| Patent | Date |
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Fabrication method of package structure with simplified encapsulation structure and simplified wiring
Grant 8,685,834 - Tsao , et al. April 1, 2 | 2014-04-01 |
Package structure and fabrication method thereof
App 20100068846 - Tsao; Pei-Haw ; et al. | 2010-03-18 |
Package structure and fabrication method thereof
Grant 7,638,887 - Tsao , et al. December 29, 2 | 2009-12-29 |
Matrix form semiconductor package substrate having an electrode of serpentine shape
Grant 7,443,010 - Tsao , et al. October 28, 2 | 2008-10-28 |
Enhanced adhesion strength between mold resin and polyimide
Grant 7,390,697 - Chen , et al. June 24, 2 | 2008-06-24 |
Heat spreader and package structure utilizing the same
Grant 7,378,731 - Huang , et al. May 27, 2 | 2008-05-27 |
Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling
Grant 7,294,937 - Su , et al. November 13, 2 | 2007-11-13 |
Novel Under-bump Metallization For Bond Pad Soldering
App 20070238283 - Chen; Chih-Chiang ; et al. | 2007-10-11 |
Heat spreader and package structure utilizing the same
App 20070138627 - Huang; Chender ; et al. | 2007-06-21 |
Heat spreader and package structure utilizing the same
Grant 7,190,066 - Huang , et al. March 13, 2 | 2007-03-13 |
Semiconductor bond pad structures and methods of manufacturing thereof
Grant 7,157,734 - Tsao , et al. January 2, 2 | 2007-01-02 |
Ball grid array package with thermally-enhanced heat spreader
App 20060278975 - Tsao; Pei-Haw ; et al. | 2006-12-14 |
Semiconductor Bond Pad Structures And Methods Of Manufacturing Thereof
App 20060267008 - Tsao; Pei-Haw ; et al. | 2006-11-30 |
Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling
App 20060261490 - Su; Chao-Yuan ; et al. | 2006-11-23 |
Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling
Grant 7,126,225 - Su , et al. October 24, 2 | 2006-10-24 |
Non-cavity semiconductor packages
App 20060231960 - Su; Chao-Yuan ; et al. | 2006-10-19 |
Heat spreader and package structure utilizing the same
App 20060202326 - Huang; Chender ; et al. | 2006-09-14 |
Package structure and fabrication method thereof
App 20060163714 - Tsao; Pei-Haw ; et al. | 2006-07-27 |
Test pad and probe card for wafer acceptance testing and other applications
App 20060109014 - Chao; Te-Tsung ; et al. | 2006-05-25 |
Fine pitch bonding pad layout and method of manufacturing same
App 20060091535 - Tsao; Pei-Haw ; et al. | 2006-05-04 |
Semiconductor Package Substrate For Flip Chip Packaging
App 20060076681 - Tsao; Pei-Haw ; et al. | 2006-04-13 |
Thermal dispensing enhancement for high performance flip chip BGA (HPFCBGA)
Grant 7,026,711 - Lee , et al. April 11, 2 | 2006-04-11 |
Three dimensional package type stacking for thinner package application
App 20060073635 - Su; Chao-Yuan ; et al. | 2006-04-06 |
Three dimensional package and packaging method for integrated circuits
App 20060065958 - Tsao; Pei-Haw ; et al. | 2006-03-30 |
Ic Package Having Ground Ic Chip And Method Of Manufacturing Same
App 20060060980 - TSAO; PEI-HAW ; et al. | 2006-03-23 |
Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assembly
Grant 7,015,066 - Tsao , et al. March 21, 2 | 2006-03-21 |
Stacked packaging methods and structures
App 20060043556 - Su; Chao-Yuan ; et al. | 2006-03-02 |
Method for burn-in testing semiconductor dice
Grant 6,998,860 - Wood , et al. February 14, 2 | 2006-02-14 |
Buildup substrate pad pre-solder bump manufacturing
Grant 6,960,518 - Tsao , et al. November 1, 2 | 2005-11-01 |
Method of wafer level chip scale packaging
Grant 6,939,789 - Huang , et al. September 6, 2 | 2005-09-06 |
Enhanced adhesion strength between mold resin and polyimide
App 20050167807 - Chen, Ken ; et al. | 2005-08-04 |
Thermal dispensing enhancement for high performance flip chip BGA (HPFCBGA)
App 20050127502 - Lee, Daniel ; et al. | 2005-06-16 |
Enhanced adhesion strength between mold resin and polyimide
Grant 6,884,662 - Chen , et al. April 26, 2 | 2005-04-26 |
Structure and method for low-stress concentration solder bumps
App 20040217482 - Wang, Chung Yu ; et al. | 2004-11-04 |
Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling
App 20040207078 - Su, Chao-Yuan ; et al. | 2004-10-21 |
Method of protecting a passivation layer during solder bump formation
Grant 6,782,897 - Wang , et al. August 31, 2 | 2004-08-31 |
Structure and method for low-stress concentration solder bumps
Grant 6,774,026 - Wang , et al. August 10, 2 | 2004-08-10 |
Under bump metallization structure
Grant 6,770,958 - Wang , et al. August 3, 2 | 2004-08-03 |
Electrical performance enhanced wafer level chip scale package with ground
Grant 6,656,827 - Tsao , et al. December 2, 2 | 2003-12-02 |
Method For Fabricating An Under Bump Metallization Structure
App 20030216039 - Wang, Chung Yu ; et al. | 2003-11-20 |
Method of wafer level chip scale packaging
App 20030211720 - Huang, Chender ; et al. | 2003-11-13 |
Method for protecting the front side of semiconductor wafers
Grant 6,638,837 - Tsao , et al. October 28, 2 | 2003-10-28 |
Method for fabricating an under bump metallization structure
Grant 6,596,619 - Wang , et al. July 22, 2 | 2003-07-22 |
Method for stress reduction in flip chip bump during flip chip mounting and underfill process steps of making a microelectronic assembly
App 20030045028 - Tsao, Pei-Haw ; et al. | 2003-03-06 |
Matrix form semiconductor package substrate having an electrode of serpentine shape and method for forming
App 20020145178 - Tsao, Pei-Haw ; et al. | 2002-10-10 |
Discrete die burn-in for nonpackaged die
Grant 6,091,250 - Wood , et al. July 18, 2 | 2000-07-18 |
Discrete die burn-in for nonpackaged die
Grant 6,091,251 - Wood , et al. July 18, 2 | 2000-07-18 |
Method and apparatus for wire bonding semiconductor dice to a leadframe
Grant 5,322,207 - Fogal , et al. June 21, 1 | 1994-06-21 |
Discrete die burn-in for non-packaged die
Grant 5,302,891 - Wood , et al. April 12, 1 | 1994-04-12 |
Method for producing high speed integrated circuits
Grant 5,214,845 - King , et al. June 1, 1 | 1993-06-01 |
Anti-bow zip lead frame design
Grant 5,150,194 - Brooks , et al. September 22, 1 | 1992-09-22 |
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