Huang; Cheng-Tang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Huang; Cheng-Tang.The latest application filed is for "semiconductor package structure and manufacturing method thereof".

Company Profile

0.9.13

Huang; Cheng-Tang - Hsinchu N/A TW
HUANG; Cheng Tang - US
Huang; Cheng Tang - Sinshih Township Tainan County TW
Huang; Cheng-Tang - Tainan County TW
HUANG; Cheng-Tang - Hsinchu city TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package structure and manufacturing method thereof Grant 9,196,553 - Liao , et al. November 24, 2	2015-11-24
Semiconductor Package Structure And Manufacturing Method Thereof App 20130049197 - Liao; Tsung-Jen ; et al.	2013-02-28
Semiconductor Package Structure And Manufacturing Method Thereof App 20130049198 - Liao; Tsung-Jen ; et al.	2013-02-28
Conductive Structure For A Semiconductor Integrated Circuit And Method For Forming The Same App 20120309186 - CHYI; J. B. ; et al.	2012-12-06
Conductive structure for a semiconductor integrated circuit and method for forming the same Grant 8,319,337 - Chi , et al. November 27, 2	2012-11-27
Chip bump structure and method for forming the same Grant 8,274,150 - Huang September 25, 2	2012-09-25
Manufacturing method of a bump structure having a reinforcement member Grant 8,211,789 - Huang July 3, 2	2012-07-03
Chip Bump Structure And Method For Forming The Same App 20110291273 - HUANG; CHENG TANG	2011-12-01
Manufacturing Method Of A Bump Structure Having A Reinforcement Member App 20110212615 - Huang; Cheng-Tang	2011-09-01
Bump structure having a reinforcement member Grant 7,969,003 - Huang June 28, 2	2011-06-28
Chip stacked structure and the forming method Grant 7,888,172 - Huang February 15, 2	2011-02-15
Packaging conductive structure and method for forming the same Grant 7,879,651 - Huang February 1, 2	2011-02-01
Method Of Die Rearrangement Package Structure Having Patterned Under Bump Metallurgic Layer Connecting Metal Lead App 20110003431 - HUANG; Cheng-Tang	2011-01-06
Packaging conductive structure for a semiconductor substrate having a metallic layer Grant 7,656,020 - Huang February 2, 2	2010-02-02
Die Rearrangement Package Structure And Method Thereof App 20090302465 - HUANG; Cheng-Tang	2009-12-10
Chip Stacked Structure and the Forming Method App 20090302448 - Huang; Cheng-Tang	2009-12-10
Conductive structure for a semiconductor integrated circuit and method for forming the same App 20080197467 - Chyi; J.B. ; et al.	2008-08-21
Packaging conductive structure and method for forming the same App 20080197475 - Huang; Cheng Tang	2008-08-21
Bump Structure Having A Reinforcement Member And Manufacturing Method Thereof App 20080185716 - Huang; Cheng-Tang	2008-08-07

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