| Patent | Date |
|---|
Device with out-plane inductors
Grant 11,282,633 - Hua , et al. March 22, 2 | 2022-03-22 |
Techniques for die stacking and associated configurations
Grant 11,222,863 - Hua , et al. January 11, 2 | 2022-01-11 |
Techniques For Die Stacking And Associated Configurations
App 20210193613 - HUA; Fay ; et al. | 2021-06-24 |
System on package architecture including structures on die back side
Grant 10,777,538 - Hua , et al. Sept | 2020-09-15 |
Electronic devices with components formed by late binding using self-assembled monolayers
Grant 10,734,236 - Oster , et al. | 2020-08-04 |
Sam assisted selective e-less plating on packaging materials
Grant 10,697,065 - Hua , et al. | 2020-06-30 |
Non-planar on-package via capacitor
Grant 10,595,410 - Hua , et al. | 2020-03-17 |
Device With Out-plane Inductors
App 20200082969 - Hua; Fay ; et al. | 2020-03-12 |
System On Package Architecture Including Structures On Die Back Side
App 20190326258 - HUA; Fay ; et al. | 2019-10-24 |
Electronic Devices With Components Formed By Late Binding Using Self-assembled Monolayers
App 20190259622 - OSTER; Sasha N. ; et al. | 2019-08-22 |
Solder contacts for socket assemblies
Grant 10,321,573 - Hua , et al. | 2019-06-11 |
System on package architecture including structures on die back side
Grant 10,304,804 - Hua , et al. | 2019-05-28 |
Electronic devices with components formed by late binding using self-assembled monolayers
Grant 10,304,686 - Oster , et al. | 2019-05-28 |
Sam Assisted Selective E-less Plating On Packaging Materials
App 20180305818 - HUA; Fay ; et al. | 2018-10-25 |
System On Package Architecture Including Structures On Die Back Side
App 20180286834 - HUA; Fay ; et al. | 2018-10-04 |
Electronic Devices With Components Formed By Late Binding Using Self-assembled Monolayers
App 20180286687 - OSTER; Sasha N. ; et al. | 2018-10-04 |
Wearable Device Platform Apparatus And Method
App 20180233710 - Hua; Fay ; et al. | 2018-08-16 |
Solder Contacts For Socket Assemblies
App 20180192519 - HUA; Fay ; et al. | 2018-07-05 |
Non-planar On-package Via Capacitor
App 20180098428 - HUA; Fay ; et al. | 2018-04-05 |
High Density Package On Package Devices Created Through A Self Assembly Monolayer Assisted Laser Direct Structuring Process On Mold Compound
App 20180096975 - Hua; Fay ; et al. | 2018-04-05 |
Zn Doped Solders On Cu Surface Finish For Thin Fli Application
App 20180047689 - HUA; Fay | 2018-02-15 |
Solder contacts for socket assemblies
Grant 9,860,988 - Hua , et al. January 2, 2 | 2018-01-02 |
Local dense patch for board assembly utilizing laser structuring metallization process
Grant 9,824,962 - Hua , et al. November 21, 2 | 2017-11-21 |
Sam Assisted Selective E-less Plating On Packaging Materials
App 20170154790 - HUA; Fay ; et al. | 2017-06-01 |
Substrate On Substrate Package
App 20170053858 - Krajniak; Jan ; et al. | 2017-02-23 |
Solder Contacts For Socket Assemblies
App 20160338199 - HUA; Fay ; et al. | 2016-11-17 |
Apparatus to minimize thermal impedance using copper on die backside
Grant 9,406,582 - Hua , et al. August 2, 2 | 2016-08-02 |
Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
Grant 8,441,118 - Hua May 14, 2 | 2013-05-14 |
Composite solder TIM for electronic package
Grant 8,242,602 - Fitzgerald , et al. August 14, 2 | 2012-08-14 |
Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
Grant 7,960,831 - Hua , et al. June 14, 2 | 2011-06-14 |
Thermal interface material with carbon nanotubes and particles
Grant 7,886,813 - Hua , et al. February 15, 2 | 2011-02-15 |
Composite solder TIM for electronic package
Grant 7,816,250 - Fitzgerald , et al. October 19, 2 | 2010-10-19 |
Composite Solder Tim For Electronic Package
App 20100259890 - Fitzgerald; Tom ; et al. | 2010-10-14 |
Method for compensating for CTE mismatch using phase change lead-free super plastic solders
Grant 7,776,651 - Hua August 17, 2 | 2010-08-17 |
Electronic assemblies with hot spot cooling and methods relating thereto
