Hu; Wen-Hung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hu; Wen-Hung.The latest application filed is for "integrated driving module with energy conversion function and manufacturing method thereof".

Company Profile

3.18.32

Hu; Wen-Hung - Hsinchu County TW
Hu; Wen-Hung - Taoyuan TW
HU; WEN-HUNG - New Taipei TW
Hu; Wen-Hung - Hsin-Chu TW
Hu; Wen-Hung - Hsin-feng Hsinchu
Hu; Wen-Hung - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated Driving Module With Energy Conversion Function And Manufacturing Method Thereof App 20200279683 - Hu; Wen-Hung ; et al.	2020-09-03
Integrated driving module with energy conversion function and manufacturing method thereof Grant 10,707,000 - Hu , et al.	2020-07-07
Integrated Driving Module With Energy Conversion Function And Manufacturing Method Thereof App 20200075211 - Hu; Wen-Hung ; et al.	2020-03-05
Packaging module and substrate structure thereof Grant 9,711,444 - Hu July 18, 2	2017-07-18
Packaging Module And Substrate Structure Thereof App 20170047279 - Hu; Wen-Hung	2017-02-16
Method for manufacturing printed circuit board Grant 9,439,281 - Hu September 6, 2	2016-09-06
Method for manufacturing printed circuit board Grant 9,439,282 - Hu September 6, 2	2016-09-06
Method for manufacturing a printed circuit board Grant 9,295,150 - Hu March 22, 2	2016-03-22
Part-embedded Circuit Structure And Method For Manufacturing Same App 20160066418 - CHENG; YU-HAO ; et al.	2016-03-03
Method for manufacturing printed circuit board Grant 9,107,332 - Hu August 11, 2	2015-08-11
Circuit Board, Package Structure And Method For Manufacturing Same App 20140146504 - HU; WEN-HUNG	2014-05-29
Printed Circuit Board And Method For Manufacturing Same App 20140083757 - HU; WEN-HUNG	2014-03-27
Printed Circuit Board And Method For Manufacturing Same App 20140083744 - HU; WEN-HUNG	2014-03-27
Printed Circuit Baord And Method For Manufacturing Same App 20140060902 - HU; WEN-HUNG	2014-03-06
Printed Circuit Baord And Method For Manufacturing Same App 20140054075 - HU; WEN-HUNG	2014-02-27
Packaging Substrate And Method Of Fabricating The Same App 20120255771 - Hu; Wen-Hung ; et al.	2012-10-11
Semiconductor package substrate structure and manufacturing method thereof Grant 8,269,354 - Hu September 18, 2	2012-09-18
Circuit board having electrically connecting structure and fabrication method thereof Grant 8,188,377 - Hu , et al. May 29, 2	2012-05-29
Circuit board surface structure Grant 8,058,564 - Hu November 15, 2	2011-11-15
Package Substrate And Manufacturing Method Thereof App 20110056738 - Hu; Wen Hung	2011-03-10
Semiconductor Package Substrate Structure And Manufacturing Method Thereof App 20110031617 - Hu; Wen-Hung	2011-02-10
Semiconductor package substrate structure and manufacturing method thereof Grant 7,847,400 - Hu December 7, 2	2010-12-07
Conductive bump structure of circuit board and method for forming the same Grant 7,705,471 - Hu April 27, 2	2010-04-27
Semiconductor package substrate Grant 7,705,456 - Hu April 27, 2	2010-04-27
Method for fabrication of a conductive bump structure of a circuit board Grant 7,674,362 - Hu March 9, 2	2010-03-09
Conductive structures for electrically conductive pads of circuit board and fabrication method thereof Grant 7,659,193 - Hu , et al. February 9, 2	2010-02-09
Electrical connector structure of circuit board and method for fabricating the same Grant 7,608,929 - Hu October 27, 2	2009-10-27
Semiconductor Package Substrate App 20090134515 - Hu; Wen-Hung	2009-05-28
Circuit board having electrically connecting structure and fabrication method thereof App 20090050359 - Hu; Wen-Hung ; et al.	2009-02-26
Semiconductor Package Substrate Structure And Manufacturing Method Thereof App 20080272501 - Hu; Wen-Hung	2008-11-06
Structure of packaging substrate and method for making the same App 20080265411 - Hu; Wen-Hung	2008-10-30
Packaging substrate and method for manufacturing the same App 20080257595 - Hu; Wen-Hung	2008-10-23
Circuit Board Surface Structure App 20080217047 - Hu; Wen-Hung	2008-09-11
Method For Fabrication Of A Conductive Bump Structure Of A Circuit Board App 20080179190 - HU; Wen-Hung	2008-07-31
Method for fabricating circuit board with conductive structure Grant 7,350,298 - Hsu , et al. April 1, 2	2008-04-01
Method for fabricating conductive bump of circuit board Grant 7,341,934 - Hsu , et al. March 11, 2	2008-03-11
Conductive connection structure formed on the surface of circuit board and manufacturing method thereof App 20080036079 - Chen; Chien-Chih ; et al.	2008-02-14
Method for Fabricating Circuit Board with Conductive Structure App 20070186412 - Hsu; Shih-Ping ; et al.	2007-08-16
Conductive structures for electrically conductive pads of circuit board and fabrication method thereof App 20070161223 - Hu; Wen-Hung ; et al.	2007-07-12
Method for fabricating electrical connection structure of circuit board Grant 7,151,050 - Hsu , et al. December 19, 2	2006-12-19
Processing apparatus for electroplating conductive bumps on organic circuit board App 20060252247 - Hsu; Shih-Ping ; et al.	2006-11-09
Method for fabricating electrically connecting structure of circuit board App 20060252248 - Hu; Wen-Hung	2006-11-09
Solder ball pad surface finish structure of circuit board and fabrication method thereof App 20060252249 - Hsu; Shih-Ping ; et al.	2006-11-09
Conductive bump structure of circuit board and method for forming the same App 20060244140 - Hu; Wen-Hung	2006-11-02
Conductive bump structure of circuit board and fabrication method thereof App 20060225917 - Hu; Wen-Hung	2006-10-12
Fabrication method of conductive bump structures of circuit board App 20060219567 - Hu; Wen-Hung	2006-10-05
Conductive bump structure of circuit board and method for fabricating the same App 20060202331 - Hu; Wen-Hung	2006-09-14
Electrical connector structure of circuit board and method for fabricating the same App 20060204650 - Hu; Wen-Hung	2006-09-14
Method for fabricating electrical connection structure of circuit board App 20060079081 - Hsu; Shih-Ping ; et al.	2006-04-13
Method for fabricating conductive bump of circuit board App 20060051952 - Hsu; Shih-Ping ; et al.	2006-03-09

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