| Patent | Date |
|---|
Semiconductor Structure And Method For Forming The Same
App 20220208999 - HUA; Chang-Hwang ; et al. | 2022-06-30 |
Gate-sinking pHEMTs having extremely uniform pinch-off/threshold voltage
Grant 11,177,379 - Chang , et al. November 16, 2 | 2021-11-16 |
Gate-sinking Phemts Having Extremely Uniform Pinch-off/threshold Voltage
App 20200403091 - CHANG; Chia-Ming ; et al. | 2020-12-24 |
Semiconductor Integrated Circuit And Circuit Layout Method Thereof
App 20200373225 - CHANG; Chih-Hsien ; et al. | 2020-11-26 |
Ohmic metal structure for GaN device
Grant 10,720,390 - Hua , et al. | 2020-07-21 |
Structure for reducing compound semiconductor wafer distortion
Grant 10,410,979 - Hua , et al. Sept | 2019-09-10 |
Compound semiconductors having an improved high temperature resistant backside metallization
Grant 10,374,129 - Hua , et al. | 2019-08-06 |
OHMIC METAL STRUCTURE FOR GaN DEVICE
App 20190131244 - HUA; Chang-Hwang ; et al. | 2019-05-02 |
High Temperature Resistant Backside Metallization for Compound Semiconductors
App 20190096755 - HUA; Chang-Hwang ; et al. | 2019-03-28 |
Structure For Reducing Compound Semiconductor Wafer Distortion
App 20180366418 - HUA; Chang-Hwang ; et al. | 2018-12-20 |
Structure For Reducing Compound Semiconductor Wafer Distortion
App 20180366913 - HUA; Chang-Hwang ; et al. | 2018-12-20 |
Structure For Reducing Compound Semiconductor Wafer Distortion
App 20180366417 - HUA; Chang-Hwang ; et al. | 2018-12-20 |
Structure for reducing compound semiconductor wafer distortion
Grant 10,158,212 - Hua , et al. Dec | 2018-12-18 |
Method for fabricating a semiconductor integrated chip
Grant 10,096,583 - Takatani , et al. October 9, 2 | 2018-10-09 |
Advanced Moisture Resistant Structure of Compound Semiconductor Integrated Circuits
App 20170330843 - Hua; Chang Hwang ; et al. | 2017-11-16 |
Gate Metal Structure for Compound Semiconductor Devices
App 20170222011 - HUA; Chang-Hwang ; et al. | 2017-08-03 |
Stacked structure of semiconductor chips having via holes and metal bumps
Grant 9,704,829 - Hua , et al. July 11, 2 | 2017-07-11 |
Schottky Barrier Semiconductor Device Having a Nanoscale Film Interface
App 20170194451 - HUA; Chang-Hwang ; et al. | 2017-07-06 |
Semiconductor integrated circuit
Grant 9,673,186 - Takatani , et al. June 6, 2 | 2017-06-06 |
Method for Fabricating a Semiconductor Integrated Chip
App 20170084592 - TAKATANI; Shinichiro ; et al. | 2017-03-23 |
Structure of backside copper metallization for semiconductor devices and a fabrication method thereof
Grant 9,548,276 - Chen , et al. January 17, 2 | 2017-01-17 |
Stacked Structure Of Semiconductor Chips Having Via Holes And Metal Bumps
App 20160035707 - HUA; Chang-Hwang ; et al. | 2016-02-04 |
Structure Of Backside Copper Metallization For Semiconductor Devices And A Fabrication Method Thereof
App 20160020178 - CHEN; JASON ; et al. | 2016-01-21 |
High Breakdown Voltage Metal-insulator-metal Capacitor
App 20150318342 - HUA; Chang-Hwang ; et al. | 2015-11-05 |
High breakdown voltage metal-insulator-metal capacitor
Grant 9,178,007 - Hua , et al. November 3, 2 | 2015-11-03 |
Semiconductor Integrated Circuit
App 20150206870 - TAKATANI; Shinichiro ; et al. | 2015-07-23 |
Electroless plating apparatus and method
Grant 8,911,551 - Chen , et al. December 16, 2 | 2014-12-16 |
Fabrication method for producing semiconductor chips with enhanced die strength
Grant 8,835,283 - Hua September 16, 2 | 2014-09-16 |
Structure Of A Semiconductor Chip With Substrate Via Holes And Metal Bumps And A Fabrication Method Thereof
App 20140252602 - HUA; Chang-Hwang ; et al. | 2014-09-11 |
Semiconductor Integrated Circuit
App 20140209926 - TAKATANI; Shinichiro ; et al. | 2014-07-31 |
Fabrication Method For Producing Semiconductor Chips With Enhanced Die Strength
App 20130337634 - HUA; Chang-Hwang | 2013-12-19 |
Structure Of Backside Copper Metallization For Semiconductor Devices And A Fabrication Method Thereof
App 20130277845 - CHEN; Jason ; et al. | 2013-10-24 |
Copper Interconnect for III-V Compound Semiconductor Devices
App 20130207266 - Hua; Chang-Hwang ; et al. | 2013-08-15 |
Method of processing backside copper layer for semiconductor chips
Grant 8,497,206 - Hua , et al. July 30, 2 | 2013-07-30 |
Structure Of Semiconductor Chips With Enhanced Die Strength And A Fabrication Method Thereof
App 20130099250 - HUA; Chang-Hwang | 2013-04-25 |
Electroless Plating Apparatus And Method
App 20130034959 - CHEN; Jason ; et al. | 2013-02-07 |
Method for mounting a thinned semiconductor wafer on a carrier substrate
Grant 8,033,011 - Chou , et al. October 11, 2 | 2011-10-11 |
Method of using an electroless plating for depositing a metal seed layer for the subsequent plated backside metal film
Grant 8,003,532 - Hua , et al. August 23, 2 | 2011-08-23 |
Method Of Processing Backside Copper Layer For Semiconductor Chips
App 20110201192 - HUA; Chang-Hwang ; et al. | 2011-08-18 |
Method of using an electroless plating for depositing a metal seed layer for the subsequent plated backside metal film
App 20110059610 - Hua; Chang-Hwang ; et al. | 2011-03-10 |
Method for mounting a thinned semiconductor wafer on a carrier substrate
App 20100035405 - Chou; Jason ; et al. | 2010-02-11 |
Method for forming self-aligned t-shaped transistor electrode
Grant 5,288,660 - Hua , et al. February 22, 1 | 1994-02-22 |
Method for the simultaneous formation of via-holes and wraparound plating on semiconductor chips
Grant 4,978,639 - Hua , et al. December 18, 1 | 1990-12-18 |
Method of selective via-hole and heat sink plating using a metal mask
Grant 4,842,699 - Hua , et al. June 27, 1 | 1989-06-27 |
Method of forming completely metallized via holes in semiconductors
Grant 4,808,273 - Hua , et al. February 28, 1 | 1989-02-28 |
| 