Huan; Ni Chin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Huan; Ni Chin.The latest application filed is for "heat dissipation module with multiple porosities".
- Huan; Ni Chin - Pingzhen City TW
| Patent | Date |
|---|---|
| Plasticized Ceramic Thermal Dissipation Module App 20130271921 - Huan; Ni Chin | 2013-10-17 |
| Heat Dissipation Module With Multiple Porosities App 20130271919 - Huan; Ni Chin | 2013-10-17 |
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