Huang; Chang-Chia
Patent Applications and Registrations
Patent applications and USPTO patent grants for Huang; Chang-Chia.The latest application filed is for "electronic devices with deformation-resistant displays".
Company Profile
10.29.35
- Huang; Chang-Chia - Cupertino CA
- Huang; Chang-Chia - San Jose CA
- Huang; Chang-Chia - Hsinchu TW
- Huang; Chang-Chia - Hsinchu City TW
- Huang; Chang-Chia - Hsin-Chu TW
Patent Activity
| Patent | Date |
|---|---|
| Wearable bands with embedded circuitry Grant 11,442,503 - Hsu , et al. September 13, 2 | 2022-09-13 |
| Electronic devices with flexible display cover layers Grant 11,444,268 - Kim , et al. September 13, 2 | 2022-09-13 |
| Electronic Devices With Deformation-Resistant Displays App 20220270522 - Afsar; Yasmin F. ; et al. | 2022-08-25 |
| Hybrid coverlay/window structure for flexible display applications Grant 11,402,868 - Kim , et al. August 2, 2 | 2022-08-02 |
| Electronic Devices With Flexible Displays App 20220077352 - Huang; Chang-Chia ; et al. | 2022-03-10 |
| Contact Pad for Semiconductor Device App 20210175191 - Huang; Chang-Chia ; et al. | 2021-06-10 |
| Hybrid Coverlay/window Structure For Flexible Display Applications App 20210096595 - Kim; Hoon Sik ; et al. | 2021-04-01 |
| Contact pad for semiconductor device Grant 10,930,605 - Huang , et al. February 23, 2 | 2021-02-23 |
| Electronic Devices Having Folding Expandable Displays App 20200383219 - Hale; Owen D. ; et al. | 2020-12-03 |
| Hybrid coverlay/window structure for flexible display applications Grant 10,817,016 - Kim , et al. October 27, 2 | 2020-10-27 |
| Electronic Devices With Flexible Display Cover Layers App 20200313111 - Kim; Hoon Sik ; et al. | 2020-10-01 |
| Packaging device and method of making the same Grant 10,700,033 - Huang , et al. | 2020-06-30 |
| Wearable Bands With Embedded Circuitry App 20200192423 - Hsu; Yung-Yu ; et al. | 2020-06-18 |
| Hybrid Coverlay/window Structure For Flexible Display Applications App 20200097044 - Kim; Hoon Sik ; et al. | 2020-03-26 |
| Contact Pad for Semiconductor Device App 20200051936 - Huang; Chang-Chia ; et al. | 2020-02-13 |
| Contact pad for semiconductor device Grant 10,453,813 - Huang , et al. Oc | 2019-10-22 |
| Packaging Device And Method Of Making The Same App 20180350764 - Huang; Chang-Chia ; et al. | 2018-12-06 |
| Packaging device and method of making the same Grant 10,050,001 - Huang , et al. August 14, 2 | 2018-08-14 |
| Mechanisms for forming fine-pitch copper bump structures Grant 9,978,656 - Lin , et al. May 22, 2 | 2018-05-22 |
| Conductive contacts having varying widths and method of manufacturing same Grant 9,953,939 - Lin , et al. April 24, 2 | 2018-04-24 |
| Contact Pad For Semiconductor Device App 20170301637 - Huang; Chang-Chia ; et al. | 2017-10-19 |
| Semiconductor device and manufacturing method thereof Grant 9,786,520 - Liu , et al. October 10, 2 | 2017-10-10 |
| Contact pad for semiconductor device Grant 9,691,686 - Huang , et al. June 27, 2 | 2017-06-27 |
| Fan-out stacked system in package (SIP) having dummy dies and methods of making the same Grant 9,613,931 - Lin , et al. April 4, 2 | 2017-04-04 |
| Conductive Contacts Having Varying Widths And Method Of Manufacturing Same App 20170069587 - Lin; Yen-Liang ; et al. | 2017-03-09 |