Grant 7,704,798 - Hua , et al. April 27, 2 | 2010-04-27 |
Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
App 20100047971 - Hua; Fay | 2010-02-25 |
Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
Grant 7,615,476 - Hua November 10, 2 | 2009-11-10 |
Low temperature solder metallurgy and process for packaging applications and structures formed thereby
Grant 7,560,373 - Hua July 14, 2 | 2009-07-14 |
Interconnect shunt used for current distribution and reliability redundancy
Grant 7,524,754 - Bohr , et al. April 28, 2 | 2009-04-28 |
Nano-sized metals and alloys, and methods of assembling packages containing same
Grant 7,524,351 - Hua , et al. April 28, 2 | 2009-04-28 |
Electronic Assemblies With Hot Spot Cooling And Methods Relating Thereto
App 20090093072 - Hua; Fay ; et al. | 2009-04-09 |
Electronic assembly with hot spot cooling
Grant 7,489,033 - Hua , et al. February 10, 2 | 2009-02-10 |
Apparatus To Minimize Thermal Impedance Using Copper On Die Backside
App 20080296754 - Hua; Fay ; et al. | 2008-12-04 |
Reactive solder material
App 20080293188 - Hua; Fay ; et al. | 2008-11-27 |
Apparatus to minimize thermal impedance using copper on die backside
Grant 7,449,780 - Hua , et al. November 11, 2 | 2008-11-11 |
Capillary underflow integral heat spreader
Grant 7,439,617 - Deppisch , et al. October 21, 2 | 2008-10-21 |
Reactive solder material
Grant 7,436,058 - Hua , et al. October 14, 2 | 2008-10-14 |
Electronic Assembly Having An Indium Wetting Layer On A Thermally Conductive Body
App 20080153210 - HUA; Fay ; et al. | 2008-06-26 |
Capping copper bumps
Grant 7,391,112 - Li , et al. June 24, 2 | 2008-06-24 |
Electronic Assembly With Hot Spot Cooling
App 20080111234 - Hua; Fay ; et al. | 2008-05-15 |
Electronic assembly having an indium wetting layer on a thermally conductive body
Grant 7,362,580 - Hua , et al. April 22, 2 | 2008-04-22 |
Composite solder TIM for electronic package
App 20080090405 - Fitzgerald; Tom ; et al. | 2008-04-17 |
Capillary underflow integral heat spreader
App 20080017975 - Deppisch; Carl ; et al. | 2008-01-24 |
Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
Grant 7,314,819 - Hua , et al. January 1, 2 | 2008-01-01 |
Compliant conductive interconnects
App 20070297151 - Mosley; Larry E. ; et al. | 2007-12-27 |
Ball-limiting Metallurgies, Solder Bump Compositions Used Therewith, Packages Assembled Thereby, And Methods Of Assembling Same
App 20070284741 - Hua; Fay ; et al. | 2007-12-13 |
Device and method for package warp compensation in an integrated heat spreader
Grant 7,256,058 - Fitzgerald , et al. August 14, 2 | 2007-08-14 |
Electromigration barrier layers for solder joints
Grant 7,242,097 - Hua July 10, 2 | 2007-07-10 |
Methods to deposit metal alloy barrier layers
Grant 7,223,695 - Zhong , et al. May 29, 2 | 2007-05-29 |
Interconnect shunt used for current distribution and reliability redundancy
Grant 7,208,830 - Bohr , et al. April 24, 2 | 2007-04-24 |
Device And Method For Package Warp Compensation In An Integrated Heat Spreader
App 20070020813 - Fitzgerald; Thomas J. ; et al. | 2007-01-25 |
Thermal interface apparatus, systems, and methods
Grant 7,164,585 - Jadhav , et al. January 16, 2 | 2007-01-16 |
Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
App 20070004086 - Hua; Fay ; et al. | 2007-01-04 |
Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
App 20070001280 - Hua; Fay | 2007-01-04 |
Thermal interface material and method
App 20070001310 - Hua; Fay ; et al. | 2007-01-04 |
Capping copper bumps
App 20060276022 - Li; Jianxing ; et al. | 2006-12-07 |
Electromigration barrier layers for solder joints
Grant 7,122,460 - Hua October 17, 2 | 2006-10-17 |
Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same
Grant 7,111,771 - Hua September 26, 2 | 2006-09-26 |
Device and method for package warp compensation in an integrated heat spreader
Grant 7,102,226 - Fitzgerald , et al. September 5, 2 | 2006-09-05 |
Device and system for heat spreader with controlled thermal expansion
