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name:-0.0032680034637451
name:-0.0023860931396484
name:-0.0015950202941895
Hu; Yi-Ting Patent Filings

Hu; Yi-Ting

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hu; Yi-Ting.The latest application filed is for "die stacking method".

Company Profile
1.4.4
  • Hu; Yi-Ting - Chiayi County TW
  • Hu; Yi-Ting - Budai Township TW
  • Hu; Yi-Ting - Taoyuan TW
  • Hu; Yi-Ting - Budai Townahip TW
  • HU; Yi-Ting - Taoyuan City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Bonding apparatus and method
Grant 10,312,118 - Wu , et al.
2019-06-04
Die stacking method
Grant 10,083,950 - Jann , et al. September 25, 2
2018-09-25
Computer stick docking system and power management method thereof
Grant 9,645,627 - Lin , et al. May 9, 2
2017-05-09
Die Stacking Method
App 20170098639 - JANN; Larry ;   et al.
2017-04-06
Die stacking apparatus and method
Grant 9,536,814 - Jann , et al. January 3, 2
2017-01-03
Computer Stick Docking System And Power Management Method Thereof
App 20160202748 - LIN; Hsin-Liang ;   et al.
2016-07-14
Die Stacking Apparatus And Method
App 20150243630 - JANN; Larry ;   et al.
2015-08-27
Bonding Apparatus And Method
App 20150200118 - WU; Pei-Shan ;   et al.
2015-07-16

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