu; Chen-Hua ; et al. | 2018-07-05 |
Molding Structure For Wafer Level Package
App 20180158780 - Yu; Chen-Hua ; et al. | 2018-06-07 |
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices
App 20180138147 - Yu; Chen-Hua ; et al. | 2018-05-17 |
Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices
App 20180108637 - Yu; Chen-Hua ; et al. | 2018-04-19 |
Packaged semiconductor devices and methods of packaging semiconductor devices
Grant 9,911,675 - Yu , et al. March 6, 2 | 2018-03-06 |
Molding structure for wafer level package
Grant 9,911,674 - Yu , et al. March 6, 2 | 2018-03-06 |
Molding structure for wafer level package
Grant 9,887,162 - Yu , et al. February 6, 2 | 2018-02-06 |
Packaged semiconductor devices and methods of packaging semiconductor devices
Grant 9,871,018 - Yu , et al. January 16, 2 | 2018-01-16 |
Methods of packaging semiconductor devices and packaged semiconductor devices
Grant 9,847,317 - Yu , et al. December 19, 2 | 2017-12-19 |
Method For Manufacturing Semiconductor Structure
App 20170316987 - YU; CHEN-HUA ; et al. | 2017-11-02 |
Method for manufacturing semiconductor structure
Grant 9,728,427 - Yu , et al. August 8, 2 | 2017-08-08 |
Packages with Molding Structures and Methods of Forming the Same
App 20170170124 - Huang; Chih-Fan ; et al. | 2017-06-15 |
Semiconductor Package, Semiconductor Device and Method of Forming the Same
App 20170092634 - YU; CHEN-HUA ; et al. | 2017-03-30 |
Packages with molding structures and methods of forming the same
Grant 9,601,353 - Huang , et al. March 21, 2 | 2017-03-21 |
Bump-on-Trace Structures with High Assembly Yield
App 20170005059 - Huang; Chih-Fan ; et al. | 2017-01-05 |
Semiconductor package, semiconductor device and method of forming the same
Grant 9,530,762 - Yu , et al. December 27, 2 | 2016-12-27 |
Molding Structure for Wafer Level Package
App 20160336247 - Yu; Chen-Hua ; et al. | 2016-11-17 |
Bump-on-trace structures with high assembly yield
Grant 9,472,525 - Huang , et al. October 18, 2 | 2016-10-18 |
Molding structure for wafer level package
Grant 9,401,337 - Yu , et al. July 26, 2 | 2016-07-26 |
Method For Manufacturing Semiconductor Structure
App 20160204042 - YU; CHEN-HUA ; et al. | 2016-07-14 |
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices
App 20160190096 - Yu; Chen-Hua ; et al. | 2016-06-30 |
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices
App 20160133538 - Yu; Chen-Hua ; et al. | 2016-05-12 |
Method for manufacturing semiconductor structure
Grant 9,324,587 - Yu , et al. April 26, 2 | 2016-04-26 |
Packaged semiconductor devices and methods of packaging semiconductor devices
Grant 9,299,688 - Yu , et al. March 29, 2 | 2016-03-29 |
Bump-on-Trace Structures with High Assembly Yield
App 20160086901 - Huang; Chih-Fan ; et al. | 2016-03-24 |
Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices
App 20160035667 - Huang; Chih-Fan ; et al. | 2016-02-04 |
Packages With Molding Structures And Methods Of Forming The Same
App 20160035666 - Huang; Chih-Fan ; et al. | 2016-02-04 |
Packaged semiconductor devices and methods of packaging semiconductor devices
Grant 9,252,135 - Yu , et al. February 2, 2 | 2016-02-02 |
Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices
App 20160013152 - Yu; Chen-Hua ; et al. | 2016-01-14 |
Wafer-level Molding Chase Design
App 20150364456 - Yu; Chen-Hua ; et al. | 2015-12-17 |
Bump-on-trace structures with high assembly yield
Grant 9,209,149 - Huang , et al. December 8, 2 | 2015-12-08 |
Method For Manufacturing Semiconductor Structure
App 20150235874 - YU; CHEN-HUA ; et al. | 2015-08-20 |
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices
App 20150228632 - Yu; Chen-Hua ; et al. | 2015-08-13 |
Semiconductor Package, Semiconductor Device And Method Of Forming The Same
App 20150200188 - YU; CHEN-HUA ; et al. | 2015-07-16 |
Molding Structure for Wafer Level Package
App 20150170937 - Yu; Chen-Hua ; et al. | 2015-06-18 |
Molding Structure for Wafer Level Package
App 20150171055 - Yu; Chen-Hua ; et al. | 2015-06-18 |
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices
App 20150162316 - Yu; Chen-Hua ; et al. | 2015-06-11 |
Bump-on-Trace Structures with High Assembly Yield
App 20150130051 - Huang; Chih-Fan ; et al. | 2015-05-14 |
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