Huang; Chang-Pin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Huang; Chang-Pin.The latest application filed is for "antiviral agents".
Company Profile
13.30.33
- Huang; Chang-Pin - New Taipei City TW
- HUANG; CHANG-PIN - TAOYUAN COUNTY TW
- Huang; Chang-Pin - Yangmei Township TW
- Huang; Chang-Pin - Taoyuan TW
- Huang; Chang-Pin - Taoyuan City TW
- Huang; Chang-Pin - Yangmei TW
- Huang; Chang-Pin - Yangmei City TW
- Huang; Chang-Pin - Shoreline WA US
- Huang; Chang-Pin - Sanchong N/A TW
- Huang; Chang-Pin - Sanchong City TW
Patent Activity
| Patent | Date |
|---|---|
| Antiviral Agents App 20220098169 - Ly; Tai-Wei ; et al. | 2022-03-31 |
| Semiconductor Device And Fabricating Method Thereof App 20210225788 - HUANG; CHANG-PIN ; et al. | 2021-07-22 |
| Bump structure and fabricating method thereof Grant 10,985,121 - Huang , et al. April 20, 2 | 2021-04-20 |
| Semiconductor Device And Manufacturing Method Thereof App 20210082849 - SHAO; TUNG-LIANG ; et al. | 2021-03-18 |
| Package with solder regions aligned to recesses Grant 10,879,198 - Yang , et al. December 29, 2 | 2020-12-29 |
| Semiconductor device and manufacturing method thereof Grant 10,854,564 - Shao , et al. December 1, 2 | 2020-12-01 |
| Hollow metal pillar packaging scheme Grant 10,825,804 - Huang , et al. November 3, 2 | 2020-11-03 |
| Hollow Metal Pillar Packaging Scheme App 20190341377 - Huang; Chang-Pin ; et al. | 2019-11-07 |
| Hollow metal pillar packaging scheme Grant 10,354,986 - Huang , et al. July 16, 2 | 2019-07-16 |
| Package with Solder Regions Aligned to Recesses App 20190214356 - Yang; Ching-Jung ; et al. | 2019-07-11 |
| Method for manufacturing semiconductor structure Grant 10,269,737 - Huang , et al. | 2019-04-23 |
| Semiconductor Device And Fabricating Method Thereof App 20190115312 - HUANG; CHANG-PIN ; et al. | 2019-04-18 |
| Package with solder regions aligned to recesses Grant 10,262,958 - Yang , et al. | 2019-04-16 |
| Semiconductor device and fabricating method thereof Grant 10,163,828 - Huang , et al. Dec | 2018-12-25 |
| Semiconductor Device And Manufacturing Method Thereof App 20180331059 - SHAO; TUNG-LIANG ; et al. | 2018-11-15 |
| Semicondcutor structure and semiconductor manufacturing process thereof Grant 10,062,654 - Lai , et al. August 28, 2 | 2018-08-28 |
| Package with Solder Regions Aligned to Recesses App 20180226370 - Yang; Ching-Jung ; et al. | 2018-08-09 |
| Semiconductor device and manufacturing method thereof Grant 10,032,737 - Shao , et al. July 24, 2 | 2018-07-24 |
| Optical sensing system and associated electronic device Grant 9,943,239 - Kuo , et al. April 17, 2 | 2018-04-17 |
| Package with solder regions aligned to recesses Grant 9,947,630 - Yang , et al. April 17, 2 | 2018-04-17 |
| Hollow Metal Pillar Packaging Scheme App 20180040599 - Huang; Chang-Pin ; et al. | 2018-02-08 |
| Method For Manufacturing Semiconductor Structure App 20180033750 - HUANG; CHANG-PIN ; et al. | 2018-02-01 |
| Semicondcutor Structure And Semiconductor Manufacturing Process Thereof App 20180025997 - Lai; Yu-Chia ; et al. | 2018-01-25 |
| Conductive Terminal On Integrated Circuit App 20170372999 - Lai; Yu-Chia ; et al. | 2017-12-28 |
| Conductive terminal on integrated circuit Grant 9,852,985 - Lai , et al. December 26, 2 | 2017-12-26 |
| Hollow metal pillar packaging scheme Grant 9,812,434 - Huang , et al. November 7, 2 | 2017-11-07 |
| Package structures having height-adjusted molding members and methods of forming the same Grant 9,799,615 - Huang , et al. October 24, 2 | 2017-10-24 |
| Semiconductor structure and manufacturing method thereof Grant 9,786,618 - Huang , et al. October 10, 2 | 2017-10-10 |
