Hu; Tien-Chen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hu; Tien-Chen.The latest application filed is for "method for processing semiconductor wafer".

Company Profile

0.16.14

Hu; Tien-Chen - New Taipei TW
HU; Tien-Chen - New Taipei City TW
Hu; Tien-Chen - Ping-Tung TW
Hu; Tien-Chen - Pingtung TW
Hu; Tien-Chen - Ping-Tung City TW
Hu, Tien-Chen - Pingtung City TW
Hu; Tien-Chen - Ping-Pung TW
Hu, Tien-Chen - Ping-Pung City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for processing semiconductor wafer Grant 9,852,932 - Kao , et al. December 26, 2	2017-12-26
Method For Processing Semiconductor Wafer App 20170148651 - KAO; Mao-Lin ; et al.	2017-05-25
Semiconductor processing station and method for processing semiconductor wafer Grant 9,558,974 - Kao , et al. January 31, 2	2017-01-31
Ultra-high vacuum (UHV) wafer processing Grant 9,281,221 - Kao , et al. March 8, 2	2016-03-08
Ultra-high Vacuum (uhv) Wafer Processing App 20140140792 - Kao; Chung-En ; et al.	2014-05-22
Semiconductor Processing Station And Method For Processing Semiconductor Wafer App 20140086720 - KAO; Mao-Lin ; et al.	2014-03-27
Chemical mechanical planarization apparatus Grant 8,057,280 - Hu , et al. November 15, 2	2011-11-15
Chemical Mechanical Planarization Methods And Apparatus App 20100323587 - HU; Tien-Chen ; et al.	2010-12-23
System for cleaning a wafer Grant 7,823,241 - Hu , et al. November 2, 2	2010-11-02
Chemical mechanical planarization methods Grant 7,824,243 - Hu , et al. November 2, 2	2010-11-02
Chemical Mechanical Planarization Methods And Apparatus App 20080318494 - Hu; Tien-Chen ; et al.	2008-12-25
System for cleaning a wafer App 20080229526 - Hu; Tien-Chen ; et al.	2008-09-25
Convex profile anode for electroplating system Grant 7,014,739 - Lin , et al. March 21, 2	2006-03-21
Calibration wafer and kit Grant 6,914,337 - Chuang , et al. July 5, 2	2005-07-05
Calibration Wafer And Kit App 20050091863 - Chuang, Chih-Nan ; et al.	2005-05-05
Apparatus and method for dry-loading of substrates in scrubber cleaner App 20050069399 - Hsieh, Chih-Ming ; et al.	2005-03-31
Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of using Grant 6,837,774 - Hu , et al. January 4, 2	2005-01-04
Belt tensioning assembly for CMP apparatus Grant 6,726,532 - Lin , et al. April 27, 2	2004-04-27
Ventilated platen/polishing pad assembly for chemcial mechanical polishing and method of using Grant 6,722,949 - Hu , et al. April 20, 2	2004-04-20
Belt tensioning assembly for CMP apparatus App 20040018808 - Lin, Hung ; et al.	2004-01-29
Convex profile anode for electroplating system App 20030221958 - Lin, Tro-Hsu ; et al.	2003-12-04
Method and apparatus for removing coating layers from alignment marks on a wafer Grant 6,649,077 - Tsai , et al. November 18, 2	2003-11-18
Method and apparatus for removing coating layers from alignment marks on a wafer App 20030116535 - Tsai, Pang-Yen ; et al.	2003-06-26
Method for a copper CMP endpoint detection system Grant 6,517,413 - Hu , et al. February 11, 2	2003-02-11
Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of using App 20020142704 - Hu, Tien-Chen ; et al.	2002-10-03
Ventilated platen/polishing pad assembly for chemical mechanical polishing and method of using App 20020137435 - Hu, Tien-Chen ; et al.	2002-09-26
Wafer mounting plate for a polishing apparatus and method of using Grant 6,315,649 - Hu , et al. November 13, 2	2001-11-13
Apparatus and method for chemical mechanical polishing metal on a semiconductor wafer Grant 6,227,947 - Hu , et al. May 8, 2	2001-05-08

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