Hua; Zi Qun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hua; Zi Qun.The latest application filed is for "method and structure for cutting dense line patterns using self-aligned double patterning".

Company Profile

12.11.14

Hua; Zi Qun - Wuhan CN
Hua; Zi Qun - Hubei CN
Hua; Zi Qun - Wuhan City CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device with exposed input/output pad in recess Grant 11,430,775 - Chen , et al. August 30, 2	2022-08-30
Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same Grant 11,430,756 - Huo , et al. August 30, 2	2022-08-30
Method And Structure For Cutting Dense Line Patterns Using Self-aligned Double Patterning App 20220130671 - FAN; Lu Ming ; et al.	2022-04-28
Method and structure for cutting dense line patterns using self-aligned double patterning Grant 11,251,043 - Fan , et al. February 15, 2	2022-02-15
Fabricating Method Of Semiconductor Device App 20210407984 - Chen; He ; et al.	2021-12-30
Hybrid bonding using dummy bonding contacts and dummy interconnects Grant 11,205,619 - Wang , et al. December 21, 2	2021-12-21
Hybrid bonding using dummy bonding contacts Grant 11,049,834 - Wang , et al. June 29, 2	2021-06-29
Self-aligned Contacts In Three-dimensional Memory Devices And Methods For Forming The Same App 20210183765 - Zhu; Hongbin ; et al.	2021-06-17
Semiconductor Device And Fabricating Method Thereof App 20210066274 - Chen; He ; et al.	2021-03-04
Hybrid Bonding Using Dummy Bonding Contacts App 20210035941 - Wang; Tao ; et al.	2021-02-04
Self-aligned Contacts In Three-dimensional Memory Devices And Methods For Forming The Same App 20210020566 - Zhu; Hongbin ; et al.	2021-01-21
Bonded Semiconductor Structures Having Bonding Contacts Made Of Indiffusible Conductive Materials And Methods For Forming The Same App 20200381384 - Huo; Zongliang ; et al.	2020-12-03
Memory structure and method for forming the same Grant 10,840,125 - Dong , et al. November 17, 2	2020-11-17
Hybrid bonding using dummy bonding contacts Grant 10,833,042 - Wang , et al. November 10, 2	2020-11-10
Hybrid Bonding Using Dummy Bonding Contacts And Dummy Interconnects App 20200335450 - Wang; Tao ; et al.	2020-10-22
Method And Structure For Cutting Dense Line Patterns Using Self-aligned Double Patterning App 20200321215 - FAN; Lu Ming ; et al.	2020-10-08
Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same Grant 10,784,225 - Huo , et al. Sept	2020-09-22
Hybrid bonding using dummy bonding contacts and dummy interconnects Grant 10,748,851 - Wang , et al. A	2020-08-18
Bonded Semiconductor Structures Having Bonding Contacts Made Of Indiffusible Conductive Materials And Methods For Forming The Sa App 20200258857 - A1	2020-08-13
Hybrid Bonding Using Dummy Bonding Contacts App 20200243473 - Wang; Tao ; et al.	2020-07-30
Hybrid Bonding Using Dummy Bonding Contacts And Dummy Interconnects App 20200243455 - Wang; Tao ; et al.	2020-07-30
Method and structure for cutting dense line patterns using self-aligned double patterning Grant 10,727,056 - Fan , et al.	2020-07-28
Memory Structure And Method For Forming The Same App 20200035542 - Dong; Jin Wen ; et al.	2020-01-30
Memory structure and forming method thereof Grant 10,497,708 - Chen , et al. De	2019-12-03
Method And Structure For Cutting Dense Line Patterns Using Self-aligned Double Patterning App 20190157082 - FAN; Lu Ming ; et al.	2019-05-23

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