Hua; Yaping

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hua; Yaping.The latest application filed is for "leakage detection method using micromachined-thermal-convection accelerometer".

Company Profile

0.4.4

Hua; Yaping - Jiangsu CN
Hua; Yaping - Wuxi CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Leakage detection method using micromachined-thermal-convection accelerometer Grant 8,011,226 - Hua , et al. September 6, 2	2011-09-06
Leakage detection method using micromachined-thermal-convection accelerometer App 20100050747 - Hua; Yaping ; et al.	2010-03-04
Method of wafer-level packaging using low-aspect ratio through-wafer holes Grant 7,495,462 - Hua , et al. February 24, 2	2009-02-24
Single chip tri-axis accelerometer Grant 7,424,826 - Hua , et al. September 16, 2	2008-09-16
Single chip tri-axis accelerometer App 20070101813 - Hua; Yaping ; et al.	2007-05-10
Method of wafer-level packaging using low-aspect ratio through-wafer holes App 20060273430 - Hua; Yaping ; et al.	2006-12-07
Method of etching a deep trench in a substrate and method of fabricating on-chip devices and micro-machined structures using the same Grant 6,712,983 - Zhao , et al. March 30, 2	2004-03-30
Method of etching a deep trench in a substrate and method of fabricating on-chip devices and micro-machined structures using the same App 20020148807 - Zhao, Yang ; et al.	2002-10-17

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