Hu; Siping

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hu; Siping.The latest application filed is for "three-dimensional memory devices and fabricating methods thereof".

Company Profile

3.7.18

Hu; Siping - Wuhan CN
HU; Siping - Wuhan City CN
Hu; Siping - Shaoxing CN
Hu; Siping - Shaoxing City CN
Hu; Siping - Hubei CN
Hu; Siping - Zhejiang N/A CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bonded three-dimensional memory devices having bonding layers Grant 11,450,653 - Huang , et al. September 20, 2	2022-09-20
Three-dimensional Memory Devices And Fabricating Methods Thereof App 20220246544 - CHEN; He ; et al.	2022-08-04
Metal-dielectric Bonding Method And Structure App 20220238479 - HU; Siping	2022-07-28
Contact Pads Of Three-dimensional Memory Device And Fabrication Method Thereof App 20220181350 - WANG; Yongqing ; et al.	2022-06-09
Contact Pads Of Three-dimensional Memory Device And Fabrication Method Thereof App 20220181351 - WANG; Yongqing ; et al.	2022-06-09
Bonded Three-dimensional Memory Devices And Methods For Forming The Same App 20220068905 - Huang; Shiqi ; et al.	2022-03-03
Bonded three-dimensional memory devices and methods for forming the same Grant 11,233,041 - Huang , et al. January 25, 2	2022-01-25
Semiconductor Structure And Method Of Forming The Same App 20210398932 - CHEN; Jun ; et al.	2021-12-23
Semiconductor Structure And Method Of Forming The Same App 20210335745 - CHEN; Jun ; et al.	2021-10-28
Metal-dielectric Bonding Method And Structure App 20210210459 - HU; Siping	2021-07-08
Bonded three-dimensional memory devices and methods for forming the same Grant 11,037,945 - Huang , et al. June 15, 2	2021-06-15
Stable fat-soluble active ingredient composition, microcapsule and process of preparation and use thereof Grant 11,013,807 - Mao , et al. May 25, 2	2021-05-25
Bonded Three-dimensional Memory Devices And Methods For Forming The Same App 20210134779 - Huang; Shiqi ; et al.	2021-05-06
Bonded Three-dimensional Memory Devices And Methods For Forming The Same App 20210134778 - Huang; Shiqi ; et al.	2021-05-06
Bonded Three-dimensional Memory Devices And Methods For Forming The Same App 20210134820 - Huang; Shiqi ; et al.	2021-05-06
Semiconductor Structure And Method Of Forming The Same App 20200006275 - CHEN; Jun ; et al.	2020-01-02
Semiconductor Structure And Method Of Forming The Same App 20200006284 - CHEN; Jun ; et al.	2020-01-02
Stable Fat-soluble Active Ingredient Composition, Microcapsule and Process Of Preparation and Use Thereof App 20180207277 - Mao; Guoquan ; et al.	2018-07-26
Preparation process of image sensors Grant 9,455,297 - Hu , et al. September 27, 2	2016-09-27
Preparation Process Of Image Sensors App 20160093663 - HU; Siping ; et al.	2016-03-31
Image Sensor Having An Embedded Color Filter And Its Preparation Method App 20160093661 - Hu; Siping ; et al.	2016-03-31
1-methoxyl-2, 6, 10-trimethyl-1, 3, 5, 9-undec-tetraene, and preparation method and uses thereof Grant 8,697,919 - Lao , et al. April 15, 2	2014-04-15
1-Methoxyl-2, 6, 10-Trimethyl-1, 3, 5, 9-Undec-Tetraene, and Preparation Method and Uses thereof App 20130046114 - Lao; Xuejun ; et al.	2013-02-21

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