Grant 7,081,669 - Fitzgerald , et al. July 25, 2 | 2006-07-25 |
Interconnect shunt used for current distribution and reliability redundancy
App 20060097375 - Bohr; Mark ; et al. | 2006-05-11 |
Polymer with solder pre-coated fillers for thermal interface materials
Grant 7,036,573 - Koning , et al. May 2, 2 | 2006-05-02 |
Methods to deposit metal alloy barrier layers
App 20060071340 - Zhong; Ting ; et al. | 2006-04-06 |
Nano-sized metals and alloys, and methods of assembling packages containing same
App 20060068216 - Hua; Fay ; et al. | 2006-03-30 |
Interconnect shunt used for current distribution and reliability redundancy
App 20060001178 - Bohr; Mark ; et al. | 2006-01-05 |
Electronic assembly having an indium wetting layer on a thermally conductive body
App 20050280142 - Hua, Fay ; et al. | 2005-12-22 |
Integrated heat spreader package for heat transfer and for bond line thickness control and process of making
App 20050157471 - Whittenburg, Kris J. ; et al. | 2005-07-21 |
Method for compensating for CTE mismatch using phase change lead-free super plastic solders
App 20050153523 - Hua, Fay | 2005-07-14 |
Device and method for package warp compensation in an integrated heat spreader
App 20050139998 - Fitzgerald, Thomas J. ; et al. | 2005-06-30 |
Device And System For Heat Spreader With Controlled Thermal Expansion
App 20050121775 - Fitzgerald, Thomas J. ; et al. | 2005-06-09 |
Integrated heat spreader package for heat transfer and for bond line thickness control and process of making
Grant 6,867,978 - Whittenburg , et al. March 15, 2 | 2005-03-15 |
Low temperature microelectronic die to substrate interconnects
Grant 6,857,557 - Hua February 22, 2 | 2005-02-22 |
Tin/indium lead-free solders for low stress chip attachment
App 20050029675 - Hua, Fay | 2005-02-10 |
Device and method for package warp compensation in an integrated heat spreader
Grant 6,848,172 - Fitzgerald , et al. February 1, 2 | 2005-02-01 |
Electromigration barrier layers for solder joints
App 20040262778 - Hua, Fay | 2004-12-30 |
Electromigration barrier layers for solder joints
App 20040262726 - Hua, Fay | 2004-12-30 |
Electronic assembly having solder thermal interface between a die substrate and a heat spreader
Grant 6,817,091 - Fitzgerald , et al. November 16, 2 | 2004-11-16 |
Polymer solder hybrid
Grant 6,813,153 - Koning , et al. November 2, 2 | 2004-11-02 |
Apparatus and method to minimize thermal impedance using copper on die backside
App 20040188817 - Hua, Fay ; et al. | 2004-09-30 |
Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same
App 20040188503 - Hua, Fay | 2004-09-30 |
Phase change lead-free super plastic solders
App 20040187976 - Hua, Fay | 2004-09-30 |
Thermal interface apparatus, systems, and methods
App 20040190263 - Jadhav, Susheel G. ; et al. | 2004-09-30 |
Low temperature microelectronic die to substrate interconnects
App 20040118586 - Hua, Fay | 2004-06-24 |
Integrated heat spreader package for heat transfer and for bond line thickness control and process of making
App 20040066630 - Whittenburg, Kris J. ; et al. | 2004-04-08 |
Polymer solder hybrid
App 20040052050 - Koning, Paul A. ; et al. | 2004-03-18 |
Reactive solder material
App 20030209801 - Hua, Fay ; et al. | 2003-11-13 |
Polymer with solder pre-coated fillers for thermal interface materials
App 20030150604 - Koning, Paul A. ; et al. | 2003-08-14 |
Device and method for package warp compensation in an integrated heat spreader
App 20030115739 - Fitzgerald, Thomas J. ; et al. | 2003-06-26 |
Electronic assembly having solder thermal interface between a die substrate and a heat spreader
App 20030090875 - Fitzgerald, Thomas J. ; et al. | 2003-05-15 |
Electronic assembly having solder thermal interface between a die substrate and a heat spreader
Grant 6,504,723 - Fitzgerald , et al. January 7, 2 | 2003-01-07 |
Electronic assembly having a wetting layer on a thermally conductive heat spreader
Grant 6,504,242 - Deppisch , et al. January 7, 2 | 2003-01-07 |
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