HUANG; CHENG-CHEN
Patent Applications and Registrations
Patent applications and USPTO patent grants for HUANG; CHENG-CHEN.The latest application filed is for "package substrate and chip package structure using the same".
- HUANG; CHENG-CHEN - HSINCHU TW
- Huang; Cheng-Chen - Prescott WI
| Patent | Date |
|---|---|
| Package Substrate And Chip Package Structure Using The Same App 20220278033 - HSIEH; HAN-CHIEH ; et al. | 2022-09-01 |
| Power rail design method, apparatus and non-transitory computer readable medium thereof Grant 11,416,665 - Huang , et al. August 16, 2 | 2022-08-16 |
| Power Rail Design Method, Apparatus And Non-transitory Computer Readable Medium Thereof App 20210124864 - HUANG; Cheng-Chen ; et al. | 2021-04-29 |
| Cancerous cell growth inhibiting compounds Grant 10,550,095 - Huang , et al. Fe | 2020-02-04 |
| Skin lightening compounds Grant 10,112,881 - Huang , et al. October 30, 2 | 2018-10-30 |
| Cancerous Cell Growth Inhibiting Compounds App 20170342047 - Huang; Cheng-Chen ; et al. | 2017-11-30 |
| Skin Lightening Compounds App 20170197897 - Huang; Cheng-Chen ; et al. | 2017-07-13 |
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