Hu; Yen-Chang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hu; Yen-Chang.The latest application filed is for "fan-out interconnect structure and method for forming same".

Company Profile

6.23.29

Hu; Yen-Chang - Tai-Chung TW
Hu; Yen-Chang - Hsinchu TW
Hu; Yen-Chang - Tai-Chung City TW
Hu; Yen-Chang - Hsin-Chu TW
Hu; Yen-Chang - Taichung TW
Hu; Yen-Chang - Taichung City TW
- Tai-Chung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Fan-out interconnect structure and method for forming same Grant 11,133,274 - Yu , et al. September 28, 2	2021-09-28
Wafer level embedded heat spreader Grant 11,101,192 - Chang , et al. August 24, 2	2021-08-24
Fan-Out Interconnect Structure and Method for Forming Same App 20200328169 - Yu; Chen-Hua ; et al.	2020-10-15
Fan-out interconnect structure and method for forming same Grant 10,700,025 - Yu , et al.	2020-06-30
Wafer Level Embedded Heat Spreader App 20190148264 - Chang; Wei Sen ; et al.	2019-05-16
Wafer level embedded heat spreader Grant 10,177,073 - Chang , et al. J	2019-01-08
3D die stacking structure with fine pitches Grant 10,157,884 - Yu , et al. Dec	2018-12-18
Method Of Packaging A Semiconductor Die App 20180286787 - HUANG; Hui-Min ; et al.	2018-10-04
Packaging with interposer frame Grant 9,991,190 - Huang , et al. June 5, 2	2018-06-05
Warpage reduction and adhesion improvement of semiconductor die package Grant 9,799,620 - Huang , et al. October 24, 2	2017-10-24
Wafer Level Embedded Heat Spreader App 20170301608 - Chang; Wei Sen ; et al.	2017-10-19
Wafer level embedded heat spreader Grant 9,735,087 - Chang , et al. August 15, 2	2017-08-15
3D Die Stacking Structure with Fine Pitches App 20160307876 - Yu; Chen-Hua ; et al.	2016-10-20
Packaged semiconductor devices and packaging methods Grant 9,418,969 - Hu , et al. August 16, 2	2016-08-16
3D die stacking structure with fine pitches Grant 9,379,078 - Yu , et al. June 28, 2	2016-06-28
Fan-out interconnect structure and method for forming same Grant 9,368,460 - Yu , et al. June 14, 2	2016-06-14
Warpage Reduction and Adhesion Improvement of Semiconductor Die Package App 20150303158 - Huang; Yu-Chih ; et al.	2015-10-22
Semiconductor device with discrete blocks Grant 9,165,887 - Hsiao , et al. October 20, 2	2015-10-20
Packaged Semiconductor Devices and Packaging Methods App 20150243636 - Hu; Yen-Chang ; et al.	2015-08-27
Warpage reduction and adhesion improvement of semiconductor die package Grant 9,087,832 - Huang , et al. July 21, 2	2015-07-21
Peripheral electrical connection of package on package Grant 9,070,667 - Hsiao , et al. June 30, 2	2015-06-30
Packaged semiconductor devices and packaging methods Grant 9,035,461 - Hu , et al. May 19, 2	2015-05-19
3D Die Stacking Structure with Fine Pitches App 20150123268 - Yu; Chen-Hua ; et al.	2015-05-07
Methods and Apparatus for Package on Package Devices with Reversed Stud Bump Through Via Interconnections App 20150072476 - Hu; Yen-Chang ; et al.	2015-03-12
Methods and apparatus for package on package devices with reversed stud bump through via interconnections Grant 08922005 -	2014-12-30
Methods and apparatus for package on package devices with reversed stud bump through via interconnections Grant 8,922,005 - Hu , et al. December 30, 2	2014-12-30
Methods For Forming Package-on-package Structures Having Buffer Dams App 20140335662 - Hu; Yen-Chang ; et al.	2014-11-13
Fan-out package comprising bulk metal Grant 8,866,285 - Hu , et al. October 21, 2	2014-10-21
Fan-Out Interconnect Structure and Method for Forming Same App 20140264930 - Yu; Chen-Hua ; et al.	2014-09-18
Warpage Reduction and Adhesion Improvement of Semiconductor Die Package App 20140252647 - Huang; Yu-Chih ; et al.	2014-09-11
Peripheral Electrical Connection of Package on Package App 20140239507 - Hsiao; Ching-Wen ; et al.	2014-08-28
Package-on-Package structures having buffer dams and method for forming the same Grant 8,816,507 - Hu , et al. August 26, 2	2014-08-26
Packaged Semiconductor Devices and Packaging Methods App 20140210099 - Hu; Yen-Chang ; et al.	2014-07-31
Carrier Wafers, Methods of Manufacture Thereof, and Packaging Methods App 20140127857 - Chen; Chen-Shien ; et al.	2014-05-08
Wafer Level Embedded Heat Spreader App 20140077394 - Chang; Wei Sen ; et al.	2014-03-20
Semiconductor Device with Discrete Blocks App 20140070422 - Hsiao; Ching-Wen ; et al.	2014-03-13
Fan-Out Package Comprising Bulk Metal App 20140061937 - Hu; Yen-Chang ; et al.	2014-03-06
Variable Frequency Microwave Device And Method For Rectifying Wafer Warpage App 20140042152 - HU; Yen-Chang ; et al.	2014-02-13
Package-on-package Structures Having Buffer Dams And Methods For Forming The Same App 20140027901 - Hu; Yen-Chang ; et al.	2014-01-30
Packaging With Interposer Frame App 20130307140 - HUANG; Hui-Min ; et al.	2013-11-21
Methods and Apparatus for Package on Package Devices with Reversed Stud Bump Through Via Interconnections App 20130270682 - Hu; Yen-Chang ; et al.	2013-10-17

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