HUANG; Chien-Mei

Patent Applications and Registrations

Patent applications and USPTO patent grants for HUANG; Chien-Mei.The latest application filed is for "semiconductor device package and method for manufacturing the same".

Company Profile

5.4.5

HUANG; Chien-Mei - Kaohsiung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device Package And Method For Manufacturing The Same App 20210280565 - HUANG; Chien-Mei ; et al.	2021-09-09
Wiring structure, electronic device and method for manufacturing the same Grant 11,031,326 - Huang , et al. June 8, 2	2021-06-08
Semiconductor device package with stress buffering layer and method for manufacturing the same Grant 11,018,120 - Huang , et al. May 25, 2	2021-05-25
Semiconductor Device Package And Method For Manufacturing The Same App 20200388600 - HUANG; Chien-Mei ; et al.	2020-12-10
Wiring Structure, Electronic Device And Method For Manufacturing The Same App 20200194361 - HUANG; Wen Hung ; et al.	2020-06-18
Wiring structure, electronic device and method for manufacturing the same Grant 10,643,937 - Huang , et al.	2020-05-05
Semiconductor package and semiconductor process Grant 10,522,492 - Huang , et al. Dec	2019-12-31
Wiring Structure, Electronic Device And Method For Manufacturing The Same App 20190348352 - HUANG; Wen Hung ; et al.	2019-11-14
Semiconductor Package And Semiconductor Process App 20180350616 - HUANG; Wen Hung ; et al.	2018-12-06

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