loadpatents
name:-0.0089759826660156
name:-0.009199857711792
name:-0.00048398971557617
Huang; Cheng-Chuan Patent Filings

Huang; Cheng-Chuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Huang; Cheng-Chuan.The latest application filed is for "finfet device for device characterization".

Company Profile
0.9.7
  • Huang; Cheng-Chuan - Taipei County TW
  • Huang; Cheng-Chuan - Jhonghe N/A TW
  • Huang; Cheng-Chuan - Taipei TW
  • Huang; Cheng-Chuan - Kinmen TW
  • Huang; Cheng-Chuan - Jhonghe City TW
  • Huang, Cheng-Chuan - Hsin-Chu TW
  • Huang, Cheng-Chuan - Jin-Cheng TW
  • Huang; Cheng-Chuan - Changhua TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
FinFET device for device characterization
Grant 9,960,274 - Chen , et al. May 1, 2
2018-05-01
FinFET Device For Device Characterization
App 20170018641 - Chen; Hao-Yu ;   et al.
2017-01-19
FinFET for device characterization
Grant 9,455,348 - Chen , et al. September 27, 2
2016-09-27
Strained silicon device
Grant 8,569,845 - Huang , et al. October 29, 2
2013-10-29
Method for forming semiconductor device with modified channel compressive stress
Grant 7,462,554 - Huang , et al. December 9, 2
2008-12-09
FinFET for device characterization
App 20080185650 - Chen; Hao-Yu ;   et al.
2008-08-07
Strained silicon device
App 20070075356 - Huang; Chien-Chao ;   et al.
2007-04-05
Strained silicon device manufacturing method
Grant 7,135,372 - Huang , et al. November 14, 2
2006-11-14
Strained silicon device manufacturing method
App 20060051922 - Huang; Chien-Chao ;   et al.
2006-03-09
Method for forming semiconductor device with modified channel compressive stress
App 20060003520 - Huang; Chien-Chao ;   et al.
2006-01-05
Novel semiconductor device design
App 20050275043 - Huang, Chien-Chao ;   et al.
2005-12-15
Semiconductor device with modified channel compressive stress
Grant 6,975,006 - Huang , et al. December 13, 2
2005-12-13
Semiconductor device with modified channel compressive stress and the method for making same
App 20050019998 - Huang, Chien-Chao ;   et al.
2005-01-27
Cutting apparatus for horticultural use
Grant 5,075,972 - Huang December 31, 1
1991-12-31

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