loadpatents
Patent applications and USPTO patent grants for Huang; Chang-Pin.The latest application filed is for "antiviral agents".
Patent | Date |
---|---|
Antiviral Agents App 20220098169 - Ly; Tai-Wei ;   et al. | 2022-03-31 |
Semiconductor Device And Fabricating Method Thereof App 20210225788 - HUANG; CHANG-PIN ;   et al. | 2021-07-22 |
Bump structure and fabricating method thereof Grant 10,985,121 - Huang , et al. April 20, 2 | 2021-04-20 |
Semiconductor Device And Manufacturing Method Thereof App 20210082849 - SHAO; TUNG-LIANG ;   et al. | 2021-03-18 |
Package with solder regions aligned to recesses Grant 10,879,198 - Yang , et al. December 29, 2 | 2020-12-29 |
Semiconductor device and manufacturing method thereof Grant 10,854,564 - Shao , et al. December 1, 2 | 2020-12-01 |
Hollow metal pillar packaging scheme Grant 10,825,804 - Huang , et al. November 3, 2 | 2020-11-03 |
Hollow Metal Pillar Packaging Scheme App 20190341377 - Huang; Chang-Pin ;   et al. | 2019-11-07 |
Hollow metal pillar packaging scheme Grant 10,354,986 - Huang , et al. July 16, 2 | 2019-07-16 |
Package with Solder Regions Aligned to Recesses App 20190214356 - Yang; Ching-Jung ;   et al. | 2019-07-11 |
Method for manufacturing semiconductor structure Grant 10,269,737 - Huang , et al. | 2019-04-23 |
Semiconductor Device And Fabricating Method Thereof App 20190115312 - HUANG; CHANG-PIN ;   et al. | 2019-04-18 |
Package with solder regions aligned to recesses Grant 10,262,958 - Yang , et al. | 2019-04-16 |
Semiconductor device and fabricating method thereof Grant 10,163,828 - Huang , et al. Dec | 2018-12-25 |
Semiconductor Device And Manufacturing Method Thereof App 20180331059 - SHAO; TUNG-LIANG ;   et al. | 2018-11-15 |
Semicondcutor structure and semiconductor manufacturing process thereof Grant 10,062,654 - Lai , et al. August 28, 2 | 2018-08-28 |
Package with Solder Regions Aligned to Recesses App 20180226370 - Yang; Ching-Jung ;   et al. | 2018-08-09 |
Semiconductor device and manufacturing method thereof Grant 10,032,737 - Shao , et al. July 24, 2 | 2018-07-24 |
Optical sensing system and associated electronic device Grant 9,943,239 - Kuo , et al. April 17, 2 | 2018-04-17 |
Package with solder regions aligned to recesses Grant 9,947,630 - Yang , et al. April 17, 2 | 2018-04-17 |
Hollow Metal Pillar Packaging Scheme App 20180040599 - Huang; Chang-Pin ;   et al. | 2018-02-08 |
Method For Manufacturing Semiconductor Structure App 20180033750 - HUANG; CHANG-PIN ;   et al. | 2018-02-01 |
Semicondcutor Structure And Semiconductor Manufacturing Process Thereof App 20180025997 - Lai; Yu-Chia ;   et al. | 2018-01-25 |
Conductive Terminal On Integrated Circuit App 20170372999 - Lai; Yu-Chia ;   et al. | 2017-12-28 |
Conductive terminal on integrated circuit Grant 9,852,985 - Lai , et al. December 26, 2 | 2017-12-26 |
Hollow metal pillar packaging scheme Grant 9,812,434 - Huang , et al. November 7, 2 | 2017-11-07 |
Package structures having height-adjusted molding members and methods of forming the same Grant 9,799,615 - Huang , et al. October 24, 2 | 2017-10-24 |
Semiconductor structure and manufacturing method thereof Grant 9,786,618 - Huang , et al. October 10, 2 | 2017-10-10 |
Hollow Metal Pillar Packaging Scheme App 20170271316 - Huang; Chang-Pin ;   et al. | 2017-09-21 |
Optical Sensing System And Associated Electronic Device App 20170251937 - KUO; HUNG-YI ;   et al. | 2017-09-07 |