| Methods and apparatus for bump-on-trace chip packaging Grant 9,583,367 - Huang , et al. February 28, 2 | 2017-02-28 |
| Packaging Device And Method Of Making The Same App 20170005060 - Huang; Chang-Chia ; et al. | 2017-01-05 |
| Conductive contacts having varying widths and method of manufacturing same Grant 9,508,668 - Lin , et al. November 29, 2 | 2016-11-29 |
| Fan-out Stacked System In Package (sip) Having Dummy Dies And Methods Of Making The Same App 20160322330 - Lin; Tsung-Shu ; et al. | 2016-11-03 |
| Packaging device and method of making the same Grant 9,449,933 - Huang , et al. September 20, 2 | 2016-09-20 |
| Semiconductor Device And Manufacturing Method Thereof App 20160071744 - LIU; YU-CHIH ; et al. | 2016-03-10 |
| Methods and Apparatus for bump-on-trace Chip Packaging App 20160035591 - Huang; Chang-Chia ; et al. | 2016-02-04 |
| Semiconductor device and manufacturing method thereof Grant 9,209,046 - Liu , et al. December 8, 2 | 2015-12-08 |
| Contact Pad for Semiconductor Device App 20150348877 - Huang; Chang-Chia ; et al. | 2015-12-03 |
| Conductive Contacts Having Varying Widths And Method Of Manufacturing Same App 20150325542 - Lin; Yen-Liang ; et al. | 2015-11-12 |
| Methods and apparatus for bump-on-trace chip packaging Grant 9,165,796 - Lin , et al. October 20, 2 | 2015-10-20 |
| Conductive contacts having varying widths and method of manufacturing same Grant 9,105,530 - Lin , et al. August 11, 2 | 2015-08-11 |
| Semiconductor Device And Manufacturing Method Thereof App 20150093856 - LIU; YU-CHIH ; et al. | 2015-04-02 |
| Semiconductor structure and manufacturing method thereof Grant 8,987,915 - Yu , et al. March 24, 2 | 2015-03-24 |
| Semiconductor Structure And Manufacturing Method Thereof App 20150061162 - YU; CHEN-HUA ; et al. | 2015-03-05 |
| Elongated bumps in integrated circuit devices Grant 8,922,006 - Lin , et al. December 30, 2 | 2014-12-30 |
| Methods and Apparatus for bump-on-trace Chip Packaging App 20140346673 - Lin; Yen-Liang ; et al. | 2014-11-27 |
| Electrical connection structure Grant 8,883,628 - Chuang , et al. November 11, 2 | 2014-11-11 |
| Fan-out package comprising bulk metal Grant 8,866,285 - Hu , et al. October 21, 2 | 2014-10-21 |
| Metal Bump and Method of Manufacturing Same App 20140077365 - Lin; Yen-Liang ; et al. | 2014-03-20 |
| Fan-Out Package Comprising Bulk Metal App 20140061937 - Hu; Yen-Chang ; et al. | 2014-03-06 |
| Electrical Connection Structure App 20130288473 - Chuang; Yao-Chun ; et al. | 2013-10-31 |
| Methods and Apparatus for bump-on-trace Chip Packaging App 20130277828 - Huang; Chang-Chia ; et al. | 2013-10-24 |
| Elongated Bumps in Integrated Circuit Devices App 20130256874 - Lin; Yen-Liang ; et al. | 2013-10-03 |
| Packaging Device And Method Of Making The Same App 20130256870 - HUANG; Chang-Chia ; et al. | 2013-10-03 |
| Electrical connection structure Grant 8,476,759 - Chuang , et al. July 2, 2 | 2013-07-02 |
| Electrical Connection Structure App 20130134563 - Chuang; Yao-Chun ; et al. | 2013-05-30 |
| Mechanisms For Forming Fine-pitch Copper Bump Structures App 20130127045 - LIN; Tsung-Shu ; et al. | 2013-05-23 |
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