| Hollow Metal Pillar Packaging Scheme App 20170271316 - Huang; Chang-Pin ; et al. | 2017-09-21 |
| Optical Sensing System And Associated Electronic Device App 20170251937 - KUO; HUNG-YI ; et al. | 2017-09-07 |
| Shadow pad for post-passivation interconnect structures Grant 9,748,212 - Liang , et al. August 29, 2 | 2017-08-29 |
| Hollow metal pillar packaging scheme Grant 9,679,883 - Huang , et al. June 13, 2 | 2017-06-13 |
| Package with Solder Regions Aligned to Recesses App 20170141054 - Yang; Ching-Jung ; et al. | 2017-05-18 |
| Semiconductor Structure And Manufacturing Method Thereof App 20170141056 - HUANG; CHANG-PIN ; et al. | 2017-05-18 |
| Integrated Fan-out (info) Package Structures And Methods Of Forming Same App 20170110425 - Huang; Chang-Pin ; et al. | 2017-04-20 |
| Integrated circuit structure and seal ring structure Grant 9,627,332 - Liang , et al. April 18, 2 | 2017-04-18 |
| Package with solder regions aligned to recesses Grant 9,559,044 - Yang , et al. January 31, 2 | 2017-01-31 |
| Semiconductor Device And Manufacturing Method Thereof App 20160372434 - SHAO; TUNG-LIANG ; et al. | 2016-12-22 |
| Interconnect Structures, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices App 20160322337 - Liang; Shih-Wei ; et al. | 2016-11-03 |
| Semiconductor device and manufacturing method thereof Grant 9,484,318 - Shao , et al. November 1, 2 | 2016-11-01 |
| MIM capacitor and method forming the same Grant 9,461,106 - Yang , et al. October 4, 2 | 2016-10-04 |
| MIM Capacitor and Method Forming the Same App 20160276426 - Yang; Ching-Jung ; et al. | 2016-09-22 |
| Hollow Metal Pillar Packaging Scheme App 20160225751 - Huang; Chang-Pin ; et al. | 2016-08-04 |
| Hollow metal pillar packaging scheme Grant 9,343,417 - Huang , et al. May 17, 2 | 2016-05-17 |
| Self-alignment structure for wafer level chip scale package Grant 9,318,456 - Lai , et al. April 19, 2 | 2016-04-19 |
| Semiconductor Device And Manufacturing Method Thereof App 20150235977 - SHAO; TUNG-LIANG ; et al. | 2015-08-20 |
| Self-alignment Structure For Wafer Level Chip Scale Package App 20150228599 - LAI; Yu-Chia ; et al. | 2015-08-13 |
| Self-alignment structure for wafer level chip scale package Grant 9,048,149 - Lai , et al. June 2, 2 | 2015-06-02 |
| Semiconductor Device And Fabricating Method Thereof App 20150137350 - HUANG; CHANG-PIN ; et al. | 2015-05-21 |
| Hollow Metal Pillar Packaging Scheme App 20150076689 - Huang; Chang-Pin ; et al. | 2015-03-19 |
| Reducing delamination between an underfill and a buffer layer in a bond structure Grant 8,963,328 - Yang , et al. February 24, 2 | 2015-02-24 |
| Self-alignment Structure for Wafer Level Chip Scale Package App 20150014846 - Lai; Yu-Chia ; et al. | 2015-01-15 |
| Package with Solder Regions Aligned to Recesses App 20140374899 - Yang; Ching-Jung ; et al. | 2014-12-25 |
| Reducing Delamination Between an Underfill and a Buffer Layer in a Bond Structure App 20140087522 - Yang; Ching-Jung ; et al. | 2014-03-27 |
| Reducing delamination between an underfill and a buffer layer in a bond structure Grant 8,610,267 - Yang , et al. December 17, 2 | 2013-12-17 |
| Enhanced Death Receptor Agonists App 20130064838 - Graves; Jonathan David ; et al. | 2013-03-14 |
| Heterocyclic compounds Grant 8,372,849 - Yen , et al. February 12, 2 | 2013-02-12 |
| Reducing Delamination Between an Underfill and a Buffer layer in a Bond Structure App 20120018875 - Yang; Ching-Jung ; et al. | 2012-01-26 |
| Heterocyclic Compounds App 20090264339 - Yen; Chi-Feng ; et al. | 2009-10-22 |
| Synthesis of amino-protected cyclohexane-1,4-diyldimethanamine and its derivatives App 20080242861 - Yen; Chi-Feng ; et al. | 2008-10-02 |
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