Shadow pad for post-passivation interconnect structures Grant 9,748,212 - Liang , et al. August 29, 2 | 2017-08-29 |
Hollow metal pillar packaging scheme Grant 9,679,883 - Huang , et al. June 13, 2 | 2017-06-13 |
Package with Solder Regions Aligned to Recesses App 20170141054 - Yang; Ching-Jung ;   et al. | 2017-05-18 |
Semiconductor Structure And Manufacturing Method Thereof App 20170141056 - HUANG; CHANG-PIN ;   et al. | 2017-05-18 |
Integrated Fan-out (info) Package Structures And Methods Of Forming Same App 20170110425 - Huang; Chang-Pin ;   et al. | 2017-04-20 |
Integrated circuit structure and seal ring structure Grant 9,627,332 - Liang , et al. April 18, 2 | 2017-04-18 |
Package with solder regions aligned to recesses Grant 9,559,044 - Yang , et al. January 31, 2 | 2017-01-31 |
Semiconductor Device And Manufacturing Method Thereof App 20160372434 - SHAO; TUNG-LIANG ;   et al. | 2016-12-22 |
Interconnect Structures, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices App 20160322337 - Liang; Shih-Wei ;   et al. | 2016-11-03 |
Semiconductor device and manufacturing method thereof Grant 9,484,318 - Shao , et al. November 1, 2 | 2016-11-01 |
MIM capacitor and method forming the same Grant 9,461,106 - Yang , et al. October 4, 2 | 2016-10-04 |
MIM Capacitor and Method Forming the Same App 20160276426 - Yang; Ching-Jung ;   et al. | 2016-09-22 |
Hollow Metal Pillar Packaging Scheme App 20160225751 - Huang; Chang-Pin ;   et al. | 2016-08-04 |
Hollow metal pillar packaging scheme Grant 9,343,417 - Huang , et al. May 17, 2 | 2016-05-17 |
Self-alignment structure for wafer level chip scale package Grant 9,318,456 - Lai , et al. April 19, 2 | 2016-04-19 |
Semiconductor Device And Manufacturing Method Thereof App 20150235977 - SHAO; TUNG-LIANG ;   et al. | 2015-08-20 |
Self-alignment Structure For Wafer Level Chip Scale Package App 20150228599 - LAI; Yu-Chia ;   et al. | 2015-08-13 |
Self-alignment structure for wafer level chip scale package Grant 9,048,149 - Lai , et al. June 2, 2 | 2015-06-02 |
Semiconductor Device And Fabricating Method Thereof App 20150137350 - HUANG; CHANG-PIN ;   et al. | 2015-05-21 |
Hollow Metal Pillar Packaging Scheme App 20150076689 - Huang; Chang-Pin ;   et al. | 2015-03-19 |
Reducing delamination between an underfill and a buffer layer in a bond structure Grant 8,963,328 - Yang , et al. February 24, 2 | 2015-02-24 |
Self-alignment Structure for Wafer Level Chip Scale Package App 20150014846 - Lai; Yu-Chia ;   et al. | 2015-01-15 |
Package with Solder Regions Aligned to Recesses App 20140374899 - Yang; Ching-Jung ;   et al. | 2014-12-25 |
Reducing Delamination Between an Underfill and a Buffer Layer in a Bond Structure App 20140087522 - Yang; Ching-Jung ;   et al. | 2014-03-27 |
Reducing delamination between an underfill and a buffer layer in a bond structure Grant 8,610,267 - Yang , et al. December 17, 2 | 2013-12-17 |
Enhanced Death Receptor Agonists App 20130064838 - Graves; Jonathan David ;   et al. | 2013-03-14 |
Heterocyclic compounds Grant 8,372,849 - Yen , et al. February 12, 2 | 2013-02-12 |
Reducing Delamination Between an Underfill and a Buffer layer in a Bond Structure App 20120018875 - Yang; Ching-Jung ;   et al. | 2012-01-26 |
Heterocyclic Compounds App 20090264339 - Yen; Chi-Feng ;   et al. | 2009-10-22 |
Synthesis of amino-protected cyclohexane-1,4-diyldimethanamine and its derivatives App 20080242861 - Yen; Chi-Feng ;   et al. | 2008-10-02 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.